Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2000
12/12/2000US6160721 Micromagnetic device for power processing applications and method of manufacture therefor
12/12/2000US6160715 Translator for recessed flip-chip package
12/12/2000US6160714 Molded electronic package and method of preparation
12/12/2000US6160710 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
12/12/2000US6160709 Retention device for mounting heat sink to CPU socket
12/12/2000US6160705 Ball grid array package and method using enhanced power and ground distribution circuitry
12/12/2000US6160704 Integral heat-sink and motor assembly for printed circuit boards
12/12/2000US6160326 Power semiconductor packaging
12/12/2000US6160316 Integrated circuit utilizing an air gap to reduce capacitance between adjacent metal linewidths
12/12/2000US6160315 The alloying metal oxide having a thickness of about 6 nm on the oxide sidewalls encapsulates the copper layer to provide a barrier against copper migration, to form an adhesion layer over silicon dioxide
12/12/2000US6160313 Semiconductor device having an insulating substrate
12/12/2000US6160312 Enbedded memory assembly
12/12/2000US6160311 Enhanced heat dissipating chip scale package method and devices
12/12/2000US6160310 Thin film flexible interconnect for infrared detectors
12/12/2000US6160309 Press-fit semiconductor package
12/12/2000US6160308 Semiconductor device
12/12/2000US6160307 Semiconductor packages having split die pad
12/12/2000US6160303 Monolithic inductor with guard rings
12/12/2000US6160302 Laser fusible link
12/12/2000US6160284 Semiconductor device with sidewall insulating layers in the capacitor contact hole
12/12/2000US6160276 Double-sided programmable interconnect structure
12/12/2000US6160218 Chip housing
12/12/2000US6160078 Composition comprising an epoxy resin, a phenolic resin, and an inorganic filler; improved flame retardance, reflow crack resistance and dielectric properties
12/12/2000US6160077 Halogen-free epoxy resin
12/12/2000US6159869 Method of making a circuit including a corral for containing a protective coating
12/12/2000US6159864 Method of preventing damages of gate oxides of a semiconductor wafer in a plasma-related process
12/12/2000US6159851 Borderless vias with CVD barrier layer
12/12/2000US6159847 Alcu alloys with higher cu content are added in thin layers within a metallization structure.
12/12/2000US6159846 Method of metallization in semiconductor devices
12/12/2000US6159842 Method for fabricating a hybrid low-dielectric-constant intermetal dielectric (IMD) layer with improved reliability for multilevel interconnections
12/12/2000US6159841 Method of fabricating lateral power MOSFET having metal strap layer to reduce distributed resistance
12/12/2000US6159837 Manufacturing method of semiconductor device
12/12/2000US6159836 Method for forming programmable contact structure
12/12/2000US6159826 Semiconductor wafer and fabrication method of a semiconductor chip
12/12/2000US6159787 Structures and processes for reduced topography trench capacitors
12/12/2000US6159775 Lead frame, method for manufacturing the same, and semiconductor device employing the same
12/12/2000US6159774 Multi-layer interconnection layout between a chip core and peripheral devices
12/12/2000US6159773 Strain release contact system for integrated circuits
12/12/2000US6159772 Packaging electrical circuits
12/12/2000US6159771 Method of manufacturing diodes
12/12/2000US6159770 Method and apparatus for fabricating semiconductor device
12/12/2000US6159769 Use of palladium in IC manufacturing
12/12/2000US6159768 Array type multi-chip device and fabrication method therefor
12/12/2000US6159767 Single chip modules, repairable multichip modules, and methods of fabrication thereof
12/12/2000US6159766 Designing method of leadframe tip arrangement
12/12/2000US6159765 Integrated circuit package having interchip bonding and method therefor
12/12/2000US6159764 Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
12/12/2000US6159756 Method of testing semiconductor device
12/12/2000US6159754 Polyimide layer acts as both an insulation layer and an anti-reflective coating layer.
12/12/2000US6159623 For electric and electronics parts; soldering characteristics
12/12/2000US6159609 Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
12/12/2000US6159586 Multilayer wiring substrate and method for producing the same
12/12/2000US6159509 Enhanced and prolonged sweetness and improved sensory benefits
12/12/2000US6159420 Gold alloy wire containing palladium and bismuth
12/12/2000US6159322 Photosensitive ceramic green sheet, ceramic package, and process for producing the same
12/12/2000US6159299 Wafer pedestal with a purge ring
12/12/2000US6158707 CPU heat sink fastening device
12/12/2000US6158649 Solder ball mounting apparatus and method
12/12/2000US6158645 Method of bonding radiation plate
12/12/2000US6158644 Method for enhancing fatigue life of ball grid arrays
12/12/2000US6158502 Thin planar heat spreader
12/12/2000US6158232 Advanced liquid cooling apparatus
12/12/2000US6158116 Radio frequency module and method for fabricating the radio frequency module
12/12/2000CA2189801C Method for production of microcapsule type conductive filler
12/12/2000CA2166228C A power integrated circuit
12/07/2000WO2000074460A1 Symmetrical package for semiconductor die
12/07/2000WO2000074453A1 Package for high power microelectronics
12/07/2000WO2000074449A1 Main board with printed circuit board mounted thereon
12/07/2000WO2000074448A1 Surface mount package for power semiconductor devices
12/07/2000WO2000074233A1 System and method for linearizing a cmos differential pair
12/07/2000WO2000074197A1 A multi-functional energy conditioner
12/07/2000WO2000074138A1 Device for cooling an electric component
12/07/2000WO2000074137A1 Device for cooling semiconductor components
12/07/2000WO2000074134A1 Method for the vertical integration of electric components by
12/07/2000WO2000074132A1 Method of protective coating bga solder alloy spheres
12/07/2000WO2000074131A1 A method of assembling a semiconductor device package
12/07/2000WO2000074126A1 A method of manufacturing a semiconductor device
12/07/2000DE19958486A1 Verfahren zur vertikalen Integration von elektrischen Bauelementen mittels Rückseitenkontakt Method for vertical integration of electrical components by means of back-contact
12/07/2000DE19936311A1 Sol material for porous dielectric film formation comprises specified amount of silicon alkoxide, alcohol, aqueous medium, base and additives
12/07/2000DE19924289A1 Electronic circuit module with flexible intermediate layer between electronic components and heat-sink
12/07/2000DE19922553A1 Low temperature co-fired ceramic circuit support is produced using the high glass content of a ceramic substrate to create adhesion to a low glass content conductive paste on firing
12/07/2000DE19908428C2 Halbleiterspeicheranordnung mit Bitleitungs-Twist A semiconductor memory device with bit line twist
12/07/2000DE10022482A1 Integrated memory with two-transistor, two-capacitor storage cells
12/07/2000DE10011368A1 Semiconductor device has copper-tin alloy layer formed on junction portion of solder ball consisting of tin, and wiring consisting of copper
12/07/2000CA2375135A1 A multi-functional energy conditioner
12/06/2000EP1058493A2 Socket for electrical parts
12/06/2000EP1058492A2 Method of forming distortion-free circuits
12/06/2000EP1058369A1 Brush holder with control unit for vehicle alternators
12/06/2000EP1058312A2 Radio frequency power device
12/06/2000EP1058307A1 Electronic unit effectively utilizing circuit board surface
12/06/2000EP1058306A2 Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same
12/06/2000EP1057871A1 Polyarylene sulfide resin composition for electronic part encapsulation
12/06/2000EP1057817A1 Novel compounds, hardening accelerator, resin composition, and electronic part device
12/06/2000EP1057779A2 Flip chip package for micromachined semiconductors
12/06/2000EP1057217A1 Integrated circuit with capacitative elements
12/06/2000EP1056981A1 Heat exchanger and method for producing the heat exchanger
12/06/2000EP0891633A4 Pcmcia memory card
12/06/2000EP0815615A4 A package housing multiple semiconductor dies
12/06/2000CN2409612Y Power device and power module heat tube radiator
12/06/2000CN1276092A 半导体装置 Semiconductor device
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