Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2013
11/06/2013CN203277362U Improved fast recovery diode framework structure
11/06/2013CN203277361U 导线架及其封装构造 Lead frame and package structure
11/06/2013CN203277360U Leading wire frame for large power semiconductor device
11/06/2013CN203277359U Copper strip for manufacturing leading wire frame
11/06/2013CN203277358U Leading wire frame for MOS semiconductor device
11/06/2013CN203277357U Leading wire frame for semiconductor
11/06/2013CN203277356U Split type leading wire frame
11/06/2013CN203277355U Leading wire frame for sound-control and light-control plastic packaging device
11/06/2013CN203277354U Single-arm rectification module
11/06/2013CN203277353U Diode
11/06/2013CN203277352U High thermal conductive power rectification semiconductor device
11/06/2013CN203277351U Thermal conduction and radiation compressing structure of power transistor
11/06/2013CN203277350U Multichip package
11/06/2013CN203277349U Field effect transistor
11/06/2013CN103385010A Package with a CMOS die positioned underneath a MEMS die
11/06/2013CN103384913A Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
11/06/2013CN103383946A Array substrate, display device and preparation method of array substrate
11/06/2013CN103383940A Semiconductor package and method for manufacturing same
11/06/2013CN103383939A Chip embedded packages and methods for forming a chip embedded package
11/06/2013CN103383938A Groove type power metal oxide semiconductor (MOS) device contact hole resistance detection structure
11/06/2013CN103383937A Via-free interconnect structure with self-aligned metal line interconnections
11/06/2013CN103383936A Connection of a chip provided with through vias
11/06/2013CN103383935A Semiconductor devices and methods of manufacturing the same
11/06/2013CN103383934A Semiconductor interconnect structure
11/06/2013CN103383933A Semiconductor device and method of fabricating
11/06/2013CN103383932A Packaging structure for improving electrical performance of chip
11/06/2013CN103383931A Electronic system with a composite substrate
11/06/2013CN103383930A Electronic component
11/06/2013CN103383929A High-reliability rectifying device
11/06/2013CN103383928A Semiconductor chip and semiconductor package
11/06/2013CN103383927A Semiconductor encapsulation and forming method thereof
11/06/2013CN103383923A Thin 3d fan-out embedded wafer level package (ewlb) for application processor and memory integration
11/06/2013CN103383922A Low-K dielectric barrier layer and forming method thereof
11/06/2013CN103383921A Semiconductor package and methods of formation thereof
11/06/2013CN103383920A Passivation for wafer level - chip-scale package devices
11/06/2013CN102676113B Light-emitting diode (LED) packaging silica gel and preparation method thereof
11/06/2013CN102504743B Single-component underfill capable of being stored at room temperature and preparation method thereof
11/06/2013CN102468274B Shadow effect analyzing structure, and forming method and analyzing method thereof
11/06/2013CN102468268B Memory device and method of fabricating the same
11/06/2013CN102446901B Failure analysis structure, formation method of failure analysis structure and failure analysis method
11/06/2013CN102354691B Quad flat non-lead (QFN) package with high density and manufacturing method
11/06/2013CN102339809B QFN (quad flat non-lead) package with multiple circles of pins and manufacturing method thereof
11/06/2013CN102332448B Semiconductor structure and manufacture method thereof
11/06/2013CN102244031B Contact hole and semiconductor device as well as formation method of contact hole and semiconductor device
11/06/2013CN102222662B Packaging structure for electrostatic protection by using point discharge
11/06/2013CN102203938B A semiconductor device comprising an in-chip active heat transfer system
11/06/2013CN102163603B Packaging structure for system level fan-out wafer
11/06/2013CN102160104B Semiconductor device
11/06/2013CN102157473B Semiconductor device and manufacturing method thereof
11/06/2013CN102110700B Semiconductor device and method of manufacturing the same, and electronic apparatus
11/06/2013CN102097405B Electronic component and inspection system
11/06/2013CN102082137B Semiconductor device, print plate and semiconductor package
11/06/2013CN102077325B Film forming method and processing system
11/06/2013CN102074545B Integrated circuit element, semiconductor element and semiconductor technology
11/06/2013CN102074487B 半导体组装结构与其形成方法 Structure and its method of forming a semiconductor assembly
11/06/2013CN102062983B Electrochromic rearview mirror assembly incorporating a display/signal light
11/06/2013CN102005442B Power conversion device
11/06/2013CN101996954B Chip
11/06/2013CN101996930B Method for making contact joint gasket and semiconductor device
11/06/2013CN101937901B Wire substrate as well as manufacturing method and packaging structure thereof
11/06/2013CN101919002B Stackable storage system and manufacture method thereof
11/06/2013CN101894856B Organic light-emitting diode (OLED) display screen and touch detection unit
11/06/2013CN101847628B 显示装置 The display device
11/06/2013CN101842896B Method for stacking serially-connected integrated circuits and multi-chip device made from same
11/06/2013CN101600327B Temperature control unit for electronic component,checking apparatus and handler apparatus
11/06/2013CN101552184B A substrate structure and a formation method thereof, a terahertz device and a manufacturing method thereof
11/06/2013CN101248525B B-stageable film, electronic device, and associated process
11/05/2013USRE44579 Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
11/05/2013US8576567 Semiconductor device and display apparatus
11/05/2013US8575769 Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
11/05/2013US8575768 Radiation-curable ink jet composition and ink jet recording method
11/05/2013US8575767 Reflow of thermoplastic sheet for passivation of power integrated circuits
11/05/2013US8575766 Microelectronic assembly with impedance controlled wirebond and conductive reference element
11/05/2013US8575765 Semiconductor package having underfill agent dispersion
11/05/2013US8575764 Semiconductor device and method for manufacturing semiconductor device
11/05/2013US8575763 Semiconductor device and method of manufacturing the same
11/05/2013US8575762 Very extremely thin semiconductor package
11/05/2013US8575761 Segmented supply rail configuration for a digital integrated circuit
11/05/2013US8575760 Semiconductor devices having electrodes
11/05/2013US8575759 Semiconductor device and electronic apparatus including the same
11/05/2013US8575758 Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies
11/05/2013US8575757 Semiconductor device and method of manufacturing the same
11/05/2013US8575756 Power package module with low and high power chips and method for fabricating the same
11/05/2013US8575755 Semiconductor device having mode of operation defined by inner bump assembly connection
11/05/2013US8575754 Micro-bump structure
11/05/2013US8575752 Modulated deposition process for stress control in thick TiN films
11/05/2013US8575751 Conductive bump, method for producing the same, and electronic component mounted structure
11/05/2013US8575748 Wafer-level packaging with compression-controlled seal ring bonding
11/05/2013US8575747 Clip interconnect with encapsulation material locking feature
11/05/2013US8575746 Chip on flexible printed circuit type semiconductor package
11/05/2013US8575745 Power semiconductor device, printed wiring board, and mechanism for connecting the power semiconductor device and the printed wiring board
11/05/2013US8575744 Semiconductor device and lead frame thereof
11/05/2013US8575742 Semiconductor device with increased I/O leadframe including power bars
11/05/2013US8575741 Method of manufacturing a semiconductor device
11/05/2013US8575740 Semiconductor device
11/05/2013US8575739 Col-based semiconductor package including electrical connections through a single layer leadframe
11/05/2013US8575738 Semiconductor memory card
11/05/2013US8575737 Direct contact semiconductor package with power transistor
11/05/2013US8575736 Direct contact flip chip package with power transistors
11/05/2013US8575735 Semiconductor chip and film and TAB package comprising the chip and film
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