Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2000
11/28/2000US6154369 Electronic assembly for removing heat from a semiconductor device
11/28/2000US6154368 Device and method for dissipating thermal energy of electronic circuit components
11/28/2000US6154366 Structures and processes for fabricating moisture resistant chip-on-flex packages
11/28/2000US6154365 Spring fixture that attaches a heat sink to a substrate for multiple cycle assembly/disassembly
11/28/2000US6154364 Circuit board assembly with IC device mounted thereto
11/28/2000US6154363 Electronic device cooling arrangement
11/28/2000US6154054 Programmable device having antifuses without programmable material edges and/or corners underneath metal
11/28/2000US6153941 Semiconductor registration measurement mark
11/28/2000US6153940 Core metal soldering knob flip-chip technology
11/28/2000US6153938 Flip-chip connecting method, flip-chip connected structure and electronic device using the same
11/28/2000US6153937 Semiconductor device and method of the same
11/28/2000US6153936 Method for forming via hole and semiconductor structure formed thereby
11/28/2000US6153933 Elimination of residual materials in a multiple-layer interconnect structure
11/28/2000US6153932 Fix base of integrated circuit chipset and heat sink
11/28/2000US6153930 Electronic circuit device and method
11/28/2000US6153928 Substrate for semiconductor package, fabrication method thereof, and stacked-type semiconductor package using the substrate
11/28/2000US6153926 Semiconductor device
11/28/2000US6153925 Film circuit
11/28/2000US6153924 Multilayered lead frame for semiconductor package
11/28/2000US6153923 Semiconductor device
11/28/2000US6153922 Semiconductor device
11/28/2000US6153913 Electrostatic discharge protection circuit
11/28/2000US6153901 Integrated circuit capacitor including anchored plug
11/28/2000US6153892 Semiconductor device and method for manufacture thereof
11/28/2000US6153891 Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die
11/28/2000US6153882 Method and system for reading a data signal emitted by an active pixel in a sensor
11/28/2000US6153833 Integrated circuit having interconnect lines separated by a dielectric having a capping layer
11/28/2000US6153829 Split cavity wall plating for an integrated circuit package
11/28/2000US6153724 A polylactam as flocculants in water purification, as polymers useful on non-fouling surfaces for biofilm suppression, thin conductive films for microchips and other electronic devices
11/28/2000US6153542 Reacting silane and hydrogen peroxide; depressurization
11/28/2000US6153537 Process for the production of a semiconductor device having better interface adhesion between dielectric layers
11/28/2000US6153530 Post-etch treatment of plasma-etched feature surfaces to prevent corrosion
11/28/2000US6153527 Semiconductor processing method of making electrical contact to a node received within a mass of insulating dielectric material
11/28/2000US6153522 Semiconductor device manufacturing method
11/28/2000US6153519 Method of forming a barrier layer
11/28/2000US6153518 Method of making chip size package substrate
11/28/2000US6153517 Low resistance poly landing pad
11/28/2000US6153516 Method of fabricating a modified polysilicon plug structure
11/28/2000US6153515 Method of forming multilayered film
11/28/2000US6153511 Semiconductor device having a multilayered interconnection structure
11/28/2000US6153510 Semiconductor device and method for manufacturing the same, and semiconductor memory device and method for manufacturing the same
11/28/2000US6153508 Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same
11/28/2000US6153507 Method of fabricating semiconductor device providing effective resistance against metal layer oxidation and diffusion
11/28/2000US6153506 Integrated circuit having reduced probability of wire-bond failure
11/28/2000US6153503 Continuous process for producing solder bumps on electrodes of semiconductor chips
11/28/2000US6153492 On semiconductor wafer
11/28/2000US6153450 Method of utilizing fuses to select alternative modules in a semiconductor device
11/28/2000US6153449 For semiconductors
11/28/2000US6153448 Overcoating source, drain and gate zones; positioning silicon dioxide spacer between drains and gate; etching
11/28/2000US6153447 LSI package and manufacturing method thereof
11/28/2000US6153290 Multi-layer ceramic substrate and method for producing the same
11/28/2000US6153269 Monomer gas is exposed to a source of heat having a temperature sufficient to pyrolyze the monomer gas and produce a source of reactive cf2 species in the vicinity of the structure surface
11/28/2000US6153123 For flat panel display devices such as liquid crystal displays, plasma displays, thick film and thin film electroluminescent displays and field emission displays; narrow particle size distribution, spherical morphology
11/28/2000US6153031 Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys
11/28/2000US6152744 Integrated circuit test socket
11/28/2000US6152215 High intensity cooler
11/28/2000US6152214 Cooling device and method
11/28/2000US6152213 Cooling system for electronic packages
11/28/2000US6151775 Multilayer circuit board and method of producing the same
11/23/2000WO2000070924A1 Integrated circuits with copper matallization for interconnections
11/23/2000WO2000070740A1 Lc oscillator
11/23/2000WO2000070681A1 Improved rf power transistor
11/23/2000WO2000070680A1 Methods and compositions for improving interconnect metallization performance in integrated circuits
11/23/2000WO2000070679A1 Carrier for electronic components and a method for manufacturing a carrier
11/23/2000WO2000070678A1 Chip package with molded underfill
11/23/2000WO2000070677A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device
11/23/2000WO2000070676A1 High-density electronic package, and method for making same
11/23/2000WO2000070672A1 Creation of a corner of an electric strip conductor, in particular, consisting of copper, which has been produced by damascene work on a substrate
11/23/2000WO2000070670A1 Semiconductor device and method for manufacturing the same, and electronic device
11/23/2000WO2000070288A1 Integrated circuit heat pipe heat spreader with through mounting holes
11/23/2000WO2000042659A3 System and method for esd protection
11/23/2000WO2000039848A3 Test method and assembly including a test die for testing a semiconductor product die
11/23/2000WO2000031797A3 Device for electronic packaging, pin jig fixture
11/23/2000DE19923055A1 Transparent package for ball grid array integrated circuit consists of transparent material with channels for connections and contacts to integrated circuit
11/23/2000DE19920593A1 Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls A chip carrier for a chip module and method of manufacturing the chip module
11/23/2000DE10019229A1 Multilayer capacitor for use in high frequency circuits
11/23/2000CA2373752A1 Improved rf power transistor
11/22/2000EP1054583A2 Electronic components cooling apparatus
11/22/2000EP1054448A2 Semiconductor device and method of fabricating the same
11/22/2000EP1054447A1 Surface mount millimeter wave IC package
11/22/2000EP1054446A1 Method of packaging semiconductor chip
11/22/2000EP1054445A1 Electronic package on circuit board and its manufacture
11/22/2000EP1053592A1 Encapsulated surface wave component and collective method for making same
11/22/2000CN1274474A Chip scale ball grid array for integrated circuit package
11/22/2000CN1274378A Semiconductor sealing epoxy resin compsn. and semiconductor device using same
11/22/2000CN1274177A Luminous device and its mfg. method
11/22/2000CN1274173A Method of mfg. carrying band and carrying band type semiconductor device
11/22/2000CN1274172A Semiconductor packed body for high frequency
11/22/2000CN1058807C Method of forming tungsten plug in semiconductor device
11/22/2000CN1058741C Aqueous silver compsn.
11/21/2000US6151238 Calibrating functions of an integrated circuit and storing calibration parameters thereof in a programmable fuse array
11/21/2000US6151220 Mounting structure for electronic part
11/21/2000US6151217 Apparatus and method for enabling hot plugging of an integrated circuit
11/21/2000US6151201 Gas-insulated high-voltage semiconductor valve means
11/21/2000US6150916 Architecture of poly fuses
11/21/2000US6150877 Semiconductor device with improved circuit interconnection
11/21/2000US6150868 Anti-fuse programming circuit
11/21/2000US6150832 Noncontact capacitance measuring device
11/21/2000US6150730 Chip-scale semiconductor package
11/21/2000US6150729 Routing density enhancement for semiconductor BGA packages and printed wiring boards
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