Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2000
12/20/2000CN1277671A Multi-mode, two-phase cooling module
12/20/2000CN1277459A LGA clamping mechanism
12/20/2000CN1277458A Producing method of relay base plate for installation of semi-conductor elements
12/20/2000CN1277448A Slotted contact for making required voltage of electrofusion fuse minimum
12/19/2000US6163462 Stress relief substrate for solder ball grid array mounted circuits and method of packaging
12/19/2000US6163461 Terminal mounting structure for a printed circuit board
12/19/2000US6163458 Heat spreader for ball grid array package
12/19/2000US6163456 Hybrid module and methods for manufacturing and mounting thereof
12/19/2000US6163234 Micromagnetic device for data transmission applications and method of manufacture therefor
12/19/2000US6163076 Stacked structure of semiconductor package
12/19/2000US6163075 Multilayer wiring structure and semiconductor device having the same, and manufacturing method therefor
12/19/2000US6163074 Integrated circuit bonding pads including intermediate closed conductive layers having spaced apart insulating islands therein
12/19/2000US6163073 Integrated heatsink and heatpipe
12/19/2000US6163072 Semiconductor device package and semiconductor device module
12/19/2000US6163071 BGA type semiconductor device and electronic equipment using the same
12/19/2000US6163070 Semiconductor package utilizing a flexible wiring substrate
12/19/2000US6163069 Semiconductor device having pads for connecting a semiconducting element to a mother board
12/19/2000US6163068 Multi-chip semiconductor encapsulation method and its finished product
12/19/2000US6163067 Semiconductor apparatus having wiring groove and contact hole in self-alignment manner
12/19/2000US6163066 Porous silicon dioxide insulator
12/19/2000US6163065 Energy-absorbing stable guard ring
12/19/2000US6163063 Semiconductor device
12/19/2000US6163062 Semiconductor device having a metallic fuse member and cutting method thereof with laser light
12/19/2000US6163056 Semiconductor device having electrostatic discharge
12/19/2000US6162997 Circuit board with primary and secondary through holes
12/19/2000US6162878 (a) a biphenyl skeleton-bearing epoxy resin, (b) a biphenyl skeleton-bearing phenolic resin as a curing agent, (c) an organosiloxane containing phenyl and organooxy groups, and (d) an inorganic filler
12/19/2000US6162838 Thermal removing organic material from mixture of organic material and dielectric
12/19/2000US6162752 Barium titanate powder, semiconducting ceramic, and semiconducting ceramic electronic element
12/19/2000US6162741 Semiconductor device and manufacturing method therefor
12/19/2000US6162740 Semiconductor device and method of forming semiconductor device
12/19/2000US6162728 Method to optimize copper chemical-mechanical polishing in a copper damascene interconnect process for integrated circuit applications
12/19/2000US6162724 Method for forming metalization for inter-layer connections
12/19/2000US6162723 Method of fabricating a semiconductor integrated circuit device having an interlevel dielectric layer with voids between narrowly-spaced wiring lines
12/19/2000US6162721 Semiconductor processing methods
12/19/2000US6162697 High Q inductor realization for use in MMIC circuits
12/19/2000US6162686 Method for forming a fuse in integrated circuit application
12/19/2000US6162679 Method of manufacturing DRAM capacitor
12/19/2000US6162676 Method of making a semiconductor device with an etching stopper
12/19/2000US6162664 Method for fabricating a surface mounting type semiconductor chip package
12/19/2000US6162663 Dissipation of heat from a circuit board having bare silicon chips mounted thereon
12/19/2000US6162662 Die paddle clamping method for wire bond enhancement
12/19/2000US6162660 Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package
12/19/2000US6162659 Method for manufacturing a package structure having a heat spreader for integrated circuit chips
12/19/2000US6162653 Lead frame attachment for optoelectronic device
12/19/2000US6162650 Via alignment, etch completion, and critical dimension measurement method and structure
12/19/2000US6162583 Method for making intermetal dielectrics (IMD) on semiconductor integrated circuits using low dielectric constant spin-on polymers
12/19/2000US6162512 Process for modifying surfaces of nitride, and nitride having surfaces modified thereby
12/19/2000US6162497 Manufacturing particles and articles having engineered properties
12/19/2000US6162319 Fixing method for electronics
12/19/2000US6161611 Radiator
12/19/2000US6161610 Heat sink with arc shaped fins
12/14/2000WO2000076281A1 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
12/14/2000WO2000076006A1 Thermoelectric material and method for manufacturing the same
12/14/2000WO2000075998A1 Connection arrangement for a semiconductor device and method of manufacturing same
12/14/2000WO2000075991A1 Power feed and heat dissipating device for power semiconductor devices
12/14/2000WO2000075990A1 High impedance matched rf power transistor
12/14/2000WO2000075989A1 Semiconductor device comprising a high-voltage circuit element
12/14/2000WO2000075988A1 Integrated circuits with multiple low dielectric-constant inter-metal dielectrics
12/14/2000WO2000075987A1 Fuse for semiconductor device
12/14/2000WO2000075986A1 Plastic package for an optical integrated circuit device and method of making
12/14/2000WO2000075985A1 Method for making an integrated circuit portable device with electric conduction paths
12/14/2000WO2000075982A1 Fabrication method for self aligned cu diffusion barrier in an integrated circuit
12/14/2000WO2000075979A1 Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices
12/14/2000WO2000075964A2 Method of fabricating semiconductor device employing copper interconnect structure
12/14/2000WO2000075940A1 Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method
12/14/2000WO2000075764A1 Micro cooling device
12/14/2000WO2000074552A2 Method for determinig alert window parameters for etc signal delivery
12/14/2000DE19946194A1 Method for manufacture of integrated power circuit has lead frame secured temporarily during connection soldering
12/14/2000DE19925983A1 Heat sink for dissipating heat losses from electronic component has contact surface with component equal in area to that of component surface
12/14/2000DE19925831A1 Process for measuring the positioning errors of structured patterns used in semiconductor production comprises forming test grating structures, and measuring the light bent at the structures
12/14/2000DE19925510A1 Heat sink device for electrical or electronic component, circuit or module
12/14/2000DE19924960A1 Vorrichtung zur Kühlung von Halbleiterbauelementen An apparatus for cooling semiconductor devices
12/14/2000DE19913367C1 Verfahren zur Herstellung einer elektrischen Schaltung A method of producing an electrical circuit
12/14/2000CA2372440A1 Power feed and heat dissipating device for power semiconductor devices
12/13/2000EP1059833A2 Heat transferring printed wiring board
12/13/2000EP1059675A2 Method of encapsulating a photovoltaic module by an encapsulating material and the photovoltaic module
12/13/2000EP1059666A1 Monolithic semiconductor integrated circuit device
12/13/2000EP1059665A2 Land grid array package clamp mechanism
12/13/2000EP1059664A2 Method of depositing and etching dielectric layers
12/13/2000EP1059271A1 Composition for ceramic substrate and ceramic circuit component
12/13/2000EP1059019A1 Components with releasable leads
12/13/2000EP1058949A1 Quasi-mesh gate structure including plugs connecting source regions with backside for lateral rf mos devices
12/13/2000CN2410743Y Spring type fast assembling-disassembling thermocouple (thermal resistance) junction box
12/13/2000CN2410742Y Metal ball embedding structure of basic plate
12/13/2000CN2410741Y Radiating device of power amplifier
12/13/2000CN2410740Y Integral power unit
12/13/2000CN2410739Y Semicondutor chip congruent encapsulation structure
12/13/2000CN2410675Y Radiating assembly and electronic component combined protector
12/13/2000CN1276699A Electronic module
12/13/2000CN1276648A Electronic component having circuit arrangement packed and mfg. method thereof
12/13/2000CN1276624A Method for mfg. semiconductor device
12/13/2000CN1276587A Multichip installation structure, electrooptical device and electronic machine
12/13/2000CN1059518C Method for mfg. film transistor
12/13/2000CN1059516C Method of mfg. semiconductor device
12/13/2000CN1059515C Conductive ball carrying device
12/13/2000CN1059404C Device and method for detaching linerless labels
12/12/2000US6161215 Package routing of integrated circuit signals
12/12/2000US6161213 System for providing an integrated circuit with a unique identification
12/12/2000US6161053 In-situ binary PCM code indentifier to verify a ROM code id during processing
12/12/2000US6160744 Semiconductor memory device and defect remedying method thereof
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