| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/12/2015 | DE102014111360A1 Halbleiterbauelement, elektronische schaltung undverfahren zum schalten von hohen spannungen A semiconductor device, electronic circuitry for switching high voltages undverfahren |
| 02/12/2015 | DE102014111252A1 Elektronisches Bauteil und Verfahren Electronic component and method |
| 02/12/2015 | DE102014111251A1 Umverdrahtungssubstrat, elektronisches Bauelement und Modul Interposer substrate, electronic component and module |
| 02/12/2015 | DE102014111195A1 Verfahren zur Herstellung einer Chip-Anordnung und eine Chip-Anordnung A method of manufacturing a chip assembly and a chip assembly |
| 02/12/2015 | DE102014111063A1 Leistungshalbleiterbauelement und Verfahren Power semiconductor device and method |
| 02/12/2015 | DE102014011854A1 Zündsteuerungs-Kurzschlussschutz Ignition control circuit protection |
| 02/12/2015 | DE102013215913A1 Hochspannungsdiodengleichrichter High voltage diode rectifier |
| 02/12/2015 | DE102013215911A1 Hochspannungsdiodengleichrichter High voltage diode rectifier |
| 02/12/2015 | DE102013215647A1 Leistungselektronisches Modul und Verfahren zur Herstellung eines leistungselektronischen Moduls Power electronic module and method of producing a power electronics module |
| 02/12/2015 | DE102013215592A1 Leistungselektronische Schaltung mit planarer elektrischer Kontaktierung Power electronic circuit with planar electrical contact |
| 02/12/2015 | DE102013108610A1 Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate and method for manufacturing a metal-ceramic substrate |
| 02/12/2015 | DE102008045721B4 Halbleitervorrichtung Semiconductor device |
| 02/11/2015 | EP2835833A2 Nitride-based field-effect transistor and method of fabricating the same |
| 02/11/2015 | EP2835827A2 Semiconductor integrated circuit |
| 02/11/2015 | EP2835826A2 Semiconductor integrated circuit |
| 02/11/2015 | EP2835824A2 Interconnection of a plurality of levels of a stack of electronic component media |
| 02/11/2015 | EP2835823A1 Power converter |
| 02/11/2015 | EP2835822A1 Wiring substrate and manufacturing method therefor |
| 02/11/2015 | EP2834841A1 Semiconductor cooling apparatus |
| 02/11/2015 | CN204155930U 一种应用于高频声表面波器件划片工艺的静电消除结构 Applied to high-frequency surface acoustic wave device dicing process of static elimination structure |
| 02/11/2015 | CN204155929U 等离子体引入损伤的测试结构 PLASMA damage test structure |
| 02/11/2015 | CN204155928U 用于晶体管漏电流测试的半导体结构 The semiconductor structure for transistor leakage current test |
| 02/11/2015 | CN204155927U 离子注入掺杂扩散的测试结构 Ion implantation doping diffusion test structure |
| 02/11/2015 | CN204155926U 应力迁移检测结构 Detection of structural stress migration |
| 02/11/2015 | CN204155925U 一种半导体封装结构 A semiconductor package structure |
| 02/11/2015 | CN204155924U 一种三维集成电路组件 A three-dimensional integrated circuit components |
| 02/11/2015 | CN204155923U 散热器固定装置组合 Sink fixtures combination |
| 02/11/2015 | CN204155922U 散热器固定装置组合 Sink fixtures combination |
| 02/11/2015 | CN204155921U 电子芯片散热板 Electronic chip cooling plate |
| 02/11/2015 | CN204155920U 大功率分立元件的安装组件 High-power discrete components installed components |
| 02/11/2015 | CN204155919U 芯片封装结构 Chip package |
| 02/11/2015 | CN204155918U 场效应晶体管封装结构 FET package |
| 02/11/2015 | CN204155917U 一种快恢复二极管模块 In fast recovery diode module |
| 02/11/2015 | CN104350814A 散热结构体 Heat dissipation structure |
| 02/11/2015 | CN104350642A 组装在柔性支撑件上的电子器件的网络和通信方法 Network and communication method are assembled on flexible supports electronic device |
| 02/11/2015 | CN104350625A 铁电装置、相互连接件、及其制造方法 Ferroelectric device, interconnectors, and manufacturing method thereof |
| 02/11/2015 | CN104350619A 具有在晶片水平形成的模制化合物中的金属柱的芯片级发光器件 The light emitting device having a chip-level in the molding compound is formed in the wafer level metal column |
| 02/11/2015 | CN104350595A 克服分划板区域限制的大型硅中介板 To overcome the limitations of the reticle area large silicon interposer board |
| 02/11/2015 | CN104350594A 半导体模块和半导体模块制造方法 Semiconductor module and method for manufacturing a semiconductor module |
| 02/11/2015 | CN104350593A 具有居间垂直侧边芯片的多管芯半导体结构及其半导体封装 Multi-die semiconductor structure and semiconductor package with intervening vertical sides of the chip |
| 02/11/2015 | CN104350592A 用于在安装具有导热垫的组件时减少机械应力的方法和装置 Method and apparatus for reducing mechanical stress when installing components have thermal pad for |
| 02/11/2015 | CN104350586A 半导体装置 Semiconductor device |
| 02/11/2015 | CN104348459A 分立器件中的负载平衡 Discrete devices Load Balancing |
| 02/11/2015 | CN104347727A 薄膜晶体管及其制造方法以及存储电容器与半导体元件 A thin film transistor and a storage capacitor and a manufacturing method of the semiconductor element |
| 02/11/2015 | CN104347630A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/11/2015 | CN104347624A 集成电路装置 The integrated circuit device |
| 02/11/2015 | CN104347621A 一种多电源系、多封装形式的芯片静电放电保护方法 A multi-power system, multi-chip package ESD protection methods |
| 02/11/2015 | CN104347615A Rf功率器件 Rf power devices |
| 02/11/2015 | CN104347611A 半导体装置 Semiconductor device |
| 02/11/2015 | CN104347602A 附接至热辐射构件的半导体器件 The semiconductor device is attached to the heat radiating member |
| 02/11/2015 | CN104347601A 半导体封装件及其制造方法 Semiconductor package and its manufacturing method |
| 02/11/2015 | CN104347600A 针对多个管芯的封装组件配置及关联的技术 For a plurality of die packaging component configuration and associated technology |
| 02/11/2015 | CN104347599A 线圈衬底及其制造方法、以及电感器 Coil substrate and its manufacturing method, and an inductor |
| 02/11/2015 | CN104347598A 静电防护元件及其制造方法 ESD protection device and manufacturing method |
| 02/11/2015 | CN104347597A 一种遮光器件及其制备方法 One kind of shading device and its preparation method |
| 02/11/2015 | CN104347596A 芯片的密封环结构 Seal ring structure of the chip |
| 02/11/2015 | CN104347595A 电子封装模块及其制造方法 Electronic package module and a manufacturing method |
| 02/11/2015 | CN104347594A 硅通孔测试结构及其测试方法和形成方法 Silicon vias and test methods and test structures forming method |
| 02/11/2015 | CN104347593A 层叠封装体及其制造方法 Laminate package and a manufacturing method |
| 02/11/2015 | CN104347592A 具有气隙的半导体器件及其制造方法 A semiconductor device and manufacturing method of the air gap |
| 02/11/2015 | CN104347591A 柔性集成电路器件及其组件和制造方法 Flexible integrated circuit device and its components and methods of manufacture |
| 02/11/2015 | CN104347590A 电熔丝结构 Electrical fuse structure |
| 02/11/2015 | CN104347589A 一种反熔丝结构 An anti-fuse structure |
| 02/11/2015 | CN104347588A 电熔丝结构 Electrical fuse structure |
| 02/11/2015 | CN104347587A 一种立体集成电感结构 A stereoscopic integrated inductor structure |
| 02/11/2015 | CN104347586A 集成电感电容的电路结构 LC integrated circuit structure |
| 02/11/2015 | CN104347585A 集成电路变压器结构 IC transformer structure |
| 02/11/2015 | CN104347584A 集成电路变压器结构及其构造方法 IC structure and construction method transformer |
| 02/11/2015 | CN104347583A 半导体制造方法、掩模形成方法和半导体结构 The semiconductor manufacturing method, a mask forming method and a semiconductor structure |
| 02/11/2015 | CN104347582A 一种提高器件纵向耐压能力的半导体装置封装结构 An increase vertical semiconductor device package structure of the device breakdown voltage capability |
| 02/11/2015 | CN104347581A 半导体互连结构、包括其的半导体器件及它们的制备方法 A semiconductor interconnect structure, including the semiconductor device and its production method thereof |
| 02/11/2015 | CN104347580A 改进的薄型迭层式功率电感制程 Improved thin laminated power inductors process |
| 02/11/2015 | CN104347579A 半导体装置 Semiconductor device |
| 02/11/2015 | CN104347578A 层叠式半导体装置 Stacked semiconductor device |
| 02/11/2015 | CN104347577A 重新分布板、电子组件和模块 Redistribution board, electronic components and modules |
| 02/11/2015 | CN104347576A 晶片封装体及其制造方法 Chip package and manufacturing method thereof |
| 02/11/2015 | CN104347575A 半导体封装件及其制造方法 Semiconductor package and its manufacturing method |
| 02/11/2015 | CN104347574A 引线框架电路及其制作方法 Leadframe circuit and method of making |
| 02/11/2015 | CN104347573A 引线框架、电力变换装置、半导体设备及其制造方法 Lead frame, the power conversion apparatus, a semiconductor device and manufacturing method thereof |
| 02/11/2015 | CN104347572A 一种导线架及其制造方法 A wire harness frame and its manufacturing method |
| 02/11/2015 | CN104347571A 功率控制器件及其制备方法 The power control device and its preparation method |
| 02/11/2015 | CN104347570A 无引线型半导体封装及其组装方法 Leadless type semiconductor packaging and assembly method |
| 02/11/2015 | CN104347569A 一种内置dbc基板的塑封式ipm A built dbc plastic substrate type ipm |
| 02/11/2015 | CN104347568A 多芯片混合封装的半导体器件及其制备方法 Multi-chip hybrid packaged semiconductor device and its preparation method |
| 02/11/2015 | CN104347567A 智能功率模块及其电极引脚结构 Intelligent Power Module and the electrode pin structure |
| 02/11/2015 | CN104347566A 一种塑封式ipm驱动保护电路结构 One kind of plastic-type ipm driver protection circuit structure |
| 02/11/2015 | CN104347565A 瞬态电压抑制二极管封装结构 Transient voltage suppression diode package structure |
| 02/11/2015 | CN104347564A 使用金属纳米粒子的接合构造以及接合方法 Using the joint structure of the metal nanoparticles and the method of joining |
| 02/11/2015 | CN104347563A 半导体器件 Semiconductor devices |
| 02/11/2015 | CN104347562A 分段键合焊盘及其制造方法 Segment bonding pad and manufacturing method thereof |
| 02/11/2015 | CN104347561A 具有无源器件的芯片封装 Chip package with a passive device |
| 02/11/2015 | CN104347560A 晶片封装体及其制造方法 Chip package and manufacturing method thereof |
| 02/11/2015 | CN104347559A 半导体封装件及其制法 Semiconductor package Jiqizhifa |
| 02/11/2015 | CN104347558A 半导体封装件及其制造方法 Semiconductor package and its manufacturing method |
| 02/11/2015 | CN104347557A 半导体封装件及其的制造方法 Method of manufacturing a semiconductor package and the |
| 02/11/2015 | CN104347556A 二极管封装结构 Diode package structure |
| 02/11/2015 | CN104347555A 一种焊接型igbt模块的电极焊接脚 A welding electrode welding type igbt module foot |
| 02/11/2015 | CN104347554A 电力半导体器件用电极 Power semiconductor devices with electrodes |
| 02/11/2015 | CN104347553A 一种挖槽阻焊型igbt模块底板 One kind Trench solder type igbt module backplane |
| 02/11/2015 | CN104347552A 一种塑封式ipm的导电结构 Conductive structure of a plastic type ipm |