Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2000
12/26/2000US6166441 Method of forming a via overlap
12/26/2000US6166440 Interconnection for preventing signal interference in a semiconductor device
12/26/2000US6166439 Low dielectric constant material and method of application to isolate conductive lines
12/26/2000US6166438 Ultrathin electronics using stacked layers and interconnect vias
12/26/2000US6166437 Silicon on silicon package with precision align macro
12/26/2000US6166436 High frequency semiconductor device
12/26/2000US6166435 Flip-chip ball grid array package with a heat slug
12/26/2000US6166434 Die clip assembly for semiconductor package
12/26/2000US6166433 Resin molded semiconductor device and method of manufacturing semiconductor package
12/26/2000US6166431 Semiconductor device with a thickness of 1 MM or less
12/26/2000US6166430 Lead frame, method for manufacturing the frame, resin-molded semiconductor device and method for manufacturing the device
12/26/2000US6166429 Lead-frame package with shield means between signal terminal electrodes
12/26/2000US6166428 Semiconductor devices with a barrier layer of nitrogen doped amorphous silicon or polysilicon and having a hydrogen getter layer formed under the barrier layer; getter layer is removed from portions of the device where salicide layers are to form
12/26/2000US6166427 Integration of low-K SiOF as inter-layer dielectric for AL-gapfill application
12/26/2000US6166422 Inductor with cobalt/nickel core for integrated circuit structure with high inductance and high Q-factor
12/26/2000US6166421 Polysilicon fuse that provides an open current path when programmed without exposing the fuse to the environment
12/26/2000US6166414 Electronic circuit
12/26/2000US6166411 Heat removal from SOI devices by using metal substrates
12/26/2000US6166403 Integrated circuit having embedded memory with electromagnetic shield
12/26/2000US6166402 Pressure-contact type semiconductor element and power converter thereof
12/26/2000US6166396 Semiconductor devices
12/26/2000US6166333 Bumps with plural under-bump dielectric layers
12/26/2000US6166328 Package stack via bottom leaded plastic (BLP) packaging
12/26/2000US6166317 Cryogenic thermoelectric generator
12/26/2000US6165899 Method for manufacturing semiconductor devices having dual damascene structure
12/26/2000US6165894 Method of reliably capping copper interconnects
12/26/2000US6165892 Method of planarizing thin film layers deposited over a common circuit base
12/26/2000US6165891 Damascene structure with reduced capacitance using a carbon nitride, boron nitride, or boron carbon nitride passivation layer, etch stop layer, and/or cap layer
12/26/2000US6165890 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections
12/26/2000US6165886 Advanced IC bonding pad design for preventing stress induced passivation cracking and pad delimitation through stress bumper pattern and dielectric pin-on effect
12/26/2000US6165885 Method of making components with solder balls
12/26/2000US6165833 Semiconductor processing method of forming a capacitor
12/26/2000US6165820 Package for electronic devices
12/26/2000US6165819 Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
12/26/2000US6165818 Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frame
12/26/2000US6165817 Method of bonding a flexible polymer tape to a substrate to reduce stresses on the electrical connections
12/26/2000US6165816 Fabrication of electronic components having a hollow package structure with a ceramic lid
12/26/2000US6165814 Thin film capacitor coupons for memory modules and multi-chip modules
12/26/2000US6165807 Method for forming junction leakage monitor for mosfets with silicide contacts
12/26/2000US6165629 Compensator with metal layer having etched opening with knife edge configuration and conforming polymer coating; dimensional stability
12/26/2000US6165613 Carrier reacts with resin or vaporizes
12/26/2000US6165612 Polyphenylsulfone matrix impregnated with alumina, boron nitride, graphite, silicon carbide, diamond and/or metal powders
12/26/2000US6165596 Multi-layer insulated metal substrate printed wiring board having improved thermal coupling of components
12/26/2000US6165247 Methods for producing platinum powders
12/26/2000US6164982 IC socket for holding IC having multiple parallel pins
12/26/2000US6164980 Socket for integrated circuit chip
12/26/2000US6164523 Electronic component and method of manufacture
12/26/2000US6164368 Heat sink for portable electronic devices
12/26/2000US6163957 Multilayer laminated substrates with high density interconnects and methods of making the same
12/26/2000US6163956 Method of making chip scale package with heat spreade
12/26/2000CA2014255C Chip package capacitor cover
12/21/2000WO2000078112A1 A device for cooling of electronic components
12/21/2000WO2000078110A1 A heat sink clip for an electronic assembly
12/21/2000WO2000078108A1 Mounting material, mounting circuit using it and printed wiring board using it
12/21/2000WO2000077907A1 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
12/21/2000WO2000077854A1 Method for making all or part of an electronic device by material jet spraying
12/21/2000WO2000077853A1 ARRANGEMENT OF FUSES IN SEMICONDUCTOR STRUCTURES WITH Cu METALLIZATION
12/21/2000WO2000077852A1 Method for making devices comprising a chip associated with a circuit element and resulting devices
12/21/2000WO2000077851A1 Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device
12/21/2000WO2000077850A1 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them
12/21/2000WO2000077849A1 Method for implementing resistance, capacitance and/or inductance in an integrated circuit
12/21/2000WO2000077844A1 Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package
12/21/2000WO2000077843A1 Semiconductor package, semiconductor device, electronic device and production method for semiconductor package
12/21/2000WO2000077840A1 Semiconductor device and method of manufacture thereof
12/21/2000WO2000077827A2 Low-inductance semiconductor component
12/21/2000WO2000077730A1 Electronic device comprising a chip fixed on a support and method for making same
12/21/2000WO2000077729A1 Device and method for making devices comprising at least a chip fixed on a support
12/21/2000WO2000077728A1 Cards and method for making cards having a communication interface with and without contact
12/21/2000WO2000077727A1 Module comprising at least a chip and its communication interface, object comprising a module and method for making said modules
12/21/2000WO2000077601A1 The heat-radiator of a portable computer's cpu
12/21/2000WO2000077275A1 Method of processing films prior to chemical vapor deposition using electron beam processing
12/21/2000WO2000077135A2 Liquid carbon dioxide cleaning utilizing natural and modified natural solvents
12/21/2000WO2000076940A1 Composite material and semiconductor device using the same
12/21/2000WO2000076938A1 Glass ceramics composition and electronic parts and multilayered lc multiple component using the same
12/21/2000WO2000065647B1 Chip scale package
12/21/2000WO2000026149A8 High performance embedded rf filters
12/21/2000DE19926453A1 Device for securing the substrate of HF thin film circuits to base of screening case employs snap connectors to secure clamping straps
12/21/2000CA2337529A1 Liquid carbon dioxide cleaning utilizing natural and modified natural solvents
12/20/2000EP1061783A2 Ceramic-metal substrate, particularly multiple substrate
12/20/2000EP1061580A2 Method and circuit for minimizing the charging effect during manufacture of semiconductor devices
12/20/2000EP1061579A2 Stack type multi chip package
12/20/2000EP1061578A1 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them
12/20/2000EP1061577A2 High frequency multi-layered circuit component
12/20/2000EP1061576A2 Semiconductor package and its manufacturing method
12/20/2000EP1061575A1 Process for plating metal parts of semiconductor devices
12/20/2000EP1061570A1 Semiconductor device
12/20/2000EP1061569A2 Method for manufacturing ceramic substrate and non-fired ceramic substrate
12/20/2000EP1060647A1 Method of making microwave, multifunction modules using fluoropolymer composite substrates
12/20/2000EP1060646A1 Method for manufacturing a resistor
12/20/2000EP1060645A1 Electric conductor with a surface structure in the form of flanges and etched grooves
12/20/2000EP1060517A1 Bipolar transistor with an insulated gate electrode
12/20/2000EP1060513A1 Semiconductor component with several semiconductor chips
12/20/2000EP1060512A1 Vertically integrated circuit system
12/20/2000CN2411577Y Packaged cooling device for light-emitting diode
12/20/2000CN2411575Y Universal crystal oscillating cover of optimized designed
12/20/2000CN2411574Y Fixing device for chip radiator holder
12/20/2000CN2411573Y Fixing device for radiator holder
12/20/2000CN2411572Y Packaged integrated circuit board with direct conducting radiating fin
12/20/2000CN1277737A Semiconductor device, method of manufacture thereof, circuit board, and electronic device
12/20/2000CN1277736A Method for producing electrically conductive cross connections between two layers of wiring on a substrate
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