| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/30/2001 | US6180241 Arrangement for reducing bending stress in an electronics package |
| 01/30/2001 | US6180187 Method of making an electronic component using reworkable underfill encapsulants |
| 01/30/2001 | US6180029 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
| 01/30/2001 | US6179598 Apparatus for filling a gap between spaced layers of a semiconductor |
| 01/30/2001 | US6179047 Mechanical assembly for regulating the temperature of an electronic device which incorporates at least two leaf springs for self-alignment plus a low initial contact force and a low profile |
| 01/30/2001 | US6179046 Heat dissipation device |
| 01/30/2001 | US6178972 Washing semiconductor integrated circuit with a neutral solution containing an oxidant to selectively remove debris/residue from wiring elements during their manufacturing step |
| 01/30/2001 | US6178628 Apparatus and method for direct attachment of heat sink to surface mount |
| 01/30/2001 | US6178611 Apparatus for installing a clip |
| 01/30/2001 | CA2119652C Silicon or silica substrate with a modified surface, process for producing the same, new orthoesters and process for producing the same |
| 01/25/2001 | WO2001006818A1 Circuitry with integrated passive components and method for producing same |
| 01/25/2001 | WO2001006558A1 Package of semiconductor device and method of manufacture thereof |
| 01/25/2001 | WO2001006547A1 A thin film resistor device and a method of manufacture therefor |
| 01/25/2001 | WO2001005889A1 Epoxy resin composition for semiconductor sealing and semiconductor device |
| 01/25/2001 | WO2000045420A3 Multiple chip module with integrated rf capabilities |
| 01/25/2001 | DE19936862C1 Kontaktierung von Metalleiterbahnen eines integrierten Halbleiterchips Contacting of metal leads of an integrated semiconductor chip |
| 01/25/2001 | DE19934554A1 Heat exchanger has cooling body with channel structure for introducing the cooling medium |
| 01/25/2001 | DE19934089A1 Raising electrical conductivity in multi-component materials e.g. semiconductors and insulators comprises withdrawing a material component from the starting material by particle radiation |
| 01/25/2001 | DE19933548A1 Electronic component used as an OFW/SAW component has a substrate plate covered with a tin dioxide layer, and an electrical conductor structure |
| 01/25/2001 | DE19932441A1 Vorrichtung zur Entwärmung von Halbleiterbauelementen beim Auftreten von Belastungsspitzen Apparatus for cooling of semiconductor devices on the occurrence of peak loads |
| 01/25/2001 | DE19931240A1 Chipkarte Smart card |
| 01/25/2001 | DE19931082A1 Abgleichbares Halbleiterbauelement Abgleichbares semiconductor device |
| 01/25/2001 | DE10031115A1 Halbleiterbauteil sowie Verfahren zur Messung seiner Temperatur Semiconductor device and method for measuring its temperature |
| 01/25/2001 | DE10030436A1 Verfahren zur Herstellung einer Masse für eine elektrisch leitfähige Dickschicht, Masse für eine elektrisch leitfähige Dickschicht und laminiertes keramisches Elektronikteil A process for preparing a composition for an electrically conductive thick film composition for an electrically conductive thick film and laminated ceramic electronic part |
| 01/25/2001 | DE10020394A1 Head component used in the production of integrated circuits contains a mounting surface, and an integrated circuit chip for processing signals covered by a layer |
| 01/24/2001 | EP1071316A2 Multilayer circuit board |
| 01/24/2001 | EP1071132A2 Method for reducing substrate capacitive coupling of a thin film inductor by reverse P/N junctions |
| 01/24/2001 | EP1071131A1 Large non-hermetic multichip module package |
| 01/24/2001 | EP1071130A2 Semiconductor device interconnection structure comprising additional capacitors |
| 01/24/2001 | EP1071126A2 Microcap wafer-level package with vias |
| 01/24/2001 | EP1071124A2 Dry etching method for forming tungsten wiring in a semiconductor device |
| 01/24/2001 | EP1070677A2 Microcap wafer-level package |
| 01/24/2001 | EP1070351A1 Over-voltage protection system for integrated circuits using the bonding pads and passivation layer |
| 01/24/2001 | EP1070350A1 Integrated circuit package having a thermoelectric cooling element therein |
| 01/24/2001 | EP1070349A1 Semiconductor component |
| 01/24/2001 | EP1004141A4 A system and method for packaging integrated circuits |
| 01/24/2001 | CN2416711Y Temperature-lowering device |
| 01/24/2001 | CN2416612Y Radiator |
| 01/24/2001 | CN2416611Y Radiator |
| 01/24/2001 | CN2416610Y Radiator |
| 01/24/2001 | CN1281545A Thermoelectric cooling apparatus with dynamic switching to isolate heat transport mechanisms |
| 01/24/2001 | CN1281331A Multilayer ceramic supporting base with anchored welding pad |
| 01/24/2001 | CN1281257A 半导体器件 Semiconductor devices |
| 01/24/2001 | CN1281256A Welding pad structure for semi-conductor package |
| 01/24/2001 | CN1281255A Semi conductor device and its manufacturing method |
| 01/24/2001 | CN1281249A Semiconductor device and its manufacturing method |
| 01/24/2001 | CN1061174C Method for producing semiconductor packaging with transparent window |
| 01/24/2001 | CN1061073C Three-layer polyimidesiloxane adhesive tape |
| 01/23/2001 | US6178543 Method of designing active region pattern with shift dummy pattern |
| 01/23/2001 | US6178088 Electronic apparatus |
| 01/23/2001 | US6178083 Layered capacitor device |
| 01/23/2001 | US6178082 High temperature, conductive thin film diffusion barrier for ceramic/metal systems |
| 01/23/2001 | US6177834 Output matched LDMOS power transistor device |
| 01/23/2001 | US6177833 Integrated circuit module having reduced impedance and method of providing the same |
| 01/23/2001 | US6177761 LED with light extractor |
| 01/23/2001 | US6177733 Semiconductor device |
| 01/23/2001 | US6177732 Multi-layer organic land grid array to minimize via inductance |
| 01/23/2001 | US6177731 Semiconductor package |
| 01/23/2001 | US6177730 Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip |
| 01/23/2001 | US6177728 Integrated circuit chip device having balanced thermal expansion |
| 01/23/2001 | US6177727 Saddle bracket for solid state pressure gauge |
| 01/23/2001 | US6177726 SiO2 wire bond insulation in semiconductor assemblies |
| 01/23/2001 | US6177725 Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same |
| 01/23/2001 | US6177724 Semiconductor device |
| 01/23/2001 | US6177723 Integrated circuit package and flat plate molding process for integrated circuit package |
| 01/23/2001 | US6177722 Leadless array package |
| 01/23/2001 | US6177721 Chip stack-type semiconductor package and method for fabricating the same |
| 01/23/2001 | US6177720 Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frame |
| 01/23/2001 | US6177719 Chip scale package of semiconductor |
| 01/23/2001 | US6177718 Resin-sealed semiconductor device |
| 01/23/2001 | US6177715 Integrated circuit having a level of metallization of variable thickness |
| 01/23/2001 | US6177714 Semiconductor device having a fuse of the laser make-link programming type |
| 01/23/2001 | US6177701 Semiconductor device with resistor and fabrication method therof |
| 01/23/2001 | US6177636 Connection components with posts |
| 01/23/2001 | US6177489 Blend of epoxy resin, curing agent, silica, and polysiloxane |
| 01/23/2001 | US6177350 Sputter etching the patterned dielectric surface, depositing a continuous wetting layer of titanim over the patterned dielectric surface using ion sputtering, covering the wetting layer with a layer of aluminum |
| 01/23/2001 | US6177346 Integrated circuitry and method of forming a field effect transistor |
| 01/23/2001 | US6177298 Electrostatic discharge protection circuit for an integrated circuit and method of manufacturing |
| 01/23/2001 | US6177297 Method of forming metallic fuse demanding lower laser power for circuit repair |
| 01/23/2001 | US6177296 Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform |
| 01/23/2001 | US6177295 Method of manufacturing semiconductor devices with “chip size package” |
| 01/23/2001 | US6177294 Wiring layout method for semiconductor device and recording medium on which wiring layout program for semiconductor device is recorded |
| 01/23/2001 | US6177288 Method of making integrated circuit packages |
| 01/23/2001 | US6177184 Method of making an interface layer for stacked lamination sizing and sintering |
| 01/23/2001 | US6177040 Forming windows |
| 01/23/2001 | US6176709 Socket and adapter integrated circuit, and integrated circuit assembly |
| 01/23/2001 | US6176304 Heat sink |
| 01/23/2001 | US6176299 Cooling apparatus for electronic devices |
| 01/23/2001 | US6176098 Water vaporization type cooler for heat-generating element |
| 01/18/2001 | WO2001005205A1 Laminates for encapsulating devices |
| 01/18/2001 | WO2001004957A1 Contactless electronic module and method for obtaining same |
| 01/18/2001 | WO2001004956A1 Semiconductor device and method of manufacturing same |
| 01/18/2001 | WO2001004955A1 Monolithic low dielectric constant platform for passive components and method |
| 01/18/2001 | WO2001004954A1 Semiconductor devices and process for manufacture |
| 01/18/2001 | WO2001004953A1 Method for manufacturing a semiconductor device having a metal layer floating over a substrate |
| 01/18/2001 | WO2001004952A1 Semiconductor device arrangement having configuration via adjacent bond pad coding |
| 01/18/2001 | WO2001004950A1 Device for heat dissipation of semiconductor components in case of load peaks |
| 01/18/2001 | WO2001004941A1 Fabrication process for dishing-free cu damascene structures |
| 01/18/2001 | WO2001004567A2 Method and apparatus for three dimensional inspection of electronic components |
| 01/18/2001 | WO2001004194A1 Method of, and material for, improving thermal conductivity |