| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/08/2001 | WO2001009944A1 Method for producing via-connections in a substrate and substrate equipped with same |
| 02/08/2001 | WO2001009939A1 Method and structure for manufacturing improved yield semiconductor packaged devices |
| 02/08/2001 | WO2001009927A1 Semiconductor structures and manufacturing methods |
| 02/08/2001 | WO2001009828A1 Method for making a smart card with contact |
| 02/08/2001 | WO2001009819A1 Scratchproof coating for semiconductor components |
| 02/08/2001 | WO2001009219A1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 02/08/2001 | WO2001009060A1 Paste for screenprinting electric structures onto carrier substrates |
| 02/08/2001 | WO2000070679B1 Carrier for electronic components and a method for manufacturing a carrier |
| 02/08/2001 | DE19956247A1 Chip component, useful for a memory chip stack, has chip contact pads connected through an adhesive dielectric strip to mounting element conductor lines and solder balls connected to mounting element contact vias |
| 02/08/2001 | DE19935677A1 Paste für den Siebdruck von elektrischen Strukturen auf Trägersubstraten Paste for screen printing of electrical structures to support substrates |
| 02/08/2001 | DE19935411A1 Chip size package has all its silicon layer doped regions connected by structured conductor lines at the side at which the doped regions are introduced |
| 02/08/2001 | DE10036619A1 Semiconducting component has socket-like plug connector for accepting pin or blade-shaped connectors with slot-shaped openings accepting connectors from above and from side |
| 02/07/2001 | EP1075072A1 Brushless DC motor and its stator |
| 02/07/2001 | EP1075027A2 Contacting of metal interconnections of integrated semiconductor chips |
| 02/07/2001 | EP1075026A2 Multilayer circuit board layout |
| 02/07/2001 | EP1075025A2 Electronic device and method of fabricating the same |
| 02/07/2001 | EP1075024A2 Chip carrier with fibrous heat dissipation plate |
| 02/07/2001 | EP1075020A2 Method for packaging semiconductor device |
| 02/07/2001 | EP1075019A1 Integrated circuit device and its manufacturing method |
| 02/07/2001 | EP1074571A2 Liquid potting composition |
| 02/07/2001 | EP1074524A1 Glass-ceramic composition, circuit substrate using the same and manufacture method thereof |
| 02/07/2001 | EP1074173A1 Reverse cantilever spring clip |
| 02/07/2001 | EP1074045A1 Method for forming a multi-layered aluminum-comprising structure on a substrate |
| 02/07/2001 | EP0963605A4 Improved leadframe structure with locked inner leads and process for manufacturing same |
| 02/07/2001 | CN1283308A Semiconductor integrated circuit |
| 02/07/2001 | CN1283307A Mounting arrangement for securing integrated circuit package to heat sink |
| 02/07/2001 | CN1283079A Screened cover and electronic device using said cover |
| 02/07/2001 | CN1282985A LED-type christmes lamp bulb and its making method |
| 02/07/2001 | CN1282983A Manufacturing method of semi-conductor device |
| 02/07/2001 | CN1282982A Manufacturing method of semi-conductor device |
| 02/07/2001 | CN1282980A Method of manufacturing semi-conductor device |
| 02/07/2001 | CN1282896A Heat radiator |
| 02/07/2001 | CN1061785C Multi-layer interlined structure for integrated circuit and manfacturing method thereof |
| 02/07/2001 | CN1061784C 树脂密封型半导体器件 Resin-sealed type semiconductor device |
| 02/07/2001 | CN1061783C Method for manufacturing semiconductor device |
| 02/07/2001 | CN1061782C Wiring structure of semiconductor device and method for manufacturing the same |
| 02/06/2001 | US6185481 Air cooled electronic equipment apparatus |
| 02/06/2001 | US6185124 Storage circuit apparatus |
| 02/06/2001 | US6184966 Semiconductor device and method for producing the same |
| 02/06/2001 | US6184965 Circuit connection structure |
| 02/06/2001 | US6184917 Laser marking method and apparatus and liquid crystal element driving method |
| 02/06/2001 | US6184757 Cryogenic electronic assembly |
| 02/06/2001 | US6184702 Crosstalk prevention circuit |
| 02/06/2001 | US6184699 Photolithographically patterned spring contact |
| 02/06/2001 | US6184664 Voltage regulator circuit for suppressing latch-up phenomenon |
| 02/06/2001 | US6184658 Battery pack protective circuit with external terminals on opposite side of part mounting surface of circuit board |
| 02/06/2001 | US6184589 Constraining ring for use in electronic packaging |
| 02/06/2001 | US6184587 Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components |
| 02/06/2001 | US6184586 Semiconductor device including a ball grid array |
| 02/06/2001 | US6184585 Co-packaged MOS-gated device and control integrated circuit |
| 02/06/2001 | US6184584 Miniaturized contact in semiconductor substrate and method for forming the same |
| 02/06/2001 | US6184582 Article comprising a standoff complaint metallization and a method for making same |
| 02/06/2001 | US6184581 Solder bump input/output pad for a surface mount circuit device |
| 02/06/2001 | US6184580 Ball grid array package with conductive leads |
| 02/06/2001 | US6184579 Double-sided electronic device |
| 02/06/2001 | US6184578 Graphite composite heat pipe |
| 02/06/2001 | US6184577 Electronic component parts device |
| 02/06/2001 | US6184576 Packaging and interconnection of contact structure |
| 02/06/2001 | US6184575 Ultra-thin composite package for integrated circuits |
| 02/06/2001 | US6184574 Multi-capacitance lead frame decoupling device |
| 02/06/2001 | US6184573 Chip packaging |
| 02/06/2001 | US6184570 Integrated circuit dies including thermal stress reducing grooves and microelectronic packages utilizing the same |
| 02/06/2001 | US6184569 Semiconductor chip inspection structures |
| 02/06/2001 | US6184567 Film capacitor and semiconductor package or device carrying same |
| 02/06/2001 | US6184551 Capacitor with lower electrode on substrate, insulating layer including via hole so surface of lower electrode exposed, dielectric layer, and upper electrode on dielectric layer having plug of alloys of tungsten, aluminum or copper |
| 02/06/2001 | US6184550 For use as conductive barrier layers in integrated circuit memory cell structures including ferroelectric or high permittivity capacitors; the nitride-carbide material includes specified metal(s) |
| 02/06/2001 | US6184514 Plastic cover for image sensors |
| 02/06/2001 | US6184494 Printed circuit board having a heating element and heating method thereof |
| 02/06/2001 | US6184477 Multi-layer circuit substrate having orthogonal grid ground and power planes |
| 02/06/2001 | US6184465 Semiconductor package |
| 02/06/2001 | US6184463 Integrated circuit package for flip chip |
| 02/06/2001 | US6184337 Heat resistance; for use in semiconductors |
| 02/06/2001 | US6184143 Semiconductor integrated circuit device and fabrication process thereof |
| 02/06/2001 | US6184137 Structure and method for improving low temperature copper reflow in semiconductor features |
| 02/06/2001 | US6184133 Method of forming an assembly board with insulator filled through holes |
| 02/06/2001 | US6184131 Supplying liquid material onto surface structure of substrate having recesses so as to form a layer of liquid material; pressing through exposure to high-pressure gas to fill recesses; heating to form solid layer from liquid layer |
| 02/06/2001 | US6184130 Depositing silicide layer conformally over surface of insulating layer over semiconductor substrate, where in silicide layer acts as ohmic contact and glue layer; depositing tungsten layer; removing tungsten and slicide layer |
| 02/06/2001 | US6184127 Semiconductor processing method of forming a contact opening to a region adjacent a field isolation mass, and a semiconductor structure |
| 02/06/2001 | US6184124 Method of making embedded wiring system |
| 02/06/2001 | US6184122 Method for preventing crosstalk between conductive layers |
| 02/06/2001 | US6184121 Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same |
| 02/06/2001 | US6184118 Method for preventing the peeling of the tungsten metal after the metal-etching process |
| 02/06/2001 | US6184104 Alignment mark strategy for oxide CMP |
| 02/06/2001 | US6184067 Memory device with multiple input/output connections |
| 02/06/2001 | US6184065 Photolithographically patterned spring contact |
| 02/06/2001 | US6184062 Process for forming cone shaped solder for chip interconnection |
| 02/06/2001 | US6184060 Integrated circuits and methods for their fabrication |
| 02/06/2001 | US6183875 Composite material which is prepared by directly solidifying molten aluminum or aluminum alloy on at least portion of ceramic substrate |
| 02/06/2001 | US6183874 Aluminum silicon carbide composite alloys |
| 02/06/2001 | US6183669 Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate |
| 02/06/2001 | US6183592 Method for minimizing warp in the production of electronic assemblies |
| 02/06/2001 | US6183589 Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads |
| 02/06/2001 | US6183267 Ultra-miniature electrical contacts and method of manufacture |
| 02/06/2001 | US6182958 Fixture for securing a component to a heat sink |
| 02/06/2001 | US6182829 I.C. carrier insert |
| 02/06/2001 | US6182358 Process for producing a metal-ceramic substrate |
| 02/01/2001 | WO2001008460A1 Thermally-coupled heat dissipation apparatus for electronic devices |
| 02/01/2001 | WO2001008459A1 Electronic assembly comprising a sole plate forming a heat sink |
| 02/01/2001 | WO2001008439A1 Mobile station supervision of the forward dedicated control channel when in the discontinuous transmission mode |
| 02/01/2001 | WO2001008290A1 Lc oscillator |