Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2000
12/06/2000CN1276091A Package substrate
12/06/2000CN1276090A Semiconductor device and method for manufacturing the same
12/06/2000CN1275808A Semiconductor device and making method thereof
12/06/2000CN1275807A Vertical fuse and making method thereof
12/06/2000CN1275806A Electrostatic discharging protector for polysilicon diode
12/06/2000CN1275805A Semiconductor structure having conductive fuel and making method thereof
12/06/2000CN1275804A Heat sinking method and device for integrated circuit
12/06/2000CN1275803A Semiconductive device design method and apparatus, memory medium stored marco-information
12/06/2000CN1275802A Semiconductor device and making method thereof
12/06/2000CN1275800A Semiconductor device and making method thereof
12/06/2000CN1275761A Magnet head, magnetic disk, and connection method and equipment
12/06/2000CN1275723A Semiconductor device
12/06/2000CN1275719A Probe adapter for spherical grid array component
12/06/2000CN1275459A Soldering tin blow flow device and tin-soldering method thereof
12/06/2000CN1059290C Method for assembly integrated circuit on a shared substrate
12/06/2000CN1059289C Tape attaching apparatus for semiconductor lead frame
12/05/2000US6157544 Electrical circuit configuration arranged in a casing
12/05/2000US6157541 Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements
12/05/2000US6157539 Cooling apparatus for electronic devices
12/05/2000US6157087 Consistent alignment mark profiles on semiconductor wafers using metal organic chemical vapor deposition titanium nitride protective layer
12/05/2000US6157086 Chip package with transfer mold underfill
12/05/2000US6157085 Semiconductor device for preventing exfoliation from occurring between a semiconductor chip and a resin substrate
12/05/2000US6157084 Film carrier and semiconductor device using same
12/05/2000US6157083 Fluorine doping concentrations in a multi-structure semiconductor device
12/05/2000US6157082 Semiconductor device having aluminum contacts or vias and method of manufacture therefor
12/05/2000US6157081 High-reliability damascene interconnect formation for semiconductor fabrication
12/05/2000US6157080 Semiconductor device using a chip scale package
12/05/2000US6157079 Semiconductor device with a bump including a bump electrode film covering a projecting photoresist
12/05/2000US6157077 Semiconductor device with plated heat sink and partially plated side surfaces
12/05/2000US6157076 Hermetic thin pack semiconductor device
12/05/2000US6157075 Semiconductor assemblies with reinforced peripheral regions
12/05/2000US6157074 Lead frame adapted for variable sized devices, semiconductor package with such lead frame and method for using same
12/05/2000US6157066 Semiconductor aggregate substrate and semiconductor device with fuse structure to prevent breakdown
12/05/2000US6157065 Electrostatic discharge protective circuit under conductive pad
12/05/2000US6157052 Semiconductor integrated circuit having three wiring layers
12/05/2000US6157050 Optical module and lead frame for optical module
12/05/2000US6157046 Semiconductor reliability test chip
12/05/2000US6157045 Semiconductor device evaluation pattern and evaluation method
12/05/2000US6156980 Flip chip on circuit board with enhanced heat dissipation and method therefor
12/05/2000US6156656 Process for manufacturing a semiconductor device
12/05/2000US6156655 Depositing dielectric layer on substrate to cover metal line; forming opening; forming laminated layer; forming copper layer; removing copper layer and laminated layer outside opening to form damascene; forming second laminated layer
12/05/2000US6156651 Metallization method for porous dielectrics
12/05/2000US6156647 Barrier layer structure which prevents migration of silicon into an adjacent metallic layer and the method of fabrication of the barrier layer
12/05/2000US6156644 Method for forming interconnects for semiconductor devices using reaction control layers, and interconnects formed thereby
12/05/2000US6156639 Method for manufacturing contact structure
12/05/2000US6156638 Integrated circuitry and method of restricting diffusion from one material to another
12/05/2000US6156635 Method of correcting solder bumps
12/05/2000US6156621 Method for fabricating direct wafer bond Si/SiO2 /Si substrates
12/05/2000US6156592 Method of manufacturing a semiconductor device containing CMOS elements
12/05/2000US6156588 Method of forming anti-fuse structure
12/05/2000US6156579 Circuit identifier for use with focused ion beam equipment
12/05/2000US6156445 A metallized ceramic substrate coated a film of an ablatively photodecomposable acrylate polymer modified by disperse red 1, a photoabsorber; circuit patterns; no phase separation or crystallization, even ablation and high resolution
12/05/2000US6156435 Formed by monomer gas pyrolysis and plasma excitation methods; can be carried out individually, sequentially, or simultaneously to produce flexible fluorocarbon polymer thin films on wires, twisted wires, tubes, complex microstructures
12/05/2000US6156414 Carrier film and process for producing the same
12/05/2000US6156408 Device for reworkable direct chip attachment
12/05/2000US6156165 Enclosing integrated circuit chip in a mask which exposes an area on an edge of integrated circuit chip and areas on major surfaces of the integrated circuit chip contiguous to area on edge of integrated circuit chip, applying metal
12/05/2000US6155859 IC socket having pressure cover and associated stopper
12/05/2000US6155247 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
12/01/2000CA2310358A1 Heat sinks for cpus for use in personal computers
11/2000
11/30/2000WO2000072644A1 Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same
11/30/2000WO2000072446A1 Integrated vco
11/30/2000WO2000072380A1 Robust interconnect structure
11/30/2000WO2000072379A1 Thermal capacity for electronic component operating in long pulses
11/30/2000WO2000072378A1 Substrate with at least two metallized polymer bumps for soldered connection to wiring
11/30/2000WO2000072371A1 Fabrication of integrated circuit by selective deposition of precursor liquid
11/30/2000WO2000071921A2 Burrless castellation via process and product for plastic chip carrier
11/30/2000WO2000071614A1 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants
11/30/2000WO2000071288A1 Pipe preparing tool v
11/30/2000WO2000042231A3 Polycrystalline silicon germanium films for forming micro-electromechanical systems
11/30/2000DE19923467A1 Semiconductor module with interconnected semiconductor chips
11/30/2000DE19922473A1 Chip carrier module has cut-outs forming large-area setting material holders with boundary forming setting material flow barrier, bridges mechanically connecting adjacent contact areas
11/30/2000DE19921867A1 Semiconductor component, e.g. a polymer stud grid array component, is produced by forming connected conductor lines outside an encapsulation region and, after chip mounting and encapsulation, separating the lines
11/29/2000EP1056321A2 Circuit substrate
11/29/2000EP1056133A1 Rf circuit module
11/29/2000EP1056132A2 Heat-generating element cooling device
11/29/2000EP1056131A2 Heat-generating element cooling device
11/29/2000EP1056130A2 Heat-generating element cooling device
11/29/2000EP1056129A2 Heat-generating element cooling device
11/29/2000EP1056128A2 Semiconductor memory device and method of fabricating the same
11/29/2000EP1056126A2 Electronic device, method of manufacturing the same, and apparatus for manufacturing the same
11/29/2000EP1055708A1 Resin composition, molded article thereof, and process for producing resin composition
11/29/2000EP1055650A1 Carbon-based metal composite material, method for preparation thereof and use thereof
11/29/2000EP1055641A2 Silicon carbide powder and composite material made thereof and method for manufacturing the powder and material
11/29/2000EP1055285A1 Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves
11/29/2000EP1055255A1 Method and apparatus for coupling circuit components
11/29/2000EP1055194A1 Device arranged for contactless communication and provided with a data carrier with fully enclosed holding means for holding a chip and a passive component
11/29/2000EP1055193A1 Data carrier with chip and fully enclosed connection means
11/29/2000EP1055192A1 Data carrier module with integrated circuit and transmission coil
11/29/2000EP1054844A2 Composite
11/29/2000EP0484353B2 Substrate element with at least one integrated circuit, in particular a substrate element for inclusion in chip cards
11/29/2000CN2408572Y Laser cooler for large integrated circuit cooling
11/29/2000CN1275246A Semiconductor device, method of manufacture, circuit board and electronic device
11/29/2000CN1275209A Optical device having optical component isotated from housing
11/29/2000CN1275170A Composite material and use thereof
11/29/2000CN1274951A Lead sticking tape unit for semiconductor device and its assembling method
11/29/2000CN1274950A Mounting structure, method of manufacturing the same and electrically conductive adhesive
11/29/2000CN1274831A Heat radiator and its making-up method
11/29/2000CN1059053C Packaged semiconductor device having flange at its side surface and its manufacturing method
11/28/2000US6154372 Multichip module for surface mounting on printed circuit boards
11/28/2000US6154370 Recessed flip-chip package
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