Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2000
10/31/2000US6140709 Bonding pad structure and method for manufacturing the bonding pad structure
10/31/2000US6140708 Chip scale package and method for manufacture thereof
10/31/2000US6140707 Laminated integrated circuit package
10/31/2000US6140706 Semiconductor device and method of manufacturing without damaging HSQ layer and metal pattern utilizing multiple dielectric layers
10/31/2000US6140705 Self-aligned contact through a conducting layer
10/31/2000US6140704 Integrated circuit memory devices with improved twisted bit-line structures
10/31/2000US6140703 A surface multilayer comprising a first layer of titanium and a second layer of nickel and vanadium alloy
10/31/2000US6140702 Plastic encapsulation for integrated circuits having plated copper top surface level interconnect
10/31/2000US6140701 Suppression of hillock formation in thin aluminum films
10/31/2000US6140700 Semiconductor chip package and method for fabricating the same
10/31/2000US6140699 Molding for holding heat sinks in a clamped stack
10/31/2000US6140698 Package for microwave and mm-wave integrated circuits
10/31/2000US6140697 Semiconductor device
10/31/2000US6140695 Compression layer on the leadframe to reduce stress defects
10/31/2000US6140692 Isolated anti-fuse structure and method for fabricating same
10/31/2000US6140665 Integrated circuit probe pad metal level
10/31/2000US6140583 An electronic parts coated with a metallic or alloy coatings, excellent heat resistance, oxidation resistance and corrosion resistance and especially excellent solderability
10/31/2000US6140581 Grounded packaged semiconductor structure and manufacturing method therefor
10/31/2000US6140571 Heat-generating element cooling device
10/31/2000US6140454 Comprising an epoxy resin, a phenolic resin and a polycarbodiimide resin; integrated circuit package resin composition
10/31/2000US6140405 Salt-modified electrostatic dissipative polymers
10/31/2000US6140258 Sheet-shaped reinforcement material buried on one side of a formed sheet of silicone gel containing a thermoconductive filler; low compressibility, high strength, for dissipating heat of heat generating electronic parts and the like
10/31/2000US6140252 Reducing capacitive coupling on a semiconductor device using electrical insulators made of porous dielectric materials.
10/31/2000US6140237 Damascene process for forming coplanar top surface of copper connector isolated by barrier layers in an insulating layer
10/31/2000US6140236 High throughput A1-Cu thin film sputtering process on small contact via for manufacturable beol wiring
10/31/2000US6140229 Semiconductor apparatus and method of producing same
10/31/2000US6140227 Method of fabricating a glue layer of contact/via
10/31/2000US6140225 Method of manufacturing semiconductor device having multilayer wiring
10/31/2000US6140222 To provide isolation between electrical conductors, phosphorous doped dielectric prevents sodium from becoming mobile under the influence of subsequently applied electric fields.
10/31/2000US6140219 Method of forming contact openings
10/31/2000US6140217 Technique for extending the limits of photolithography
10/31/2000US6140212 Semiconductor device and method therefor
10/31/2000US6140155 Method of manufacturing semiconductor device using dry photoresist film
10/31/2000US6140154 Multi-part lead frame with dissimilar materials and method of manufacturing
10/31/2000US6140153 Lead frame, the manufacturing method, semiconductor device and the manufacturing method
10/31/2000US6140150 Plastic encapsulation for integrated circuits having plated copper top surface level interconnect
10/31/2000US6140149 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
10/31/2000US6140141 Method for cooling backside optically probed integrated circuits
10/31/2000US6139978 (a) a polyfunctional epoxy resin, (b) a polyfunctional phenolic resin curing agent, (c) an organophosphorus curing accelerator, (d) an aminosilane coupling agent, and (e) an inorganic filler
10/31/2000US6139977 Useful in packaging integrated circuit devices.
10/31/2000US6139975 Sheet metal member, method of manufacturing same, and heat radiation plate
10/31/2000US6139944 Electronic device having a sheathed body and a method of producing the same
10/31/2000US6139700 Protective layer prevents defects in the conductive layer caused by precursor impurities used during the formation of the metal barrier layer.
10/31/2000US6139699 Controlling particular process variables during deposition of the film.
10/31/2000US6139697 Low temperature integrated via and trench fill process and apparatus
10/31/2000US6139666 Method for producing ceramic surfaces with easily removable contact sheets
10/31/2000US6139079 Universal transport apparatus
10/31/2000US6138748 Interleaved-fin thermal connector
10/31/2000US6138469 Refrigeration system for electronic components having environmental isolation
10/31/2000US6138352 Method of manufacturing an extruded, tiered high fin density heat sink
10/31/2000US6138349 Protective coating for an electronic device
10/31/2000US6138348 Method of forming electrically conductive polymer interconnects on electrical substrates
10/27/2000CA2305977A1 Connection method and structure to printed circuit board
10/26/2000WO2000064229A1 Contact module, as for a smart card, and method for making same
10/26/2000WO2000063970A1 Module component and method of manufacturing the same
10/26/2000WO2000063969A1 Electrical conductor system of a semiconductor device and manufacturing method thereof
10/26/2000WO2000063968A1 Dissipation of heat from a circuit board having bare silicon chips mounted thereon
10/26/2000WO2000063950A2 Sub-package bypass capacitor mounting for an array packaged integrated circuit
10/26/2000WO2000063836A1 Integrated circuit device which is secured against attacks resulting from controlled destruction of an additional layer
10/26/2000WO2000049652A8 Bonding material, semiconductor device, method of manufacturing semiconductor device, circuit board and electronic device
10/26/2000WO2000031775A3 A method of manufacturing an electronic device comprising two layers of organic-containing material
10/26/2000DE19953843A1 Verfahren zur Herstellung einer Kupferverdrahtung für eine Halbleitervorrichtung A process for producing a copper wiring for a semiconductor device
10/26/2000DE19916177A1 Wire bonding connections for semiconductor chip contacts, connections are formed by mechanically deforming contact pieces before positioning in deformation area
10/26/2000DE10018358A1 Semiconductor component manufacturing method, involves separating insulating layer on semiconductor substrate and producing connection strip conductor connected with strip conductor layer of semiconductor elements in layer.
10/26/2000DE10013013A1 Chemical synthesized components, intersects pair of crossing conductors which form crossing which has function for measurement in nanometer range
10/25/2000EP1047295A2 High frequency shielding structure and method
10/25/2000EP1047293A2 Heat sink attachment apparatus and method
10/25/2000EP1047134A2 Interconnection scheme for semiconductor storage device
10/25/2000EP1047130A1 Radio frequency semiconductor apparatus
10/25/2000EP1047129A1 Bonding method for an integrated circuit
10/25/2000EP1047128A2 Warped semiconductor device and method of manufacturing the same
10/25/2000EP1047127A2 A method of forming a multi-layered dual-polysilicon structure
10/25/2000EP1047124A2 Process for producing semiconductor device
10/25/2000EP1047113A2 Method and apparatus for generating controlled mixture of organic vapor and inert gas
10/25/2000EP1046192A1 Method of manufacturing a semiconductor device in a silicon body, a surface of said silicon body being provided with an alignment grating and an at least partially recessed oxide pattern
10/25/2000EP0888708A4 Fan attachment clip for heat sink
10/25/2000EP0835892B1 Epoxy resin composition for printed wiring board and laminated board produced with the use of the same
10/25/2000EP0835287B1 Use of silicone-modified epoxy resins as potting compound
10/25/2000CN2403178Y High-power AC solid-state relay
10/25/2000CN2403125Y Spheric cell array integrated circuit element packaging structure
10/25/2000CN1271509A Method for mounting semiconductor element to circuit board, and semiconductor device
10/25/2000CN1271466A Housing for piezoelectric transformer device
10/25/2000CN1271464A Electrode means, with or without functional elements and an electrode device including polymer material and an electrode device formed of saidmeans
10/25/2000CN1057869C Method for forming through-hole of semiconductor device
10/25/2000CN1057868C Method for forming metal interconnects in semiconductor device
10/24/2000US6137693 High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding
10/24/2000US6137687 Printed circuit board, IC card, and manufacturing method thereof
10/24/2000US6137683 Heat-dissipating device for an electronic component
10/24/2000US6137682 Air-cooled electronic apparatus
10/24/2000US6137681 Thermal module
10/24/2000US6137680 Electronic component cooling apparatus
10/24/2000US6137186 Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns
10/24/2000US6137185 Electrode structure of a wiring substrate of semiconductor device having expanded pitch
10/24/2000US6137184 Flip-chip type semiconductor device having recessed-protruded electrodes in press-fit contact
10/24/2000US6137181 Method for locating active support circuitry on an integrated circuit fabrication die
10/24/2000US6137178 Semiconductor metalization system and method
10/24/2000US6137176 Semiconductor device and method of fabricating the same
10/24/2000US6137174 Hybrid ASIC/memory module package
10/24/2000US6137173 Preventing backside analysis of an integrated circuit
10/24/2000US6137172 Method and device for positioning and retaining micro-building-blocks
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