| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/06/2001 | US6197616 Method of fabricating semiconductor device |
| 03/06/2001 | US6197615 Method of producing lead frame having uneven surfaces |
| 03/06/2001 | US6197613 Wafer level packaging method and devices formed |
| 03/06/2001 | US6197481 Oxidizing surface of blank wafer and etching zero layer alignment pattern into wafer at first and second chip sites; depositing photoresist, exposing with circuit pattern; removing exposed photoresit |
| 03/06/2001 | US6197435 Substrate |
| 03/06/2001 | US6197222 Lead free conductive composites for electrical interconnections |
| 03/06/2001 | US6197218 Phosphor spherical particles of yttrium-gadolinium borate, zinc silicate, barium magnesium aluminate and barium aluminate in a liquid vehicle to be applied to a substrate; flat panel displays, e.g. plasma type; fluorescent lighting elements |
| 03/06/2001 | US6196849 Method and apparatus for aligning an integrated circuit chip |
| 03/06/2001 | US6196443 Pb-In-Sn tall C-4 for fatigue enhancement |
| 03/06/2001 | US6196307 High performance heat exchanger and method |
| 03/06/2001 | US6196302 Heat sink with multi-layer dispersion space |
| 03/06/2001 | US6196300 Heat sink |
| 03/06/2001 | US6196299 Mechanical assembly for regulating the temperature of an electronic device which incorporates a heat exchanger that contacts an entire planar face on the device except for its corners |
| 03/06/2001 | US6196096 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 03/06/2001 | US6196003 Computer enclosure cooling unit |
| 03/06/2001 | US6196002 Ball grid array package having thermoelectric cooler |
| 03/06/2001 | US6195893 Method of manufacture of heat exchange unit |
| 03/06/2001 | US6195880 Strap spring for attaching heat sinks to circuit boards |
| 03/01/2001 | WO2001015508A2 Integrated emi shield utilizing a hybrid edge |
| 03/01/2001 | WO2001015290A1 Solid-state laser cooling |
| 03/01/2001 | WO2001015231A1 Wiring board, semiconductor device, method of manufacturing semiconductor device, circuit board and electronic device |
| 03/01/2001 | WO2001015230A1 Electronic device |
| 03/01/2001 | WO2001015229A1 Stacked via with especially designed landing pad for integrated semiconductor structures |
| 03/01/2001 | WO2001015228A1 Wiring board, method of manufacturing wiring board, electronic device, method of manufacturing electronic device, circuit board and electronic apparatus |
| 03/01/2001 | WO2001015227A1 Microbeam assembly and associated method for integrated circuit interconnection to substrates |
| 03/01/2001 | WO2001015226A1 Lead frame structure for the fabrication of hybrid semiconductor devices |
| 03/01/2001 | WO2001015225A1 A combined heat sink/electromagnetic shield |
| 03/01/2001 | WO2001015224A1 Method for protecting integrated circuit chips by depositing a thin insulation layer |
| 03/01/2001 | WO2001015220A1 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes |
| 03/01/2001 | WO2001015219A2 Method for producing an integrated circuit having at least one metalicized surface |
| 03/01/2001 | WO2001015217A2 Method for producing a semiconductor chip with an electrical property that can be adjusted after the silicon process |
| 03/01/2001 | WO2001015216A1 Semiconductor device and method of manufacture thereof |
| 03/01/2001 | WO2001015208A2 Process for fabricating electronic devices having a thermally conductive substrate |
| 03/01/2001 | WO2001015076A1 Method for making a mini-smart card |
| 03/01/2001 | DE19940035A1 Manufacture of integrated inductor which reduces energy loss through underlying silicon substrate |
| 03/01/2001 | DE19939825A1 Component with optically recognizable marker for precision installation and assembly of electronic chips or components, has at least one constant shape marker in the form of a pointed, rounded or flattened feature |
| 03/01/2001 | DE10033610A1 Semiconductor device for invertor, has contact probe which press contacts with current carrier of control electrode and collector substrate, based on which control signal is transmitted |
| 03/01/2001 | DE10017383A1 Halbleitervorrichtung Semiconductor device |
| 02/28/2001 | EP1079439A1 Process for packaging a detector chip and a semiconductor device or package |
| 02/28/2001 | EP1079434A2 Power device packaging structure |
| 02/28/2001 | EP1079433A2 Ball grid array package having two ground levels |
| 02/28/2001 | EP1079432A1 Electronic module and method of manufacturing such a module |
| 02/28/2001 | EP1079431A2 Encapsulation process for components with cavities and cavity producing process |
| 02/28/2001 | EP1079430A2 A method of manufacturing a semiconductor device |
| 02/28/2001 | EP1079427A2 Encapsulated electronic part and method of fabricating thereof |
| 02/28/2001 | EP1079260A2 Electro-optical device |
| 02/28/2001 | EP1079004A2 Aluminium-neodymium etch process with hydrogen iodide |
| 02/28/2001 | EP1078451A1 Electronic component |
| 02/28/2001 | EP1078401A1 Power mos transistor with overtemperature protection circuit |
| 02/28/2001 | EP1078399A1 Method of manufacturing a leadframe assembly |
| 02/28/2001 | EP1078398A1 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink |
| 02/28/2001 | EP1078397A1 Method for metallizing an electric component and electric component |
| 02/28/2001 | CN2421735Y Fastener for radiator |
| 02/28/2001 | CN2421734Y Combined heat radiating device |
| 02/28/2001 | CN2421733Y Clad heat transfer pipe radiator |
| 02/28/2001 | CN2421732Y Radiator fastener |
| 02/28/2001 | CN1285656A Conductive cap, electronic assembly and method for forming insulation film of conductive cap |
| 02/28/2001 | CN1285620A Semiconductor device |
| 02/28/2001 | CN1285619A Electronic parts and making method thereof |
| 02/28/2001 | CN1285613A Electronic element without lead pin and method for making the same |
| 02/28/2001 | CN1285537A CPU heat-sink for personal computer |
| 02/28/2001 | CN1285526A Electro-optical device |
| 02/28/2001 | CN1285261A Abrading tool |
| 02/28/2001 | CN1062680C Method for making semiconductor device |
| 02/27/2001 | US6195742 Semiconductor multi-chip module |
| 02/27/2001 | US6195268 Stacking layers containing enclosed IC chips |
| 02/27/2001 | US6195267 Gel structure for combined EMI shielding and thermal control of microelectronic assemblies |
| 02/27/2001 | US6195264 Laminate substrate having joining layer of photoimageable material |
| 02/27/2001 | US6195260 Flexible printed circuit board unit having electronic parts mounted thereon |
| 02/27/2001 | US6195256 Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink |
| 02/27/2001 | US6194987 Inductance device |
| 02/27/2001 | US6194789 Flexible hermetic sealing |
| 02/27/2001 | US6194787 Multistage coupling semiconductor carrier, semiconductor device using the semiconductor carrier |
| 02/27/2001 | US6194786 Integrated circuit package providing bond wire clearance over intervening conductive regions |
| 02/27/2001 | US6194784 Self-aligned contact process in semiconductor fabrication and device therefrom |
| 02/27/2001 | US6194782 Mechanically-stabilized area-array device package |
| 02/27/2001 | US6194781 Semiconductor device and method of fabricating the same |
| 02/27/2001 | US6194780 Tape automated bonding method and bonded structure |
| 02/27/2001 | US6194779 Plastic mold type semiconductor device |
| 02/27/2001 | US6194778 Semiconductor package with improved cross talk and grounding, and method of manufacturing same |
| 02/27/2001 | US6194777 Leadframes with selective palladium plating |
| 02/27/2001 | US6194774 Inductor including bonding wires |
| 02/27/2001 | US6194767 X-ROM semiconductor memory device |
| 02/27/2001 | US6194757 Semiconductor device having contact hole and method of manufacturing the same |
| 02/27/2001 | US6194750 Integrated circuit comprising means for high frequency signal transmission |
| 02/27/2001 | US6194739 Inline ground-signal-ground (GSG) RF tester |
| 02/27/2001 | US6194669 Solder ball grid array for connecting multiple millimeter wave assemblies |
| 02/27/2001 | US6194668 Multi-layer circuit board |
| 02/27/2001 | US6194491 Biphenyl epoxy resin, naphthalene-containing phenolic resin and accelerator triphenylphosphine/p-benzoquinone |
| 02/27/2001 | US6194318 Manufacturing multiple layered structures of large scale integrated semiconductor devices |
| 02/27/2001 | US6194311 Method for manufacturing semiconductor device capable of effectively carrying out hydrogen passivation |
| 02/27/2001 | US6194310 Method of forming amorphous conducting diffusion barriers |
| 02/27/2001 | US6194309 Method for forming contact |
| 02/27/2001 | US6194308 Method of forming wire line |
| 02/27/2001 | US6194304 Semiconductor device and method of fabricating the same |
| 02/27/2001 | US6194291 Microelectronic assemblies with multiple leads |
| 02/27/2001 | US6194251 Die positioning in integrated circuit packaging |
| 02/27/2001 | US6194250 Low-profile microelectronic package |
| 02/27/2001 | US6194249 Method of assembly stress protection |
| 02/27/2001 | US6194247 Warp-resistent ultra-thin integrated circuit package fabrication method |