| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/20/2001 | US6191020 Conductive interconnection for semiconductor integrated circuit and method of forming the same |
| 02/20/2001 | US6191017 Method of forming a multi-layered dual-polysilicon structure |
| 02/20/2001 | US6190986 Method of producing sulithographic fuses using a phase shift mask |
| 02/20/2001 | US6190985 Practical way to remove heat from SOI devices |
| 02/20/2001 | US6190978 Method for fabricating lateral RF MOS devices with enhanced RF properties |
| 02/20/2001 | US6190946 Fabricating method of semiconductor package |
| 02/20/2001 | US6190945 Integrated heat sink |
| 02/20/2001 | US6190944 Stacked package for semiconductor device and fabrication method thereof, and apparatus for making the stacked package |
| 02/20/2001 | US6190943 Chip scale packaging method |
| 02/20/2001 | US6190939 Method of manufacturing a warp resistant thermally conductive circuit package |
| 02/20/2001 | US6190938 Cross grid array package structure and method of manufacture |
| 02/20/2001 | US6190926 Yield enhancement technique for integrated circuit processing to reduce effects of undesired dielectric moisture retention and subsequent hydrogen out-diffusion |
| 02/20/2001 | US6190787 Epoxy resin compositions for encapsulating semiconductors, and semiconductor devices |
| 02/20/2001 | US6190786 Epoxy resin composition and resin-encapsulated semiconductor device |
| 02/20/2001 | US6190737 Metalized elastomers |
| 02/20/2001 | US6190509 Blend of dielectric and electroconductive particles; applying electromagnetic waves |
| 02/20/2001 | US6190493 Thin-film multilayer wiring board and production thereof |
| 02/20/2001 | US6190135 Cover for a fan |
| 02/20/2001 | US6189771 Method of forming solder bump and method of mounting the same |
| 02/20/2001 | US6189766 Zero stress bonding of silicon carbide to diamond |
| 02/20/2001 | US6189762 Apparatus and method of clamping semiconductor devices using sliding finger supports |
| 02/20/2001 | US6189602 Electronic device with improved heat dissipation |
| 02/20/2001 | US6189601 Heat sink with a heat pipe for spreading of heat |
| 02/20/2001 | US6189213 Method for manufacturing cooling unit comprising heat pipes and cooling unit |
| 02/20/2001 | US6189209 Layer of titanium is formed covering the walls of the via and extending onto one of the pair of electrically conductive layers. |
| 02/16/2001 | CA2312128A1 Mmic-to-waveguide rf transition and associated method |
| 02/15/2001 | WO2001011677A1 Method for manufacturing semiconductor device |
| 02/15/2001 | WO2001011669A1 Salicide process for mosfet integrated circuit |
| 02/15/2001 | WO2001011662A2 Vapor phase connection techniques |
| 02/15/2001 | WO2001011661A2 Passive electrical components formed on carbon coated insulating substrates |
| 02/15/2001 | WO2001010958A1 Highly acid-resistant, hydration-resistant magnesium oxide particles and resin compositions |
| 02/15/2001 | WO2001010955A1 Epoxy resin composition and semiconductor device |
| 02/15/2001 | WO2001010926A1 Transparent liquid resin material for smt-enabled led-applications at higher temperatures and higher luminosities |
| 02/15/2001 | WO2001010718A1 A wafer-level micro-cap package and method of manufacturing the same |
| 02/15/2001 | WO2000059029A3 Method and apparatus for enabling conventional wire bonding to copper-based bond pad features |
| 02/15/2001 | WO2000028664A8 Fully integrated tuner architecture |
| 02/15/2001 | DE19937284A1 Electrically conducting multi layered structure comprises a first layer made of a metal material, especially chromium and a second layer made of gold or gold alloy applied on the first layer by PVD |
| 02/15/2001 | DE19936605A1 Transparente Gießharzmasse für SMT-fähige LED-Anwendungen mit hoher Temperatur und hohen Helligkeiten oder Leuchtstärken Transparent casting resin for SMT-compatible LED applications with high temperature and high brightness or lighting levels |
| 02/15/2001 | DE19738118C2 Montageverfahren für ein Halbleiterbauelement A mounting method of a semiconductor device |
| 02/14/2001 | EP1076414A2 Surface-acoustic-wave device for flip-chip mounting |
| 02/14/2001 | EP1076361A2 Chip assembly module of bump connection type using a multi-layer printed circuit substrate |
| 02/14/2001 | EP1075209A1 Analyte monitoring device and methods of use |
| 02/14/2001 | CN2419686Y Heat radiator with multiple stage structure |
| 02/14/2001 | CN1283871A 半导体器件和存储器模块 Semiconductor devices and memory modules |
| 02/13/2001 | US6188582 Flexible interconnection between integrated circuit chip and substrate or printed circuit board |
| 02/13/2001 | US6188579 Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage |
| 02/13/2001 | US6188578 Integrated circuit package with multiple heat dissipation paths |
| 02/13/2001 | US6188577 Protective device for central processing unit |
| 02/13/2001 | US6188575 Heat exchanging chassis and method |
| 02/13/2001 | US6188297 Low-EMI circuit board and low-EMI cable connector |
| 02/13/2001 | US6188233 Method for determining proximity effects on electrical characteristics of semiconductor devices |
| 02/13/2001 | US6188136 Semiconductor device including a wiring layer having a non-doped or high resistivity polycrystal silicon portion |
| 02/13/2001 | US6188135 Copper interconnect with top barrier layer |
| 02/13/2001 | US6188133 Semiconductor with plurality of connecting parts arranged on lower surface of a substrate |
| 02/13/2001 | US6188132 Two-wavelength semiconductor laser diode package for use on the read/write head of an optical drive capable of reading different types of optical discs |
| 02/13/2001 | US6188131 Clip for retaining a heatsink onto an electronic component |
| 02/13/2001 | US6188130 Exposed heat spreader with seal ring |
| 02/13/2001 | US6188129 Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer |
| 02/13/2001 | US6188126 Vertical interconnect process for silicon segments |
| 02/13/2001 | US6188125 Via formation in polymeric materials |
| 02/13/2001 | US6188124 Semiconductor arrangement preventing damage during contact processing |
| 02/13/2001 | US6188123 Semiconductor element having vertical discrete bipolar transistor and semiconductor device having same |
| 02/13/2001 | US6188109 Semiconductor device having a sense electrode |
| 02/13/2001 | US6188098 Semiconductor device and method of manufacturing the same |
| 02/13/2001 | US6188092 Solid imaging device having an antifuse element and method of making the same |
| 02/13/2001 | US6188021 Package stack via bottom leaded plastic (BLP) packaging |
| 02/13/2001 | US6187686 High degree of etching selectivity between the platinum layer and the mask layer can thus be achieved thereby reducing sidewall erosion and residue generation. |
| 02/13/2001 | US6187683 Method for final passivation of integrated circuit |
| 02/13/2001 | US6187680 Method/structure for creating aluminum wirebound pad on copper BEOL |
| 02/13/2001 | US6187678 High density integrated circuit packaging with chip stacking and via interconnections |
| 02/13/2001 | US6187677 Integrated circuitry and methods of forming integrated circuitry |
| 02/13/2001 | US6187671 Method of forming semiconductor device having minute contact hole |
| 02/13/2001 | US6187662 Semiconductor device with low permittivity interlayer insulating film and method of manufacturing the same |
| 02/13/2001 | US6187660 Method of making an embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias |
| 02/13/2001 | US6187658 Bond pad for a flip chip package, and method of forming the same |
| 02/13/2001 | US6187656 CVD-based process for manufacturing stable low-resistivity poly-metal gate electrodes |
| 02/13/2001 | US6187632 Anneal technique for reducing amount of electronic trap in gate oxide film of transistor |
| 02/13/2001 | US6187615 Chip scale packages and methods for manufacturing the chip scale packages at wafer level |
| 02/13/2001 | US6187614 Electronic component, method for making the same, and lead frame and mold assembly for use therein |
| 02/13/2001 | US6187612 Molded ball grid array package mold die |
| 02/13/2001 | US6187611 Monolithic surface mount semiconductor device and method for fabricating same |
| 02/13/2001 | US6187610 Flexible thin film ball grid array containing solder mask |
| 02/13/2001 | US6187601 Plastic encapsulated IC package and method of designing same |
| 02/13/2001 | US6187418 Multilayer ceramic substrate with anchored pad |
| 02/13/2001 | US6187412 Silicon article having columns and method of making |
| 02/13/2001 | US6187121 Die-bonding equipment and a method for detecting residual adhesive material using the same |
| 02/13/2001 | US6187114 Solder material and electronic part using the same |
| 02/13/2001 | US6186779 Wafer clamp for a heater assembly |
| 02/13/2001 | US6186768 Heat exchanger of a porous, reinforcing recrystallized silicon carbide having pores filled with an infiltration metal of magnesium, zinc, iron, aluminum or copper or their alloys; dielectric diamond coating; low thermal expansion |
| 02/13/2001 | US6186389 Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices |
| 02/13/2001 | US6186008 Semiconductor sensor component |
| 02/13/2001 | CA2237819C A micromagnetic device for power processing applications and method of manufacture therefor |
| 02/08/2001 | WO2001055277A1 Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same |
| 02/08/2001 | WO2001010000A1 Universal energy conditioning interposer with circuit architecture |
| 02/08/2001 | WO2001009953A1 Lead frame with downset die pad |
| 02/08/2001 | WO2001009952A2 Interconnect assemblies and methods |
| 02/08/2001 | WO2001009951A1 Semiconductor device and heat sink fixing device |
| 02/08/2001 | WO2001009950A1 Semiconductor package unit |
| 02/08/2001 | WO2001009949A1 Apparatus and methods of reinforcement of lead bonding in microelectronic packages |
| 02/08/2001 | WO2001009948A1 Dual wafer attachment process |