| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/11/2001 | WO2001003189A1 Multichip module and method for producing a multichip module |
| 01/11/2001 | WO2001003188A1 Integrated circuit attachment process and apparatus |
| 01/11/2001 | WO2001003187A1 Adjustable semiconductor component |
| 01/11/2001 | WO2001003186A1 Semiconductor device, method of manufacturing the same, and structure for mounting semiconductor device |
| 01/11/2001 | WO2001003184A1 Electronic part |
| 01/11/2001 | WO2001003182A1 Heatsink and method of manufacture |
| 01/11/2001 | WO2001003174A1 Method for selectively coating ceramic surfaces |
| 01/11/2001 | WO2001003060A1 Chip card with a flexible chip |
| 01/11/2001 | WO2001002468A1 Composites of powdered fillers and polymer matrix and process for preparing them |
| 01/11/2001 | WO2000055887A3 Housing for an electronic circuit |
| 01/11/2001 | WO2000052739A3 A controlled collapse chip connection (c4) integrated circuit package that has a filler which seals an underfill material |
| 01/11/2001 | DE19931689A1 Planar LED assembly on thermally-conductive board, increases cooling, component packing density and life, whilst permitting active device integration to form display- or illumination panel in or on e.g. vehicle |
| 01/11/2001 | DE19930308A1 Multichip module for complex electronic systems comprises a silicon support substrate with a multi-layered wiring on its components side |
| 01/11/2001 | DE19929542A1 Chip mit räumlich vorstehenden Mikroelektroden und Verfahren zur Herstellung eines solchen Chip with spatially protruding micro-electrodes and methods for producing such |
| 01/11/2001 | DE19928761A1 Semiconducting chip has strain, displacement and/or compression stresses and forces arising during and after mounting of pressed material body kept as small as possible |
| 01/10/2001 | EP1067604A2 Semiconductor apparatus with self-security function |
| 01/10/2001 | EP1067603A2 Chip carrier |
| 01/10/2001 | EP1067602A1 Un-packaged or semi-packaged electrically tested electronic semiconductor device free from infantile mortality and process for manufacture thereof |
| 01/10/2001 | EP1067601A1 Chip module, in particular BGA package, with chip carrier for stress free solder connection to printed wiring board |
| 01/10/2001 | EP1067164A1 Phase change thermal interface material |
| 01/10/2001 | EP1067162A1 Adhesive and semiconductor devices |
| 01/10/2001 | EP1066489A1 Thermoelectric cooling apparatus with dynamic switching to isolate heat transport mechanisms |
| 01/10/2001 | CN2414588Y Cool board radiator |
| 01/10/2001 | CN1279821A Stress relaxation electronic part, stress relaxation wiring board and stress relaxation electronic part mounted body |
| 01/10/2001 | CN1279797A Method for making electronic module or label, resulting electronic module or label and medium containing such a module or label |
| 01/10/2001 | CN1279511A Semiconductor device and manufacture thereof |
| 01/10/2001 | CN1279251A Semiconductor having themosetting dielectric material and manufacture thereof |
| 01/10/2001 | CN1279157A Multi-layer substrates |
| 01/09/2001 | US6172872 Heat sink and information processor using it |
| 01/09/2001 | US6172590 Over-voltage protection device and method for making same |
| 01/09/2001 | US6172448 Method and apparatus for utilizing heat dissipated from an electrical device |
| 01/09/2001 | US6172425 Encapsulation of transmitter and receiver modules |
| 01/09/2001 | US6172424 Resin sealing type semiconductor device |
| 01/09/2001 | US6172423 Layer-type ball grid array semiconductor package and fabrication method thereof |
| 01/09/2001 | US6172422 Semiconductor device and a manufacturing method thereof |
| 01/09/2001 | US6172419 Low profile ball grid array package |
| 01/09/2001 | US6172418 Semiconductor device and method for fabricating the same |
| 01/09/2001 | US6172416 Heat sink unit for cooling a plurality of exothermic units, and electronic apparatus comprising the same |
| 01/09/2001 | US6172415 A sintered copper or sintered alluminum alloy body having a recess for receiving a semiconductor chip |
| 01/09/2001 | US6172413 Chip leads constrained in dielectric media |
| 01/09/2001 | US6172412 High frequency microelectronics package |
| 01/09/2001 | US6172409 Buffer grated structure for metrology mark and method for making the same |
| 01/09/2001 | US6172381 Source/drain junction areas self aligned between a sidewall spacer and an etched lateral sidewall |
| 01/09/2001 | US6172305 Multilayer circuit board |
| 01/09/2001 | US6172143 Comprising epoxy compound, polycarbodiimide resin in 0.1 to 10 parts by weight relative to 100 parts by weight of the epoxy compound, and epoxy resin curing agent comprising one of an acid anhydride, imidazole, dicyandiamide and phenol |
| 01/09/2001 | US6171979 Semiconductor device and method of producing the same |
| 01/09/2001 | US6171971 Freestanding multilayer wiring structure |
| 01/09/2001 | US6171964 Method of forming a conductive spacer in a via |
| 01/09/2001 | US6171961 Fabrication method of a semiconductor device |
| 01/09/2001 | US6171960 Method of fabricating copper interconnection |
| 01/09/2001 | US6171957 Manufacturing method of semiconductor device having high pressure reflow process |
| 01/09/2001 | US6171956 Method for improving the thermal conductivity of metal lines in integrated circuits |
| 01/09/2001 | US6171950 Method for forming a multilevel interconnection with low contact resistance in a semiconductor device |
| 01/09/2001 | US6171945 CVD nanoporous silica low dielectric constant films |
| 01/09/2001 | US6171936 Method of producing co-planar Si and Ge composite substrate |
| 01/09/2001 | US6171910 Method for forming a semiconductor device |
| 01/09/2001 | US6171902 Method of forming a DRAM cylinder shaped capacitor |
| 01/09/2001 | US6171888 Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same |
| 01/09/2001 | US6171887 Semiconductor device for a face down bonding to a mounting substrate and a method of manufacturing the same |
| 01/09/2001 | US6171877 Optical transmitter package assembly and methods of manufacture |
| 01/09/2001 | US6171873 Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information |
| 01/09/2001 | US6171737 For detecting defects in photolithography processes in a submicron integrated circuit manufacturing environment; combines use of a reusable test wafer with in-line processing to monitor defects using a pattern comparator system |
| 01/09/2001 | US6171703 Hermetic substrate coatings in an inert gas atmosphere |
| 01/09/2001 | US6171691 Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same |
| 01/09/2001 | US6171687 Infiltrated nanoporous materials and methods of producing same |
| 01/09/2001 | US6170737 Solder ball placement method |
| 01/09/2001 | US6170647 Conveyor and reflow device using the same |
| 01/09/2001 | US6170563 Heat radiating device for notebook computer |
| 01/09/2001 | US6170155 System of components to be hybridized and hybridization process allowing for thermal expansions |
| 01/08/2001 | CA2313442A1 Optoelectric component group |
| 01/08/2001 | CA2311067A1 Phase change thermal interface material |
| 01/04/2001 | WO2001001487A1 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
| 01/04/2001 | WO2001001486A1 Interposer and method of making same |
| 01/04/2001 | WO2001001485A2 A semiconductor device |
| 01/04/2001 | WO2001001480A1 Method of protecting an underlying wiring layer during dual damascene processing |
| 01/04/2001 | WO2001001478A1 Component and method for the production thereof |
| 01/04/2001 | WO2001001469A2 Process for designing a mask |
| 01/04/2001 | WO2001001455A2 Chip with protruding microelectrodes and method for the production thereof |
| 01/04/2001 | WO2001001453A2 Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards |
| 01/04/2001 | WO2001001451A2 Microwave circuit packages having a reduced number of vias in the substrate |
| 01/04/2001 | WO2001001341A1 Support element for an integrated circuit module |
| 01/04/2001 | WO2001001180A1 Optomodule |
| 01/04/2001 | WO2001000508A1 Semiconductor package clad material and semiconductor package using the same |
| 01/04/2001 | WO2001000137A2 Apparatus and method for setting the parameters of an alert window used for timing the delivery of etc signals to a heart under varying cardiac conditions |
| 01/04/2001 | WO2000062419A3 Mos variable gain amplifier |
| 01/04/2001 | DE19930782A1 Verfahren zum selektiven Beschichten keramischer Oberflächenbereiche A process for selectively coating ceramic surface regions |
| 01/04/2001 | DE10030289A1 Component carrier consists of two different temperature resistant synthetic materials, one resistant to higher temperature than other, with high temperature resistant material at least near connecting points |
| 01/04/2001 | DE10030209A1 Test socket has IC holder with housing contg. contacts, each of which makes contact with IC connection points, apertures in housing and open to side that contacts test socket |
| 01/04/2001 | DE10023834A1 Production of a semiconductor element comprises preparing a substrate having an insulating section and a conducting section, forming a metallic layer on the substrate, and removing the first section of the metallic layer |
| 01/04/2001 | CA2377956A1 Optomodule |
| 01/04/2001 | CA2377628A1 Component and method for the production thereof |
| 01/03/2001 | WO2001015223A1 Semiconductor device and method of manufacture thereof |
| 01/03/2001 | EP1065916A2 Resin sealed electronic device |
| 01/03/2001 | EP1065730A1 Compression bonded semiconductor device |
| 01/03/2001 | EP1065729A1 Compression bonded semiconductor device |
| 01/03/2001 | EP1065720A2 Driver IC packaging module and flat display device using the same |
| 01/03/2001 | EP1065719A2 Power semiconductor mounting package containing ball grid array |
| 01/03/2001 | EP1065718A1 Semiconductor chip module and method for manufacturing the same |
| 01/03/2001 | EP1065717A2 Multilayer circuit boards |
| 01/03/2001 | EP1065716A2 Method for making air pockets in an HDI context |