Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2000
11/07/2000US6143975 Thermoelectric regenerator
11/07/2000US6143855 Each silicon atom is bonded to at least three oxygen atoms and to either a hyrogen atom or organic substituent; no hydroxyl or alkoxy substituents; use as low dielectric film
11/07/2000US6143668 KLXX technology with integrated passivation process, probe geometry and probing process
11/07/2000US6143658 Multilevel wiring structure and method of fabricating a multilevel wiring structure
11/07/2000US6143657 Selectively growing copper germanide compound as deposit on bottom of contact hole, forming barrier layer over copper germanide, forming copper plug thereover
11/07/2000US6143655 Methods and structures for silver interconnections in integrated circuits
11/07/2000US6143654 Method of forming tungsten pattern for a semiconductor device
11/07/2000US6143651 Method of manufacturing a semiconductor device with a multilayer wiring
11/07/2000US6143649 Forming layer of conductive material in dielectric layer, forming layer of hard mask material onto portion thereof, etching hard mask material to expose portion of first layer, forming facets on hard mask layer, forming via in first layer
11/07/2000US6143647 Silicon-rich block copolymers to achieve unbalanced vias
11/07/2000US6143642 Programmable semiconductor structures and methods for making the same
11/07/2000US6143640 Method of fabricating a stacked via in copper/polyimide beol
11/07/2000US6143638 Passivation structure and its method of fabrication
11/07/2000US6143622 Method for forming alignment mark
11/07/2000US6143621 Capacitor circuit structure for determining overlay error
11/07/2000US6143614 Monolithic inductor
11/07/2000US6143592 MOS semiconductor device and method of fabricating the same
11/07/2000US6143590 Multi-chip semiconductor device and method of producing the same
11/07/2000US6143589 Tape under frame for conventional-type IC package assembly
11/07/2000US6143588 Method of making an integrated circuit package employing a transparent encapsulant
11/07/2000US6143587 Method of marking on semiconductor device having metallic layer
11/07/2000US6143586 Electrostatic protected substrate
11/07/2000US6143581 Asymmetric transfer molding method and an asymmetric encapsulation made therefrom
11/07/2000US6143579 Efficient method for monitoring gate oxide damage related to plasma etch chamber processing history
11/07/2000US6143432 Ceramic composites with improved interfacial properties and methods to make such composites
11/07/2000US6143423 Comprising epoxy resin, phenolic resin, polyimide, inorganic filler; used to encapsulate semiconductor device
11/07/2000US6143421 Electronic components incorporating ceramic-metal composites
11/07/2000US6143401 Electronic chip package
11/07/2000US6143399 Aromatic polyimide film
11/07/2000US6143396 System and method for reinforcing a bond pad
11/07/2000US6143377 Process of forming a refractory metal thin film
11/07/2000US6143357 Aluminum complex derivatives for chemical vacuum evaporation and the method of producing the same
11/07/2000US6143121 Hybrid module and method of manufacturing the same
11/07/2000US6143076 Applicator head
11/07/2000US6142789 Demateable, compliant, area array interconnect
11/07/2000US6141869 Apparatus for and method of manufacturing a semiconductor die carrier
11/02/2000WO2000065891A1 System for uniformly interconnecting and cooling
11/02/2000WO2000065740A1 Energy conditioning circuit assembly
11/02/2000WO2000065732A1 Microwave module
11/02/2000WO2000065714A1 Integrated electronic circuit comprising an electronic component and a delay element which is connected to the component
11/02/2000WO2000065689A1 Wireless article including a plural-turn loop antenna
11/02/2000WO2000065654A1 Method and apparatus using silicide layer for protecting integrated circuits from reverse engineering
11/02/2000WO2000065652A1 Universal package and method of forming the same
11/02/2000WO2000065648A1 Circuit suitable for vertical integration and method of producing same
11/02/2000WO2000065647A1 Chip scale package
11/02/2000WO2000065642A1 Production methods of compound semiconductor single crystal and compound semiconductor element
11/02/2000WO2000065616A1 Electronic device and manufacture thereof
11/02/2000WO2000065615A1 Power electronics component with improved thermal properties
11/02/2000WO2000065126A1 Cvd tantalum nitride plug formation from tantalum halide precursors
11/02/2000WO2000064960A1 Thermosetting resin composition and flexible-circuit overcoating material comprising the same
11/02/2000WO2000064625A1 Improved solder balls and use thereof
11/02/2000WO2000038231A9 Open-cavity semiconductor die package
11/02/2000WO2000033622A9 Improved heat sink and process of manufacture
11/02/2000WO2000027160A9 Methods and systems to obtain a tldn for a home system in response to a call received for a wireless unit roaming in a visited system
11/02/2000WO2000027159A9 Methods and systems to substantially prevent fraudulent use of a wireless unit roaming in a visited system
11/02/2000EP1049365A2 Socket for electrical parts
11/02/2000EP1049363A2 Printed circuit board
11/02/2000EP1049204A2 Socket assembly for a pin grid array package and terminals therefor
11/02/2000EP1049192A2 High-frequency communication device
11/02/2000EP1049191A2 Procedure for the production of electronical elements with strip lines
11/02/2000EP1049179A2 Chip-type semiconductor light emitting device
11/02/2000EP1049166A2 CMOS inverter and standard cell using the same
11/02/2000EP1049164A1 High laser absorption copper fuse and method for making the same
11/02/2000EP1049163A1 Multiple line grid array package and a method for the manufacture thereof
11/02/2000EP1049162A2 Interconnection structure of a multilayer circuit board for electrical connection to a semiconductor package and manufacturing method thereof
11/02/2000EP1049161A2 Cooling module including a pressure relief mechanism
11/02/2000EP1049158A2 Semiconductor interconnect structure
11/02/2000EP1049152A2 Semiconductor encapsulating epoxy resin composition and semiconductor device
11/02/2000EP1049151A2 Method of producing a ball grid array type printed wiring board having excellent heat diffusibility and printed wiring board
11/02/2000EP1049150A1 Method and structure for bonding layers in a semiconductor device
11/02/2000EP1049138A2 Tray for semiconductor integrated circuit device
11/02/2000EP1048984A2 Method and apparatus for reducing non-uniformities in the manufacture of semiconductive devices
11/02/2000EP1048957A2 Integrated circuit device having process parameter measuring circuit
11/02/2000EP1048917A2 Two-phase thermosyphon including a porous structural material having slots disposed therein
11/02/2000EP1048916A2 Two-phase thermosyphon including air feed through slots
11/02/2000EP1048680A1 Modified polyimide resin and thermosetting resin composition containing the same
11/02/2000EP1048483A1 Semiconductor device
11/02/2000EP1048392A1 Pb-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE
11/02/2000EP1048072A1 Gettering device for ion capture
11/02/2000EP1048071A1 Integrated circuit rewiring using gas-assisted fib etching
11/02/2000EP1048060A1 Semiconductor body having a surface provided with a coil having a magnetic core
11/02/2000EP1048056A1 A single step electroplating process for interconnect via fill and metal line patterning
11/02/2000EP1047744A1 Curable epoxy-based compositions
11/02/2000EP1047523A1 Method for producing a lead-free substrate
11/02/2000EP0922192A4 Spray-cooling an electronic component
11/02/2000EP0895486A4 Grafted thermoplastic elastomer barrier layer
11/02/2000EP0721659B1 Method of forming a patterned array of uniform metal microbeads
11/02/2000DE19918671A1 Vertikal integrierbare Schaltung und Verfahren zu ihrer Herstellung Vertically integrated circuit, and processes for their preparation
11/02/2000DE19918090A1 Leistungselektronik-Bauelement mit verbesserten thermischen Eigenschaften Power electronics component with improved thermal properties
11/02/2000DE10018126A1 Semiconductor device, especially a highly integrated device mounted on an insulating circuit board, has a bottom contact with an outer periphery not covered by a conductor connecting the circuit board to the device substrate
11/02/2000CA2371317A1 System for uniformly interconnecting and cooling
11/02/2000CA2371206A1 Power electronics component with improved thermal properties
11/01/2000CN1271962A Apparatus and method of maintaining cipher in interior of IC package
11/01/2000CN1058109C 半导体器件 Semiconductor devices
10/2000
10/31/2000USRE36938 Method of forming a landing pad structure in an integrated circuit
10/31/2000US6141220 CPU heat sink mounting arrangement
10/31/2000US6141219 Modular power electronics die having integrated cooling apparatus
10/31/2000US6140833 In-situ measurement method and apparatus for semiconductor processing
10/31/2000US6140711 Alignment marks of semiconductor substrate and manufacturing method thereof
10/31/2000US6140710 Power and ground and signal layout for higher density integrated circuit connections with flip-chip bonding
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