Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2000
11/14/2000US6147399 Backside exposure of desired nodes in a multi-layer integrated circuit
11/14/2000US6147398 Semiconductor device package
11/14/2000US6147397 Stress isolated integrated circuit and method for making
11/14/2000US6147396 Power semiconductor module
11/14/2000US6147374 Resin-encapsulated semiconductor apparatus
11/14/2000US6147368 Voltage-driven power semiconductor device
11/14/2000US6147361 Polysilicon electromigration sensor which can detect and monitor electromigration in composite metal lines on integrated circuit structures with improved sensitivity
11/14/2000US6147321 Configuration for the automatic inscription or reinscription of wafers
11/14/2000US6147311 Multi layer circuit board using anisotropic electroconductive adhesive layer and method for producing same
11/14/2000US6147141 Die attach adhesive compositions
11/14/2000US6147012 Process for forming low k silicon oxide dielectric material while suppressing pressure spiking and inhibiting increase in dielectric constant
11/14/2000US6147009 Hydrogenated oxidized silicon carbon material
11/14/2000US6146999 Method for forming metal line of semiconductor device
11/14/2000US6146992 Vertically integrated semiconductor component and method of producing the same
11/14/2000US6146989 Method of fabricating semiconductor device with cavity interposed between wirings
11/14/2000US6146985 Low capacitance interconnection
11/14/2000US6146984 Method and structure for uniform height solder bumps on a semiconductor wafer
11/14/2000US6146969 Printing optimized global alignment mark at contact/via layers
11/14/2000US6146958 Methods for making VLSI capacitors and high Q VLSI inductors using metal-filled via plugs
11/14/2000US6146933 Field shield isolated transistor
11/14/2000US6146925 Method of jointly forming stacked capacitors and antifuses method of blowing antifuses method of blowing antifuses
11/14/2000US6146922 Hybrid frame with lead-lock tape
11/14/2000US6146921 Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink
11/14/2000US6146919 Package stack via bottom leaded plastic (BLP) packaging
11/14/2000US6146918 Method of fabricating a semiconductor package
11/14/2000US6146910 Target configuration and method for extraction of overlay vectors from targets having concealed features
11/14/2000US6146908 Method of manufacturing a test circuit on a silicon wafer
11/14/2000US6146749 Having a matrix resin and crosslinked resin particles of cross-linking monomers and non-cross-linking monomers; circuit boards with high reliability in high frequency range; dielectric constant =/<3
11/14/2000US6146743 Barrier metallization in ceramic substrate for implantable medical devices
11/14/2000US6146517 Filling trench; vapor deposition, electroplating
11/14/2000US6145586 Heat sink module with heat dissipating device
11/14/2000US6145365 Method for forming a recess portion on a metal plate
11/14/2000CA2176789C Wiring board for mounting electronic devices with high-density terminals and method for producing wiring board
11/09/2000WO2000067541A1 Composite electronics packages and methods of manufacture
11/09/2000WO2000067538A1 Method for manufacturing solderless high density electronic modules
11/09/2000WO2000067324A1 Integrated circuit, method of manufacture thereof, and method of producing mask pattern
11/09/2000WO2000067320A2 Integrated circuit inductor with high self-resonance frequency
11/09/2000WO2000067319A1 Security method and device for a chip stack with a multidimensional structure
11/09/2000WO2000067318A1 Method and apparatus relating to interconnect lines
11/09/2000WO2000067317A1 Semiconductor device and method of manufacturing same
11/09/2000WO2000067316A2 Method for producing a portable electronic device with an integrated circuit protected by a photosensitive resin
11/09/2000WO2000067315A1 Semiconductor chip package
11/09/2000WO2000067314A1 Stackable flex circuit ic package and method of making the same
11/09/2000WO2000067304A1 Method for removal of sic
11/09/2000WO2000066803A1 Copper alloy with improved resistance to cracking
11/09/2000WO2000066340A1 Method for manufacturing encapsulated electronical components
11/09/2000DE19921230A1 Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten A method of handling of the thinned chip for insertion into chip cards
11/09/2000DE10007434A1 Support module for a micro-ball grid array (BGA) device for testing semiconductor devices and solder connections, includes projections and elastic device to hold the module body and test container
11/09/2000CA2370170A1 Copper alloy with improved resistance to cracking
11/08/2000EP1051061A1 Low dielectric composition, insulating material, sealing material, and circuit board
11/08/2000EP1050906A1 Package for electronic components
11/08/2000EP1050902A2 Method for forming a copper layer over a semiconductor wafer
11/08/2000EP1050594A1 Copper alloy with improved resistance to cracking
11/08/2000EP1050546A2 Amorphous copolymers of tetrafluoroethylene and hexafluoropropylene
11/08/2000EP1050078A1 Microsystem and method for the production thereof
11/08/2000EP1050077A1 High-density computer modules with stacked parallel-plane packaging
11/08/2000EP1049905A1 Multi-mode, two-phase cooling module
11/08/2000EP1049735A1 Snap cure adhesive based on anhydride/epoxy resins
11/08/2000CN1272959A Semiconductor device and method for manufacturing the same
11/08/2000CN1272892A Conductor track structures arranged on nonconductive material, espectially fine conductor track structure, and method for producing the same
11/08/2000CN1272705A Socket component of pin grid array component and its terminals
11/08/2000CN1272694A High laser absorbing copper fuse and its manufacturing method
11/08/2000CN1272693A Wave type fin radiator and heat exchange using this radiator
11/08/2000CN1272692A Semiconductor module
11/08/2000CN1272685A Method for forming copper layer on semiconductor chip
11/08/2000CN1272450A Pallet for semiconductor integrated circuit device
11/07/2000US6144560 Semiconductor device including combed bond pad opening, assemblies and methods
11/07/2000US6144559 Process for assembling an interposer to probe dense pad arrays
11/07/2000US6144397 Laser marking method and an apparatus thereof
11/07/2000US6144225 Programmable integrated circuit having metal plate capacitors that provide local switching energy
11/07/2000US6144109 Method for improving a stepper signal in a planarized surface over alignment topography
11/07/2000US6144108 Semiconductor device and method of fabricating the same
11/07/2000US6144107 Solid state pickup device excellent in heat-resistance and method of manufacturing the device
11/07/2000US6144106 Electronic coatings
11/07/2000US6144104 High-operating-temperature electronic component
11/07/2000US6144103 Graded PB for C4 bump technology
11/07/2000US6144102 Semiconductor device package
11/07/2000US6144101 Flip chip down-bond: method and apparatus
11/07/2000US6144100 Integrated circuit with bonding layer over active circuitry
11/07/2000US6144099 Semiconductor metalization barrier
11/07/2000US6144097 Semiconductor device and method of fabricating the same
11/07/2000US6144096 Low resistivity semiconductor barrier layers and manufacturing method therefor
11/07/2000US6144093 Commonly housed diverse semiconductor die with reduced inductance
11/07/2000US6144092 Electronic power device heatsink clamping system
11/07/2000US6144091 Semiconductor device
11/07/2000US6144090 Ball grid array package having electrodes on peripheral side surfaces of a package board
11/07/2000US6144089 Inner-digitized bond fingers on bus bars of semiconductor device package
11/07/2000US6144088 Leadframe for semiconductor chips and semiconductor module having the lead frame
11/07/2000US6144084 Semiconductor integrated circuit having a logic verifying structure and method of manufacturing the same
11/07/2000US6144083 Method of reducing defects in anti-reflective coatings and semiconductor structures fabricated thereby
11/07/2000US6144074 Semiconductor memory device having stack-type memory cells and a method for manufacturing the same
11/07/2000US6144070 High breakdown-voltage transistor with electrostatic discharge protection
11/07/2000US6144040 Van der pauw structure to measure the resistivity of a doped area under diffusion areas and gate structures
11/07/2000US6144039 Low melting pads for instant electrical connections
11/07/2000US6144013 Local humidity control system for low temperature electronic module
11/07/2000US6143992 Circuit board with terminals having a solder lead portion
11/07/2000US6143991 Bump electrode with adjacent pad and insulation for solder flow stopping
11/07/2000US6143989 Active alignment/contact verification system
11/07/2000US6143981 Plastic integrated circuit package and method and leadframe for making the package
11/07/2000US6143977 Heat-generating element cooling device
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