| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/03/2001 | EP1065715A2 Bicmos process with low temperature coefficient resistor (TCRL) |
| 01/03/2001 | EP1065713A2 Staged aluminium deposition process for filling vias |
| 01/03/2001 | EP1065711A2 Method of manufacturing a plated electronic termination |
| 01/03/2001 | EP1065704A2 Low temperature coefficient resistor (TCRL) |
| 01/03/2001 | EP1064828A1 Electronic ballast with a piezoelectric cooling fan |
| 01/03/2001 | EP1064680A1 Wiring method for producing a vertical, integrated circuit structure and vertical, integrated circuit structure |
| 01/03/2001 | EP1064674A2 A method of manufacturing an electronic device comprising two layers of organic-containing material |
| 01/03/2001 | CN2413387Y Encapsulation mould for transistor |
| 01/03/2001 | CN1278948A Semiconductor power converter and application device of same |
| 01/02/2001 | US6169664 Selective performance enhancements for interconnect conducting paths |
| 01/02/2001 | US6169663 Integrated circuit connection using an electrically conductive adhesive |
| 01/02/2001 | US6169660 Stress relieved integrated circuit cooler |
| 01/02/2001 | US6169659 Metered force single point heatsink attach mechanism |
| 01/02/2001 | US6169657 Radiating device for electronic appliances |
| 01/02/2001 | US6169331 Apparatus for electrically coupling bond pads of a microelectronic device |
| 01/02/2001 | US6169329 Semiconductor devices having interconnections using standardized bonding locations and methods of designing |
| 01/02/2001 | US6169328 Semiconductor chip assembly |
| 01/02/2001 | US6169327 Metal interconnection structure of semiconductor device |
| 01/02/2001 | US6169326 Metal wire of semiconductor device and method for forming the same |
| 01/02/2001 | US6169325 Semiconductor device |
| 01/02/2001 | US6169324 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same |
| 01/02/2001 | US6169323 Semiconductor device with improved leads |
| 01/02/2001 | US6169322 Die attach pad adapted to reduce delamination stress and method of using same |
| 01/02/2001 | US6169302 Determination of parasitic capacitance between the gate and drain/source local interconnect of a field effect transistor |
| 01/02/2001 | US6169301 Planar dielectric integrated circuit |
| 01/02/2001 | US6169254 Three axis sensor package on flexible substrate |
| 01/02/2001 | US6169136 Thermosetting resin potting composition |
| 01/02/2001 | US6169032 CVD film formation method |
| 01/02/2001 | US6169022 Method of forming projection electrodes |
| 01/02/2001 | US6169021 Method of making a metallized recess in a substrate |
| 01/02/2001 | US6169010 Method for making integrated circuit capacitor including anchored plug |
| 01/02/2001 | US6168977 Method of manufacturing a semiconductor device having conductive patterns |
| 01/02/2001 | US6168975 Method of forming extended lead package |
| 01/02/2001 | US6168972 Flip chip pre-assembly underfill process |
| 01/02/2001 | US6168970 Ultra high density integrated circuit packages |
| 01/02/2001 | US6168969 Surface mount IC using silicon vias in an area array format or same size as die array |
| 01/02/2001 | US6168872 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 01/02/2001 | US6168859 Filler powder comprising a partially coated alumina powder and process to make the filler powder |
| 01/02/2001 | US6167949 Low EMI emissions heat sink device |
| 01/02/2001 | US6167948 Thin, planar heat spreader |
| 12/28/2000 | WO2000079856A1 Gel structure for combined emi shielding and thermal control of microelectronic assemblies |
| 12/28/2000 | WO2000079847A1 Transition between asymmetric stripline and microstrip in cavity |
| 12/28/2000 | WO2000079845A1 An arrangement for mounting chips in multilayer printed circuit boards |
| 12/28/2000 | WO2000079592A1 Semiconductor device and electronic device |
| 12/28/2000 | WO2000079591A1 Multi-chip module for leads-on-chip (loc) assembly and method for production of the same. |
| 12/28/2000 | WO2000079590A1 Electronic device with flexible contacting points |
| 12/28/2000 | WO2000079589A1 Electronic component with flexible contact structures and method for the production of said component |
| 12/28/2000 | WO2000079588A1 Resin seal package and terminal forming board |
| 12/28/2000 | WO2000079586A1 Production method for semiconductor integrated circuit device and semiconductor integrated circuit device |
| 12/28/2000 | WO2000079585A1 Copper wiring |
| 12/28/2000 | WO2000079582A1 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 12/28/2000 | WO2000079296A1 Integral bump technology sense resistor |
| 12/28/2000 | WO2000078887A1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 12/28/2000 | WO2000078871A1 Crosslinkable elastomer composition and molded article produced from the composition |
| 12/28/2000 | WO2000078838A1 Epoxy resin composition and process for producing silane-modified epoxy resin |
| 12/28/2000 | DE19927749A1 Electronic arrangement used as a semiconductor chip has electrical contacts on a first surface with a flexible elevation made of an insulating material |
| 12/28/2000 | DE19927285A1 Niederinduktives Halbleiterbauelement Niederinduktives semiconductor device |
| 12/28/2000 | DE19927046A1 Keramik-Metall-Substrat, insbesondere Mehrfachsubstrat A ceramic-metal substrate, in particular multiple substrate |
| 12/28/2000 | DE10030430A1 Aromatic polysulfone resin composition comprises liquid crystalline polyester resin with a defined flow temperature and aromatic polysulfone resin of specific melt viscosity |
| 12/28/2000 | CA2374187A1 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 12/27/2000 | EP1063733A2 Apparatus for providing controlled impedance in an electrical contact |
| 12/27/2000 | EP1063727A2 IC socket |
| 12/27/2000 | EP1063702A1 Double density fuse structure in a window |
| 12/27/2000 | EP1063701A2 Backmetal drain terminal with low stress and thermal resistance |
| 12/27/2000 | EP1063700A2 Substrate for high voltage modules |
| 12/27/2000 | EP1063699A1 Base sheet for semiconductor module, method for manufacturing base sheet for semiconductor module, and semiconductor module |
| 12/27/2000 | EP1063698A2 Method of forming a dram bit line contact |
| 12/27/2000 | EP1063692A1 Process for depositing a low dielectric constant film |
| 12/27/2000 | EP1063687A2 Titanium-tantalum barrier layer film and method for forming the same |
| 12/27/2000 | EP1063286A1 Substrates for immobilizing and amplifying dna, dna-immobilized chips having dna immobilized on the substrates, and method for amplifying dna |
| 12/27/2000 | EP1063211A1 Silicon nitride sintered body and method of producing the same |
| 12/27/2000 | EP1062852A1 Cooling element for electronic power device and power electronic device comprising same |
| 12/27/2000 | EP1062849A1 Circuit board features with reduced parasitic capacitance and method therefor |
| 12/27/2000 | EP1062848A2 Integrated circuit connection using an electrically conductive adhesive |
| 12/27/2000 | EP1062699A1 Method of manufacturing a semiconductor device |
| 12/27/2000 | EP1062698A1 Electronic semiconductor module |
| 12/27/2000 | EP1062697A1 Method for reducing the capacitance between interconnects by forming voids in dielectric material |
| 12/27/2000 | EP1062695A1 Method for fabricating double sided ceramic circuit boards using a titanium support substrate |
| 12/27/2000 | EP1062688A1 Over-voltage protection device for integrated circuits |
| 12/27/2000 | EP1062618A1 Non-lot based method for assembling integrated circuit devices |
| 12/27/2000 | EP1062563A1 System for cooling device in computer |
| 12/27/2000 | CN2412294Y Semiconductor component packing for non-welding assembly |
| 12/27/2000 | CN1278364A Device with security integrated circuit and method for making same |
| 12/27/2000 | CN1278363A Component and method for prodn. thereof |
| 12/27/2000 | CN1278308A Method of making a structure with improved material properties by moderate heat treatment of a metal deposit |
| 12/27/2000 | CN1278107A Manufacture of grid electrode conductor layer cavity fuse |
| 12/27/2000 | CN1059982C Method for welding packaged integrated circuit plate |
| 12/26/2000 | US6166940 Semiconductor memory device having a plurality of storage regions |
| 12/26/2000 | US6166937 Inverter device with cooling arrangement therefor |
| 12/26/2000 | US6166915 Electronic circuits and circuit boards |
| 12/26/2000 | US6166914 IC card having a reinforcing member for reinforcing a sealing member |
| 12/26/2000 | US6166911 Semiconductor integrated circuit card assembly |
| 12/26/2000 | US6166904 Heat generating element cooling device |
| 12/26/2000 | US6166903 Electronic power module, and electronic power system comprising a plurality of said modules |
| 12/26/2000 | US6166607 Semiconductor test structure formed in cutting path of semiconductor water |
| 12/26/2000 | US6166464 Power module |
| 12/26/2000 | US6166446 Semiconductor device and fabrication process thereof |
| 12/26/2000 | US6166445 Semiconductor device and method for producing same |
| 12/26/2000 | US6166443 Semiconductor device with reduced thickness |
| 12/26/2000 | US6166442 Semiconductor device |