H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2013
11/07/2013	US20130293253 Contactless Wafer Probing with Improved Power Supply
11/07/2013	US20130292856 Method for the wafer-level integration of shape memory alloy wires
11/07/2013	US20130292855 Method for Housing an Electronic Component in a Device Package and an Electronic Component Housed in the Device Package
11/07/2013	US20130292854 Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
11/07/2013	US20130292852 Chip embedded packages and methods for forming a chip embedded package
11/07/2013	US20130292851 Semiconductor Device and Method of Forming TSV Semiconductor Wafer with Embedded Semiconductor Die
11/07/2013	US20130292850 Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant
11/07/2013	US20130292849 System-in packages
11/07/2013	US20130292848 Semiconductor packages including molding layers
11/07/2013	US20130292847 Semiconductor Devices and Methods of Manufacturing the Same
11/07/2013	US20130292846 Semiconductor package
11/07/2013	US20130292845 Stacked semiconductor package and method for manufacturing the same
11/07/2013	US20130292844 Semiconductor package
11/07/2013	US20130292843 Semiconductor chip and stacked semiconductor package having the same
11/07/2013	US20130292842 Stacked semiconductor package
11/07/2013	US20130292841 Semiconductor interconnect structure
11/07/2013	US20130292839 Porous silicon material
11/07/2013	US20130292838 Package-on-package interconnect stiffener
11/07/2013	US20130292837 Passivation for wafer level - chip-scale package devices
11/07/2013	US20130292836 Via-free interconnect structure with self-aligned metal line interconnections
11/07/2013	US20130292835 Conformal low temperature hermetic dielectric diffusion barriers
11/07/2013	US20130292834 Microelectronic assembly with joined bond elements having lowered inductance
11/07/2013	US20130292833 Semiconductor device and method of fabricating the same
11/07/2013	US20130292832 Semiconductor package and fabrication method thereof
11/07/2013	US20130292831 Methods and Apparatus for Package on Package Devices
11/07/2013	US20130292830 Interposer Having a Defined Through Via Pattern
11/07/2013	US20130292829 Semiconductor Package with Embedded Die
11/07/2013	US20130292828 Stacked semiconductor packages
11/07/2013	US20130292827 Pillar Structure having a Non-Planar Surface for Semiconductor Devices
11/07/2013	US20130292826 Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby
11/07/2013	US20130292825 Chip package and method for forming the same
11/07/2013	US20130292824 Connection of a chip provided with through vias
11/07/2013	US20130292823 Stack of semiconductor structures and corresponding manufacturing method
11/07/2013	US20130292822 Bump structure, semiconductor package having the bump structure, and method of forming the bump structure
11/07/2013	US20130292821 Conductive structure and method for forming the same
11/07/2013	US20130292820 Electronic device packages including bump buffer spring pads and methods of manufacturing the same
11/07/2013	US20130292819 Chip-on-film device
11/07/2013	US20130292818 Semiconductor chip, semiconductor package having the same, and stacked semiconductor package using the semiconductor package
11/07/2013	US20130292817 Structure and method for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits
11/07/2013	US20130292816 Clad material for insulating substrates
11/07/2013	US20130292815 Semiconductor device and method of manufacturing the same
11/07/2013	US20130292814 Integrated power converter package with die stacking
11/07/2013	US20130292813 Multi-chip flip chip package and manufacturing method thereof
11/07/2013	US20130292812 Lead frame for semiconductor device and semiconductor device package using the lead frame
11/07/2013	US20130292811 Leadframe having selective planishing
11/07/2013	US20130292810 Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements
11/07/2013	US20130292809 Semiconductor package
11/07/2013	US20130292808 Semiconductor package integrated with conformal shield and antenna
11/07/2013	US20130292804 Semiconductor Device and Method of Forming a Shielding Layer over a Semiconductor Die Disposed in a Cavity of an Interconnect Structure and Grounded Through the Die TSV
11/07/2013	US20130292803 Chip structure and wafer structure
11/07/2013	US20130292727 Lead frame for optical semiconductor device and optical semiconductor device using the same
11/07/2013	US20130292684 Semiconductor Package and Methods of Formation Thereof
11/07/2013	US20130292603 Graphite filled polyester compositions
11/07/2013	US20130292096 Heat dissipating fan and fan wheel
11/07/2013	US20130291523 Cooling System for Diesel Emissions Fluid Injector
11/07/2013	DE102013206900A1 Halbleiterbauelement mit kernlosem Übertrager A semiconductor device comprising coreless transformer
11/07/2013	DE102013104487A1 Verfahren zum Herstellen eines Chipgehäuses A method of manufacturing a chip housing
11/07/2013	DE102013104463A1 Chip-Einbettungsgehäuse und Verfahren zum Bilden eines Chip-Einbettungsgehäuses Chip embedding housing and method of forming a chip embedding housing
11/07/2013	DE102013104337A1 Halbleitergehäuse und Verfahren zu seiner Herstellung Semiconductor package and method for its preparation
11/07/2013	DE102012224356A1 Semiconductor device has terminals having planar portions that are extended in direction from interior of semiconductor device to outer side of device
11/07/2013	DE102012223136A1 Halbleitervorrichtung und Kühlsystem für die Halbleitervorrichtung Semiconductor device and cooling system for the semiconductor device
11/07/2013	DE102012219568B3 Power semiconductor module manufacturing method, involves connecting semiconductor components with two conductors, respectively, and breaking insulant body along recesses that extend between connection and utilizable regions
11/07/2013	DE102012218868B3 Power semiconductor module has first and second power semiconductor components that are arranged on common side with respect to first and second direct current (DC) voltage load power connection elements
11/07/2013	DE102012217905B3 3-Level-Stromrichterhalbbrücke 3-level inverter half bridge
11/07/2013	DE102012207560A1 Method for manufacturing semiconductor module, involves preparing electrically conductive bonded connection between metallization layer and end of terminal element by arc welding and by generating electric arc
11/07/2013	DE102012207519A1 Verfahren zum herstellen eines bauelementträgers, einer elektronischen anordnung und einer strahlungsanordnung und bauelementträger, elektronische anordnung und strahlungsanordnung Method of manufacturing a component-carrier, an electronic arrangement and a radiation arrangement and component-makers, electronic assembly and radiation arrangement
11/07/2013	DE102012207501A1 Halbleiterschichtenstruktur Semiconductor layer structure
11/07/2013	DE102012207229A1 Elektronisches Bauelement und Verfahren zum Herstellen eines elektronischen Bauelements An electronic device and method for fabricating an electronic device
11/07/2013	DE102012206587A1 Lotmaterial, Verfahren zu dessen Herstellung und seine Verwendung zum drucklosen Fügen metallischer Substrate Solder material, process for its preparation and its use for joining metallic substrates unpressurized
11/07/2013	DE102012108665A1 Halbleiterverbindungsstruktur Compound semiconductor structure
11/07/2013	DE102012103430A1 Verfahren zum Heften von Chips auf ein Substrat Method for stitching of chips on a substrate
11/07/2013	DE102012001769B4 Gebondete gestapelte wafer Bonded wafer stacked
11/07/2013	DE102011113677A1 Aluminum assembly board for heat generating elements utilized in inverter for photovoltaic application, has lateral and open flow channels formed with slats or bars, which comprise guiding groove that is formed in anchored base
11/07/2013	DE102011079569B4 Leistungs- oder Stromverteilungssystem eines Flugzeuges mit einer aktiven Transistor-Klemmschaltung sowie zugehöriges Verfahren zum aktiven Pegelhalten Performance or power distribution system of an aircraft with a transistor active clamp circuit and associated method for keeping active level
11/06/2013	EP2661156A1 Circuit board for semiconductor module
11/06/2013	EP2660884A1 Light-emitting apparatus and method of manufacturing thereof
11/06/2013	EP2660862A2 Microelectronic wireless transmission device
11/06/2013	EP2660263A1 Curable epoxy resin composition
11/06/2013	EP2659509A1 Cooling device for electronic components and control apparatus comprising the cooling device
11/06/2013	EP2659508A1 Heat dissipation device and method
11/06/2013	CN203278624U IGBT drive circuit with protection time-delay
11/06/2013	CN203277503U Radiating fin structure and radiating device of electronic component
11/06/2013	CN203277453U Metal rack for protection module packaging of photovoltaic cell
11/06/2013	CN203277379U Bus bar connecting type high-performance IGBT module
11/06/2013	CN203277378U A double-chip power diode with TO packaging
11/06/2013	CN203277377U DRAM (dynamic random access memory) double-chip stack packaging structure
11/06/2013	CN203277376U A multi-wafer packaging structure
11/06/2013	CN203277375U Novel wafer level silicon substrate radio frequency inductance structure
11/06/2013	CN203277374U 半导体器件 Semiconductor devices
11/06/2013	CN203277373U Self-protection transistor
11/06/2013	CN203277372U 一种igbt模块封装件 One kind igbt module package
11/06/2013	CN203277371U Semiconductor device and semiconductor assembly
11/06/2013	CN203277370U 半导体器件 Semiconductor devices
11/06/2013	CN203277369U Integrated circuit device and circuitry system
11/06/2013	CN203277368U Packaging substrate
11/06/2013	CN203277367U 半导体装置 Semiconductor device
11/06/2013	CN203277366U J-shaped surface-mounted pin circuit module
11/06/2013	CN203277365U TO-220 frame characterized by separation of aluminum substrate and copper substrate
11/06/2013	CN203277364U TO-220 welding foot framework structure
11/06/2013	CN203277363U Forward direction series-connection diode framework structure

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