| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/20/2001 | US6204073 Shallow trench isolation with conductive hard mask for in-line moat/trench width electrical measurements |
| 03/20/2001 | US6203967 Method for controlling stress in thin film layers deposited over a high density interconnect common circuit base |
| 03/20/2001 | US6203931 Lead frame material and process for manufacturing the same |
| 03/20/2001 | US6203929 Gold plated solder material and method of fluxless soldering using solder |
| 03/20/2001 | US6203926 Corrosion resistant multilayer metal structure with cushionsand diffusion barriers then gold layer and encapsulation |
| 03/20/2001 | US6203912 Thin film of triazine fluoropolymers by trimerization of cyano groups with fluoropolymers |
| 03/20/2001 | US6203891 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias |
| 03/20/2001 | US6203869 Hydrogen getters and methods for fabricating sealed microelectronic packages employing same |
| 03/20/2001 | US6203690 Process of reworking pin grid array chip carriers |
| 03/20/2001 | US6203655 Thin electronic circuit component and method and apparatus for producing the same |
| 03/20/2001 | US6202739 Apparatus including a heat-dissipating apparatus, and method for forming same |
| 03/20/2001 | US6202738 Assembled structure having an enlarged heat transfer area for heat radiation therefrom |
| 03/20/2001 | US6202299 Semiconductor chip connection components with adhesives and methods of making same |
| 03/20/2001 | US6202298 Microelectronic connections with liquid conductive elements |
| 03/15/2001 | WO2001019153A1 Electronic device with heat generating parts and heat absorbing parts |
| 03/15/2001 | WO2001019149A1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 03/15/2001 | WO2001019148A1 Printed wiring board and method of producing the same |
| 03/15/2001 | WO2001018864A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 03/15/2001 | WO2001018863A1 Method for manufacturing fusible links in a semiconductor device |
| 03/15/2001 | WO2001018862A1 Electronic micromodule and method for making and incorporating same to produce portable devices |
| 03/15/2001 | WO2001018860A2 Improved apparatus and methods for integrated circuit planarization |
| 03/15/2001 | WO2001018115A1 Epoxy resin composition and semiconductor device |
| 03/15/2001 | WO2001017957A1 Prostaglandin e analogues |
| 03/15/2001 | WO2000079582A9 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 03/15/2001 | WO2000075964A3 Method of fabricating semiconductor device employing copper interconnect structure |
| 03/15/2001 | WO2000061834A8 Low dielectric mano-porous material obtainable from polymer decomposition |
| 03/15/2001 | US20010000032 Microelectronic element bonding with deformation of leads in rows |
| 03/15/2001 | DE19942915A1 Leistungshalbleitermodul The power semiconductor module |
| 03/15/2001 | DE19940758A1 Verfahren zur Herstellung eines HF-FET und HF-FET A process for the preparation of a FET RF and HF-FET |
| 03/15/2001 | DE19939852A1 Stacked Via mit besonders ausgebildetem Landing Pad für integrierte Halbleiterstrukturen Via Stacked with specially trained Landing Pad for integrated semiconductor structures |
| 03/15/2001 | DE19939774A1 Festkörperlaser (Scheibenlaser) mit direktem Kontakt des aktiven Mediums zu einer Kühlmittelflüssigkeit Solid-state laser (laser disc) with direct contact of the active medium to a coolant fluid |
| 03/15/2001 | DE19926499A1 Anordnung von Fuses bei Halbleiterstrukturen mit Cu-Metallisierung Arrangement of fuses in semiconductor structures with Cu metallization |
| 03/15/2001 | DE10019250A1 Bipolarer Hochfrequenztransistor Radio-frequency bipolar transistor |
| 03/15/2001 | CA2384463A1 Improved apparatus and methods for integrated circuit planarization |
| 03/15/2001 | CA2384164A1 Electronic device with heat generating parts and heat absorbing parts |
| 03/15/2001 | CA2384148A1 Prostaglandin e analogues |
| 03/14/2001 | EP1083605A2 Field effect transistor with double sided airbridge |
| 03/14/2001 | EP1083602A2 Lead frame and resin package and photoelectron device using the same |
| 03/14/2001 | EP1083601A2 Micromachined silicon beam interconnect |
| 03/14/2001 | EP1083600A2 Multilayered circuit substrate |
| 03/14/2001 | EP1083599A2 Power semiconductor module |
| 03/14/2001 | EP1083596A1 A method to create a copper dual damascene structure with less dishing and erosion |
| 03/14/2001 | EP1083595A1 Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same |
| 03/14/2001 | EP1083594A2 Fired body for and manufacture of a substrate |
| 03/14/2001 | EP1083578A1 Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate |
| 03/14/2001 | EP1082777A1 Wideband rf port structure using coplanar waveguide and bga i/o |
| 03/14/2001 | EP1082762A1 Laminated integrated circuit package |
| 03/14/2001 | EP1082757A1 Semiconductor device with transparent link area for silicide applications and fabrication thereof |
| 03/14/2001 | EP1027732A4 Monolithic inductor |
| 03/14/2001 | EP0958608A4 A fiducial for aligning an integrated circuit die |
| 03/14/2001 | EP0627104B1 Contacting device for a chip card |
| 03/14/2001 | CN1287688A Semiconductor device, method of manufacture thereof, circuit board and electronic equipment |
| 03/14/2001 | CN1287687A Semiconductor device and manufacturing method thereof, semiconductor module, circuit board and electronic equipment |
| 03/14/2001 | CN1287471A Element mounting base plate and its producing method |
| 03/14/2001 | CN1287385A Technological process of lowering the junction temperature of semiconductor power device |
| 03/14/2001 | CN1287382A Semiconductor apparatus and its mounting structure |
| 03/14/2001 | CN1287140A Electroconductive thick film paste and its producing process and laminated ceramic electronic element |
| 03/14/2001 | CN1287139A Sealing material composition for cards and process for producing cards therewith |
| 03/14/2001 | CN1287035A High-strength welding head |
| 03/13/2001 | US6202191 Electromigration resistant power distribution network |
| 03/13/2001 | US6201707 Wiring substrate used for a resin-sealing type semiconductor device and a resin-sealing type semiconductor device structure using such a wiring substrate |
| 03/13/2001 | US6201699 Transverse mountable heat sink for use in an electronic device |
| 03/13/2001 | US6201697 Heat sink assembly with cam lock |
| 03/13/2001 | US6201696 Package for semiconductor power device and method for assembling the same |
| 03/13/2001 | US6201695 Heat sink for chip stacking applications |
| 03/13/2001 | US6201682 Thin-film component |
| 03/13/2001 | US6201679 Integrated electrical overload protection device and method of formation |
| 03/13/2001 | US6201454 Compensation structure for a bond wire at high frequency operation |
| 03/13/2001 | US6201411 Programmable integrated circuit having metal plate capacitors that provide local switching energy |
| 03/13/2001 | US6201309 Thermoplastic material for sealing a semiconductor element, semiconductor device sealed by the material, and the process for manufacturing the same |
| 03/13/2001 | US6201308 Semiconductor chip having a low-noise ground line |
| 03/13/2001 | US6201307 Ceramics for wiring boards and method of producing the same |
| 03/13/2001 | US6201305 Making solder ball mounting pads on substrates |
| 03/13/2001 | US6201304 Flip chip adaptor package for bare die |
| 03/13/2001 | US6201303 Method of forming a local interconnect with improved etch selectivity of silicon dioxide/silicide |
| 03/13/2001 | US6201302 Semiconductor package having multi-dies |
| 03/13/2001 | US6201301 Low cost thermally enhanced flip chip BGA |
| 03/13/2001 | US6201300 Printed circuit board with thermal conductive structure |
| 03/13/2001 | US6201299 Substrate structure of BGA semiconductor package |
| 03/13/2001 | US6201298 Semiconductor device using wiring tape |
| 03/13/2001 | US6201297 Semiconductor device |
| 03/13/2001 | US6201296 Semiconductor chip with protection against analyzing |
| 03/13/2001 | US6201295 Plate-shaped external storage device and method of producing the same |
| 03/13/2001 | US6201294 Ball grid array semiconductor package comprised of two lead frames |
| 03/13/2001 | US6201292 Resin-sealed semiconductor device, circuit member used therefor |
| 03/13/2001 | US6201291 Semiconductor device and method of manufacturing such a device |
| 03/13/2001 | US6201289 Method of manufacturing an inductor |
| 03/13/2001 | US6201287 Monolithic inductance-enhancing integrated circuits, complementary metal oxide semiconductor (CMOS) inductance-enhancing integrated circuits, inductor assemblies, and inductance-multiplying methods |
| 03/13/2001 | US6201286 Multilayer wiring substrate for hybrid integrated circuit and method for manufacturing the same |
| 03/13/2001 | US6201285 Sensor with diaphragm sensor chip |
| 03/13/2001 | US6201283 Field effect transistor with double sided airbridge |
| 03/13/2001 | US6201266 Semiconductor device and method for manufacturing the same |
| 03/13/2001 | US6201186 Electronic component assembly and method of making the same |
| 03/13/2001 | US6201185 Substrate for mounting electronic part having conductive projections and process for manufacturing the same |
| 03/13/2001 | US6200912 Mixing silica sol containing silanol condensate particulates which contains fluorine-silicon bonds or organic group silicon bonds with silicon alkoxide; supplying silica sol mixture to semiconductor substrate; thermally treating |
| 03/13/2001 | US6200895 Method of forming an electrical connection |
| 03/13/2001 | US6200894 Method for enhancing aluminum interconnect properties |
| 03/13/2001 | US6200892 Method for forming an integrated circuit interconnect using a dual poly process |
| 03/13/2001 | US6200889 Semiconductor bonding pad |
| 03/13/2001 | US6200874 Methods for use in forming a capacitor |