Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2000
11/21/2000US6150728 Semiconductor memory device having a pad arrangement with reduced occupying area
11/21/2000US6150727 Semiconductor device
11/21/2000US6150726 Component carrier with raised bonding sites
11/21/2000US6150725 Semiconductor devices with means to reduce contamination
11/21/2000US6150723 Copper stud structure with refractory metal liner
11/21/2000US6150722 Ldmos transistor with thick copper interconnect
11/21/2000US6150721 Integrated circuit which uses a damascene process for producing staggered interconnect lines
11/21/2000US6150719 Amorphous hydrogenated carbon hermetic structure and fabrication method
11/21/2000US6150718 Method and apparatus for performing a circuit edit through the back side of an integrated circuit die
11/21/2000US6150717 Direct die contact (DDC) semiconductor package
11/21/2000US6150716 Metal substrate having an IC chip and carrier mounting
11/21/2000US6150715 Semiconductor device with radiation plate for high radiation character and method of manufacturing the same
11/21/2000US6150714 Current sense element incorporated into integrated circuit package lead frame
11/21/2000US6150713 Metal substrate; intermediate layer on at least one side of substrate; and a protection layer plated with one or more of palladium, gold, silver, or alloys thereof formed on upper surface of intermediate layer by applying modulating current
11/21/2000US6150712 Lead frame for semiconductor device, and semiconductor device
11/21/2000US6150711 Ferroalloy substrate, first precious metal(pm) plating layer, intermediate layer of copper (alloy) plating layer and a nickel (alloy) plating layer, and a second pm plating layer formed sequentially on substrate; anticorrosion, solderable
11/21/2000US6150710 Transverse hybrid LOC package
11/21/2000US6150709 Grid array type lead frame having lead ends in different planes
11/21/2000US6150705 Dielectric-polysilicon-dielectric-polysilicon-dielectric antifuse for field programmable logic application
11/21/2000US6150678 Method and pattern for avoiding micro-loading effect in an etching process
11/21/2000US6150669 Combination test structures for in-situ measurements during fabrication of semiconductor devices
11/21/2000US6150615 Economical package with built-in end resistor used for semiconductor device and process of fabrication
11/21/2000US6150435 An epoxy resin copolymer comprising two different molecular weight polyol components; improve the properties of coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity
11/21/2000US6150284 Method of forming an organic polymer insulating film in a semiconductor device
11/21/2000US6150270 Method for forming barrier layer for copper metallization
11/21/2000US6150269 Copper interconnect patterning
11/21/2000US6150268 Barrier materials for metal interconnect
11/21/2000US6150262 Silver-gold wire for wire bonding
11/21/2000US6150261 Method of fabricating semiconductor device for preventing antenna effect
11/21/2000US6150255 Method of planarizing a curved substrate and resulting structure
11/21/2000US6150254 Method for wiring of a semiconductor device
11/21/2000US6150246 Doping, annealing; heat resistant
11/21/2000US6150227 Integrated circuit structure with a gap between resistor film and substrate
11/21/2000US6150206 Methods of forming integrated circuit capacitors using trench isolation and planarization techniques
11/21/2000US6150199 Method for fabrication of programmable interconnect structure
11/21/2000US6150195 Method for an integrated circuit thermal grease mesh structure
11/21/2000US6150194 Semiconductor device sealed with resin, and its manufacture
11/21/2000US6150193 RF shielded device
11/21/2000US6150188 Integrated circuits using optical fiber interconnects formed through a semiconductor wafer and methods for forming same
11/21/2000US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive
11/21/2000US6150071 Fabrication process for flex circuit applications
11/21/2000US6150023 Dummy wafer
11/21/2000US6150010 Integrated circuit insulator
11/21/2000US6149778 Article comprising fluorinated amorphous carbon and method for fabricating article
11/21/2000US6149777 Method of producing smooth titanium nitride films having low resistivity
11/21/2000US6149741 Copper-based alloy having a high electrical conductivity and a high softening temperature for application in electronics
11/21/2000US6149449 IC socket
11/21/2000US6149122 Method for building interconnect structures by injection molded solder and structures built
11/21/2000US6148906 Flat plate heat pipe cooling system for electronic equipment enclosure
11/21/2000US6148905 Two-phase thermosyphon including air feed through slots
11/21/2000US6148512 Method for attaching an electronic device
11/21/2000US6148509 Method for supporting an integrated circuit die
11/20/2000CA2308943A1 Surface mount millimeter wave ic package
11/16/2000WO2000069239A1 Method for manufacturing a printed circuit board with integrated heat sink for semiconductor package
11/16/2000WO2000069236A1 A thermally enhanced via/bga microwave circuit ceramic package
11/16/2000WO2000069234A1 Wiring method and wiring device
11/16/2000WO2000069232A1 Thermosetting polymer systems and electronic laminates
11/16/2000WO2000068995A1 Ic chip
11/16/2000WO2000068994A1 Chip holder for a chip module and method for producing said chip module
11/16/2000WO2000068993A1 Semiconductor devices with improved lead frame structures
11/16/2000WO2000068992A1 Semiconductor device
11/16/2000WO2000068991A1 Pbga package with integrated ball grid
11/16/2000WO2000068990A1 Method for handling thinned chips for introducing them into chip cards
11/16/2000WO2000068986A1 Method and apparatus for vacuum treatment
11/16/2000WO2000068972A2 Method of creating an electrical interconnect device bearing an array of electrical contact pads
11/16/2000WO2000067918A1 Surface trace electrical feedthru
11/16/2000WO2000031163A3 Poly(arylene ether) homopolymer compositions and methods of manufacture thereof
11/16/2000WO2000021126A9 Semiconductor copper bond pad surface protection
11/16/2000WO2000004584A3 Semiconductor component in a chip format and method for the production thereof
11/16/2000DE19926107C1 Semiconductor structure, especially a memory including redundant memory cells or word lines, has a vertical fuse embedded in a cavity of a semiconductor body
11/16/2000DE19920505A1 Converter with temp. symmetrisation has temp. sensors in chips, evaluation device that calls up measurement values and processes them into signals for input to correction circuit
11/16/2000CA2409472A1 Surface trace electrical feedthru
11/16/2000CA2373154A1 Thermosetting polymer systems and electronic laminates
11/15/2000EP1052706A2 Light emitting device and method of manufacturing the same
11/15/2000EP1052698A2 Interlayer dielectric for integrated circuit
11/15/2000EP1052696A2 Electrical interconnection medium
11/15/2000EP1052695A2 Tape carrier and manufacturing method of tape carrier type semiconductor device
11/15/2000EP1051890A1 Self-balancing thermal control device for integrated circuits
11/15/2000EP1051750A1 An integrated circuit device
11/15/2000EP1051749A1 An electrical connecting element and a method of making such an element
11/15/2000EP1051746A1 Integrated circuit device
11/15/2000EP1051745A1 A method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating
11/15/2000EP1051741A1 A method for generation of electrical conducting or semiconducting structures in three dimensions and methods for erasure of the same structures
11/15/2000CN1273695A Semiconductor device, method of manufacture thereof, circuit board and electronic device
11/15/2000CN1273694A Semiconductor device, method of manufacture thereof circuit board and electronic device
11/15/2000CN1273625A Bearing for refrigerating machine compressor and compressor for refrigerating machine
11/15/2000CN1273543A Method for producing cooling element and cooling element
11/15/2000CN1273457A Package for electronic component
11/14/2000US6147876 Multi-chip module having printed wiring board comprising circuit pattern for IC chip
11/14/2000US6147868 Electronic power components module
11/14/2000US6147857 Optional on chip power supply bypass capacitor
11/14/2000US6147413 Mask repattern process
11/14/2000US6147410 Electronic component and method of manufacture
11/14/2000US6147409 Modified multilayered metal line structure for use with tungsten-filled vias in integrated circuit structures
11/14/2000US6147408 Method of forming embedded copper interconnections and embedded copper interconnection structure
11/14/2000US6147407 Article comprising fluorinated amorphous carbon and process for fabricating article
11/14/2000US6147405 Asymmetric, double-sided self-aligned silicide and method of forming the same
11/14/2000US6147404 Dual barrier and conductor deposition in a dual damascene process for semiconductors
11/14/2000US6147403 Reduced wafer warping of semiconductor wafers without weakening the strength of adhesion to substrate materials; aluminum, titanium, silicon, titanium nitride layers
11/14/2000US6147402 Refractory metal capped low resistivity metal conductor lines and vias
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