| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/27/2001 | CA2242152C Poly fuses in cmos integrated circuits |
| 03/22/2001 | WO2001020962A1 Spray cooling system |
| 03/22/2001 | WO2001020955A1 A printed circuit board assembly |
| 03/22/2001 | WO2001020713A1 Method and apparatus for cooling with a phase change material and heat pipes |
| 03/22/2001 | WO2001020691A1 Conductive structure based on poly-3,4-alkenedioxythiophene (pedot) and polystyrenesulfonic acid (pss) |
| 03/22/2001 | WO2001020676A1 Flip chip having integral mask and underfill providing two-stage bump formation |
| 03/22/2001 | WO2001020675A1 Heat sink including heat receiving surface with protruding portion |
| 03/22/2001 | WO2001020673A1 A method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple |
| 03/22/2001 | WO2001020672A1 Protective layer for a semiconductor device |
| 03/22/2001 | WO2001020671A1 Semiconductor wafer level package |
| 03/22/2001 | WO2001020670A1 Connection arrangement for enabling the use of identical chips in 3-dimensional stacks of chips requiring addresses specific to each chip |
| 03/22/2001 | WO2001020669A2 Use of additional bonding finger rows to improve wire bond density |
| 03/22/2001 | WO2001020668A2 AN INTEGRATED RF MxN SWITCH MATRIX |
| 03/22/2001 | WO2001020665A1 Method for producing a copper connection |
| 03/22/2001 | WO2001020661A1 Semiconductor wafer with anisotropic conductor film, and method of manufacture thereof |
| 03/22/2001 | WO2001020660A1 Method of mounting optical and electrical devices, and mounting structure |
| 03/22/2001 | WO2001020658A1 Wafer coating method for flip chips |
| 03/22/2001 | WO2001020657A1 Heat sink manufacturing device and manufacturing method |
| 03/22/2001 | WO2001020649A1 Reducing the coupling between the semiconductor substrate and a coil integrated thereon |
| 03/22/2001 | WO2001020646A2 Fill strategies in the optical kerf |
| 03/22/2001 | WO2001020644A2 Method and apparatus for encapsulating semiconductor chips |
| 03/22/2001 | WO2001019889A1 Highly stable packaging substrates and brominated indane derivatives |
| 03/22/2001 | US20010000053 Chip stack-type semiconductor package and method for fabricating the same |
| 03/22/2001 | DE19940759A1 Schaltungsanordnung und Verfahren zu deren Herstellung Circuit arrangement and method for their preparation |
| 03/22/2001 | DE19940512A1 Verfahren zur Verkappung eines Bauelementes mit einer Kavernenstruktur und Verfahren zur Herstellung der Kavernenstruktur A method for capping a component having a cavity structure and process for producing the cavity structure |
| 03/22/2001 | DE10033977A1 Intermediate coupling structure for mounting semiconductor chip on printed circuit board has conductor paths between contact pads and bonding pads on opposite sides of dielectric body |
| 03/22/2001 | DE10015698C1 Semiconductor device has additional marking detected for increasing overly alignment of photomask employed during exposure step of semiconductor manufacture |
| 03/22/2001 | CA2384962A1 Highly stable packaging substrates and brominated indane derivatives |
| 03/22/2001 | CA2384784A1 Protective layer for a semiconductor device |
| 03/22/2001 | CA2350199A1 Heat sink manufacturing device and manufacturing method |
| 03/22/2001 | CA2349833A1 Heat sink including heat receiving surface with protruding portion |
| 03/21/2001 | EP1085594A2 High frequency circuit apparatus |
| 03/21/2001 | EP1085573A1 Method of decreasing the mutual inductance between bond wires in a high frequency amplifying circuit |
| 03/21/2001 | EP1085572A2 Low pass filter integral with semiconductor package |
| 03/21/2001 | EP1085571A1 Method for increasing device reliability of a BGA package |
| 03/21/2001 | EP1085570A2 Chip scale surface mount package for semiconductor device and process of fabricating the same |
| 03/21/2001 | EP1085569A2 Chip scale surface mount packages for semiconductor device and process of fabricating the same |
| 03/21/2001 | EP1085568A1 Method for the electrical and mechanical interconnection of microelectronic components |
| 03/21/2001 | EP1085566A1 Method and apparatus for partially encapsulating semiconductor chips |
| 03/21/2001 | EP1085565A2 Semiconductor device having sealing film formed on the surface having columnar electrodes thereon and method of manufacturing the same |
| 03/21/2001 | EP1085563A2 Process for etching an insulating layer and forming a semiconductor device |
| 03/21/2001 | EP1085561A1 Chip scale surface mount package for semiconductor device and process of fabricating the same |
| 03/21/2001 | EP1085399A1 Software-based temperature controller circuit in an electronic apparatus |
| 03/21/2001 | EP1085279A2 Electromagnetic wave-activated sorption refrigeration system |
| 03/21/2001 | EP1085278A2 Electromagnetic wave-activated sorption refrigeration system |
| 03/21/2001 | EP1084598A1 System, method and apparatus for purging fluid |
| 03/21/2001 | EP1084513A1 A method for treating a deposited film for resistivity reduction |
| 03/21/2001 | EP1084482A1 Method for producing an integrated circuit card and card produced according to said method |
| 03/21/2001 | EP1084029A2 Electronic devices having thermodynamic encapsulant portions predominating over thermostatic encapsulant portions |
| 03/21/2001 | CN1288591A Semiconductor device and method of prodn. thereof and semiconductor mounting structure and method |
| 03/21/2001 | CN1288481A Curable epoxy-based compositions |
| 03/21/2001 | CN1288261A Lead-frame and resin sealing member with same, and photoelectronic device |
| 03/21/2001 | CN1288260A Assembled frame for water cooling semi-condustor device |
| 03/21/2001 | CN1288258A Semiconductor device and mfg. method therefor |
| 03/21/2001 | CN1288257A Semiconductor device chip scale surface assembling and packaging, and mfg. method therefor |
| 03/21/2001 | CN1288256A Semiconductor device chip scale surface assembling and packaging, and mfg. method therefor |
| 03/21/2001 | CN1288255A Semiconductor device chip scale surface assembling and packaging, and mfg. method therefor |
| 03/21/2001 | CN1288253A Etching insulating layer and mfg. semiconductor device process |
| 03/21/2001 | CN1063579C Semiconductor device |
| 03/20/2001 | US6205032 Low temperature co-fired ceramic with improved registration |
| 03/20/2001 | US6205027 Structure and method for mounting a circuit module |
| 03/20/2001 | US6205026 Heat sink retention components and system |
| 03/20/2001 | US6205025 Heat sink structure adapted for use in a computer |
| 03/20/2001 | US6205023 Cooling arrangement comprising for a heat source a heat sink movable on an external sink |
| 03/20/2001 | US6205013 Multi-layer metallization capacitive structure for reduction of the simultaneous switching noise in integrated circuits |
| 03/20/2001 | US6204567 Semiconductor device with circuit cell array and arrangement on a semiconductor chip |
| 03/20/2001 | US6204566 Resin encapsulated electrode structure of a semiconductor device, mounted semiconductor devices, and semiconductor wafer including multiple electrode structures |
| 03/20/2001 | US6204565 Support substrate having conductive interconnection pattern; photosensitive adhesive bump |
| 03/20/2001 | US6204563 Semiconductor device |
| 03/20/2001 | US6204562 Wafer-level chip scale package |
| 03/20/2001 | US6204561 Semiconductor device having two-layer contact |
| 03/20/2001 | US6204559 Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking |
| 03/20/2001 | US6204558 Two ball bump |
| 03/20/2001 | US6204557 Reduction of topside movement during temperature cycles |
| 03/20/2001 | US6204556 Structure for and method of mounting image taking element on substrate |
| 03/20/2001 | US6204555 Microwave-frequency hybrid integrated circuit |
| 03/20/2001 | US6204554 Surface mount semiconductor package |
| 03/20/2001 | US6204553 Lead frame structure |
| 03/20/2001 | US6204552 Semiconductor device |
| 03/20/2001 | US6204549 Overvoltage protection device |
| 03/20/2001 | US6204548 Fuse for semiconductor device and semiconductor device |
| 03/20/2001 | US6204455 Microelectronic component mounting with deformable shell terminals |
| 03/20/2001 | US6204454 Wiring board and process for the production thereof |
| 03/20/2001 | US6204448 High frequency microwave packaging having a dielectric gap |
| 03/20/2001 | US6204356 Polybenzoxazole resin and precursor thereof |
| 03/20/2001 | US6204305 Polymer blend of (i) a high surface energy polymer and (ii) a low surface energy organosilicon polymer; surface of the article is exposed to ozone and ultraviolet radiation to form a diffusion barrier. |
| 03/20/2001 | US6204303 Uv curable acrylate material, catalyst, hydrocarbon solvent and conductive filler. |
| 03/20/2001 | US6204201 Method of processing films prior to chemical vapor deposition using electron beam processing |
| 03/20/2001 | US6204192 Plasma cleaning process for openings formed in at least one low dielectric constant insulation layer over copper metallization in integrated circuit structures |
| 03/20/2001 | US6204179 Copper diffusion barrier, aluminum wetting layer and improved methods for filling openings in silicon substrates with copper |
| 03/20/2001 | US6204167 Method of making a multi-level interconnect having a refractory metal wire and a degassed oxidized, TiN barrier layer |
| 03/20/2001 | US6204165 Practical air dielectric interconnections by post-processing standard CMOS wafers |
| 03/20/2001 | US6204162 Production of semiconductor device |
| 03/20/2001 | US6204161 Self aligned contact pad in a semiconductor device and method for forming the same |
| 03/20/2001 | US6204095 Method of forming overmolded chip scale package and resulting product |
| 03/20/2001 | US6204091 Method of assembling a semiconductor chip package |
| 03/20/2001 | US6204089 Method for forming flip chip package utilizing cone shaped bumps |
| 03/20/2001 | US6204076 Semiconductor device with unbreakable testing elements for evaluating components and process of fabrication thereof |
| 03/20/2001 | US6204075 Method of detecting defects in a wiring process |
| 03/20/2001 | US6204074 Chip design process for wire bond and flip-chip package |