| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/18/2001 | WO2000057454A3 Improved integrated oscillators and tuning circuits |
| 01/18/2001 | DE19945426C1 Plug connector protecting e.g. components of circuit card from electrostatic discharge, has pins embedded in plastic including material insulating at working voltage, but conducting above it |
| 01/18/2001 | DE19931694A1 Production of electrical circuit or module with device, e.g. chip, on top, uses lead frame with fingers connected to contact areas of top metallization and encapsulation in insulating material leaving bottom metallization exposed |
| 01/18/2001 | DE19929912A1 Trägerelement für einen IC-Baustein A carrier element for an IC module |
| 01/18/2001 | DE19929754A1 Verguß eines Schaltungsaufbaus mit vibrationsdämpfender Einbettungsmasse Casting a circuit construction with vibration damping embedding compound |
| 01/18/2001 | DE19929209A1 Electronic control device for car brake antiblocking systems, comprises carrier in which control connector is fitted and metallic cooling component soldered under it on further side from carrier and encapsulated in plastic |
| 01/18/2001 | DE10029025A1 Integrated circuit socket e.g. for ball grid array device, has upper contact pins which are displaceable and mechanically biased to extend beyond upper surface of base |
| 01/18/2001 | DE10025213A1 Semiconductor device for protecting access e.g. to mobile telephone had circuit for encoding dispersion of polycrystalline substance in semiconductor element |
| 01/18/2001 | DE10011005A1 Multichip module and method for producing a multichip module |
| 01/18/2001 | CA2373710A1 Fabrication process for dishing-free cu damascene structures |
| 01/18/2001 | CA2342363A1 Laminates for encapsulating devices |
| 01/17/2001 | EP1069656A2 Electrical connector assembly |
| 01/17/2001 | EP1069639A2 Radio-frequency circuit module |
| 01/17/2001 | EP1069618A1 Semiconductor device and manufacture thereof |
| 01/17/2001 | EP1069617A2 Multilayer wiring board |
| 01/17/2001 | EP1069616A2 Multi-layer flexible printed wiring board |
| 01/17/2001 | EP1069615A2 Semiconductor device |
| 01/17/2001 | EP1069612A2 Continuous, non-agglomerated adhesion of a seed layer to a barrier layer |
| 01/17/2001 | EP1069611A2 Method and apparatus for forming a conductive via comprising a refractory metal |
| 01/17/2001 | EP1069610A2 Refractory metal deposition process for low contact resistivity to silicon and corresponding apparatus |
| 01/17/2001 | EP1069608A1 Method of wire bonding, semiconductor device, circuit board, electronic device and wire bonder |
| 01/17/2001 | EP1069607A2 Release member for use in producing a multi-layer package |
| 01/17/2001 | EP1069604A2 Method for etching layers on semiconductor substrates |
| 01/17/2001 | EP1069437A1 Method for controlling ic handler and control system using the same |
| 01/17/2001 | EP1069213A2 Optimal anneal technology for micro-voiding control and self-annealing management of electroplated copper |
| 01/17/2001 | EP1069212A1 Electrochemical deposition for high aspect ratio structures using electrical pulse modulation |
| 01/17/2001 | EP1069208A2 Method of diffusing gas into a CVD chamber and gas diffusing means |
| 01/17/2001 | EP1069207A2 In-situ etch method for for cleaning a CVD chamber |
| 01/17/2001 | EP1069206A2 Nanoscale conductive connectors and method for making same |
| 01/17/2001 | EP1069194A1 Metal material for electronic parts, electronic parts, electronic apparatuses, and method of processing metal materials |
| 01/17/2001 | EP1068642A1 An inductance device |
| 01/17/2001 | EP1068641A1 Stepper alignment mark formation with dual field oxide process |
| 01/17/2001 | EP1068640A1 Use of the constructional characteristics of an electronic component as a reference for positioning the component |
| 01/17/2001 | EP1068639A1 Wire bond attachment of a integrated circuit package to a heat sink |
| 01/17/2001 | EP1068638A1 Wafer-pair having deposited layer sealed chambers |
| 01/17/2001 | EP1068499A1 Packaged device |
| 01/17/2001 | EP1068255A2 Poly(arylene ether) compositions and methods of manufacture thereof |
| 01/17/2001 | CN1280707A Silicon based conductive material and process for production thereof |
| 01/17/2001 | CN1280706A Thermoelectric transducing material and method of producing the same |
| 01/17/2001 | CN1280702A Microelectronic Component carrier and method of its manufacture |
| 01/17/2001 | CN1280455A Method for producing electronic device and electronic device and resin filling method |
| 01/17/2001 | CN1280388A Silicon complementary metal oxide semiconductor body contact on insulator formed by grating |
| 01/17/2001 | CN1280387A Metal material for electronic unit, electronic unit, electronic equipment and treating method for metal material |
| 01/17/2001 | CN1280384A Method and equipment for reducing non-uniform area influence in semiconductor device production |
| 01/17/2001 | CN1280056A Multilager base plate |
| 01/17/2001 | CN1060771C Novel aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin |
| 01/16/2001 | US6175752 Analyte monitoring device and methods of use |
| 01/16/2001 | US6175499 Heat sink clamping string additionally holding a ZIF socket locked |
| 01/16/2001 | US6175497 Thermal vias-provided cavity-down IC package structure |
| 01/16/2001 | US6175287 Direct backside interconnect for multiple chip assemblies |
| 01/16/2001 | US6175162 Semiconductor wafer having a bottom surface protective coating |
| 01/16/2001 | US6175161 System and method for packaging integrated circuits |
| 01/16/2001 | US6175160 Flip-chip having an on-chip cache memory |
| 01/16/2001 | US6175159 Semiconductor package |
| 01/16/2001 | US6175158 Interposer for recessed flip-chip package |
| 01/16/2001 | US6175157 Semiconductor device package for suppressing warping in semiconductor chips |
| 01/16/2001 | US6175156 Semiconductor device with improved interconnection |
| 01/16/2001 | US6175154 Fully encapsulated metal leads for multi-level metallization |
| 01/16/2001 | US6175153 Semiconductor device |
| 01/16/2001 | US6175152 Semiconductor device |
| 01/16/2001 | US6175151 Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument |
| 01/16/2001 | US6175150 Plastic-encapsulated semiconductor device and fabrication method thereof |
| 01/16/2001 | US6175149 Mounting multiple semiconductor dies in a package |
| 01/16/2001 | US6175148 Electrical connection for a power semiconductor component |
| 01/16/2001 | US6175145 Method of making a fuse in a semiconductor device and a semiconductor device having a fuse |
| 01/16/2001 | US6175131 Semiconductor device having a capacitor and an interconnect layer |
| 01/16/2001 | US6175125 Semiconductor structure for testing vias interconnecting layers of the structure |
| 01/16/2001 | US6175124 Method and apparatus for a wafer level system |
| 01/16/2001 | US6175084 Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
| 01/16/2001 | US6174841 Enables efficient removal of heat generated from electronic parts and prevent semiconductor performance from deteriorating or being damaged by temperature rise due to heat generation |
| 01/16/2001 | US6174822 Semiconductor device and method for fabricating the same |
| 01/16/2001 | US6174814 Method for producing a crack stop for interlevel dielectric layers |
| 01/16/2001 | US6174812 Copper damascene technology for ultra large scale integration circuits |
| 01/16/2001 | US6174810 Providing semiconductor substrate; forming dielectric layer; patterning dielectric layer to form openings; forming copper layer; removing copper layer; exposing to plasma of hydrogen and nitrogen; forming siliconoxynitride layers |
| 01/16/2001 | US6174803 Integrated circuit device interconnection techniques |
| 01/16/2001 | US6174799 Graded compound seed layers for semiconductors |
| 01/16/2001 | US6174798 Forming titanium nitride(tin) barrier layer over insulation layer on integrated circuit structure; forming titanium seed layer over barrier layer; forming second tin barrier layer over titanium seed layer; forming main metal interconnect |
| 01/16/2001 | US6174796 Semiconductor device manufacturing method |
| 01/16/2001 | US6174793 Method for enhancing adhesion between copper and silicon nitride |
| 01/16/2001 | US6174766 Semiconductor device and method of manufacturing the semiconductor device |
| 01/16/2001 | US6174753 Mask reduction process with a method of forming a raised fuse and a fuse window with sidewall passivation |
| 01/16/2001 | US6174752 Method and apparatus for epoxy loc die attachment |
| 01/16/2001 | US6174751 Method of manufacturing resin encapsulated semiconductor device |
| 01/16/2001 | US6174633 Method for correcting photocontiguous effect during manufacture of semiconductor device |
| 01/16/2001 | US6174563 Forming an integrated circuit which includes a metal film layer for wiring |
| 01/16/2001 | US6174462 Conductive paste composition including conductive metallic powder |
| 01/16/2001 | US6174173 IC socket |
| 01/16/2001 | US6173898 Memory card of the contactless type |
| 01/16/2001 | US6173760 Co-axial bellows liquid heatsink for high power module test |
| 01/16/2001 | US6173759 Method of cooling electronic devices using a tube in plate heat sink |
| 01/16/2001 | US6173758 Pin fin heat sink and pin fin arrangement therein |
| 01/16/2001 | US6173577 Methods and apparatus for cooling systems for cryogenic power conversion electronics |
| 01/16/2001 | US6173576 Cooling unit for an integrated circuit package |
| 01/16/2001 | US6173490 Method for forming a panel of packaged integrated circuits |
| 01/16/2001 | US6173489 Organic substrate (PCB) slip plane “stress deflector” for flip chip devices |
| 01/16/2001 | CA2160501C Laminar stackable circuit board structure and manufacture |
| 01/11/2001 | WO2001003487A1 Heat sink apparatus and method of attaching the heat sink apparatus to a device |
| 01/11/2001 | WO2001003485A1 Arrangement for dissipating thermal energy generated by heat source |
| 01/11/2001 | WO2001003484A1 Method of installing heat source, and micro heat pipe module |
| 01/11/2001 | WO2001003191A1 Soi substrate, method of manufacture thereof, and semiconductor device using soi substrate |