| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/03/2001 | US6210992 Controlling packaging encapsulant leakage |
| 04/03/2001 | US6210988 Polycrystalline silicon germanium films for forming micro-electromechanical systems |
| 04/03/2001 | US6210811 Improved heat resistance, improved moisture resistance, low stress property |
| 04/03/2001 | US6210637 Corrosion resistance after heating for improved long term reliability of contact bonded to the aluminum electrodes of semiconductor device |
| 04/03/2001 | US6210604 For x-ray image intensifiers |
| 04/03/2001 | US6210548 Apparatus for partially removing plating films of leadframe |
| 04/03/2001 | US6210175 Socket rails for stacking integrated circuit components |
| 04/03/2001 | US6210118 Thin motor-driven centrifugal blowing fan apparatus |
| 04/03/2001 | US6210068 Computer central processing unit heat dissipation device latching structure |
| 04/03/2001 | US6209790 Data medium in card form and lead frame for use in such a data medium |
| 04/03/2001 | US6209626 Heat pipe with pumping capabilities and use thereof in cooling a device |
| 04/03/2001 | US6209623 Post mounted heat sink method and apparatus |
| 03/29/2001 | WO2001022501A1 Electronic component and coating agent |
| 03/29/2001 | WO2001022491A1 Semiconductive chip having a bond pad located on an active device |
| 03/29/2001 | WO2001022490A1 Selective cooling of partial surfaces pertaining to a flat electronic component |
| 03/29/2001 | WO2001022489A2 Control device, particularly for use in automotive engineering |
| 03/29/2001 | WO2001022488A1 Grid array electronic component, wire reinforcing method for the same, and method of manufacturing the same |
| 03/29/2001 | WO2001021697A1 Epoxy resin composition and resin encapsulation type semiconductor device |
| 03/29/2001 | WO2001021393A1 Thermally conductive materials in a hydrophobic compound for thermal management |
| 03/29/2001 | WO2000067316A3 Method for producing a portable electronic device with an integrated circuit protected by a photosensitive resin |
| 03/29/2001 | US20010000080 A chip having electrodes, an interconnect layer, a conducting layer and an underlying metal layer larger peripherally than the conducting one, and a resin layer formed around the conducting layer; soldering; thermal stress relieving |
| 03/29/2001 | DE19946255A1 Gleichrichteranordnung Rectifier arrangement |
| 03/29/2001 | DE19945855A1 High inductance micro-coil constructed on substrate, useful at higher currents is formed using additive- or doping technology with diamond or diamond-like material in insulator |
| 03/28/2001 | EP1087440A2 Modeling technique to increase device reliability |
| 03/28/2001 | EP1087439A2 Rectifier assembly for an alternator of a motor vehicle |
| 03/28/2001 | EP1087434A2 Semiconductor device of the flip-chip type and method for manufacturing same |
| 03/28/2001 | EP1087431A2 Method and apparatus for forming a sputtered doped seed layer |
| 03/28/2001 | EP1086807A2 Metal article coated with multilayer surface finish for porosity reduction |
| 03/28/2001 | EP1086492A1 Method for making a micromodule and a storage medium comprising such a micromodule |
| 03/28/2001 | EP0983612A4 A thermal conducting trench in a semiconductor structure and method for forming the same |
| 03/28/2001 | CN2425477Y Radiator fastening device |
| 03/28/2001 | CN1289453A Anisotropic conductor film, semiconductor chip, and method of packaging |
| 03/28/2001 | CN1289147A Semiconductor device packaged by resin |
| 03/28/2001 | CN1289146A Semiconductor and method for producing same |
| 03/28/2001 | CN1289145A Radiating pin for integrated circuit and its manufacture |
| 03/28/2001 | CN1289143A Semiconductor device and production technology thereof |
| 03/28/2001 | CN1063849C Integrated circuit carrier |
| 03/28/2001 | CA2321371A1 Process for manufacturing heat sink |
| 03/27/2001 | US6208947 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture |
| 03/27/2001 | US6208546 Memory module |
| 03/27/2001 | US6208525 Process for mounting electronic device and semiconductor device |
| 03/27/2001 | US6208521 Film carrier and laminate type mounting structure using same |
| 03/27/2001 | US6208519 Thermally enhanced semiconductor package |
| 03/27/2001 | US6208518 Fastening device for a heat sink |
| 03/27/2001 | US6208517 Heat sink |
| 03/27/2001 | US6208513 Independently mounted cooling fins for a low-stress semiconductor package |
| 03/27/2001 | US6208210 Advanced hybrid power amplifier design |
| 03/27/2001 | US6208032 Semiconductor device and fabrication method thereof |
| 03/27/2001 | US6208031 Circuit fabrication using a particle filled adhesive |
| 03/27/2001 | US6208030 Semiconductor device having a low dielectric constant material |
| 03/27/2001 | US6208029 Integrated circuit device with reduced cross talk |
| 03/27/2001 | US6208027 Temporary interconnect for semiconductor devices |
| 03/27/2001 | US6208025 Microelectronic component with rigid interposer |
| 03/27/2001 | US6208024 Microelectronic mounting with multiple lead deformation using restraining straps |
| 03/27/2001 | US6208023 Lead frame for use with an RF powered semiconductor |
| 03/27/2001 | US6208022 Electronic-circuit assembly |
| 03/27/2001 | US6208021 Semiconductor device, manufacturing method thereof and aggregate type semiconductor device |
| 03/27/2001 | US6208020 Leadframe for use in manufacturing a resin-molded semiconductor device |
| 03/27/2001 | US6208017 Semiconductor device with lead-on-chip structure |
| 03/27/2001 | US6208016 Integrated circuit of an oxidation-resistant polymeric layer supporting conductive structure(s) of zirconium, hafnium, tantalum, and/or titanium with gold, silver, and/or copper which are electrically coupled to transistor(s) |
| 03/27/2001 | US6208015 Interlevel dielectric with air gaps to lessen capacitive coupling |
| 03/27/2001 | US6207987 Semiconductor device having smooth surface for suppressing layer displacement |
| 03/27/2001 | US6207986 Semiconductor integrated circuit device |
| 03/27/2001 | US6207980 Layout method of a semiconductor device |
| 03/27/2001 | US6207966 Mark protection with transparent film |
| 03/27/2001 | US6207905 Glass-ceramic composition, circuit substrate using the same and manufacture method thereof |
| 03/27/2001 | US6207903 Via transitions for use as micromachined circuit interconnects |
| 03/27/2001 | US6207892 System and method for sealing high density electronic circuits |
| 03/27/2001 | US6207789 Containing a dinaphthyltetrahydropyran compound |
| 03/27/2001 | US6207595 Laminate and method of manufacture thereof |
| 03/27/2001 | US6207585 Method of forming stacked insulating film and semiconductor device using the same |
| 03/27/2001 | US6207568 Ionized metal plasma (IMP) method for forming (111) oriented aluminum containing conductor layer |
| 03/27/2001 | US6207559 Method of making a semiconductor device for attachment to a semiconductor substrate |
| 03/27/2001 | US6207558 For improved via fill in high aspect ratio sub-micron apertures at low temperature, particularly at the contact level on a substrate. |
| 03/27/2001 | US6207555 Electron beam process during dual damascene processing |
| 03/27/2001 | US6207550 Method for fabricating bump electrodes with a leveling step for uniform heights |
| 03/27/2001 | US6207549 Method of forming a ball bond using a bonding capillary |
| 03/27/2001 | US6207548 Method for fabricating a micromachined chip scale package |
| 03/27/2001 | US6207547 Bond pad design for integrated circuits |
| 03/27/2001 | US6207546 Prevent passivation from keyhole damage and resist extrusion by a crosslinking mechanism |
| 03/27/2001 | US6207529 Semiconductor wafer,wafer alignment patterns and method of forming wafer alignment patterns |
| 03/27/2001 | US6207521 Thin-film resistor employed in a semiconductor wafer and its method formation |
| 03/27/2001 | US6207479 Place and route method for integrated circuit design |
| 03/27/2001 | US6207478 Method for manufacturing semiconductor package of center pad type device |
| 03/27/2001 | US6207477 Semiconductor device having a ball grid array and a fabrication process thereof |
| 03/27/2001 | US6207476 Methods of packaging an integrated circuit and methods of forming an integrated circuit package |
| 03/27/2001 | US6207473 Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and IC card |
| 03/27/2001 | US6207467 Multi-chip module with stacked dice |
| 03/27/2001 | US6207298 Connector surface-treated with a Sn-Ni alloy |
| 03/27/2001 | US6207296 Inorganic filler, epoxy resin composition, and semiconductor device |
| 03/27/2001 | US6207288 Conductive composition chemically bonded to substrate |
| 03/27/2001 | US6207222 Depositing barrier layer on exposed surfaces of dielectric layer, chemical vapor depositing first conductive material on barrier layer, annealing first conductive material, plating second conductive material on annealed layer, planarizing |
| 03/27/2001 | US6207221 Applying copper foil using direct copper bonding process to one side of ceramic layer as first metal coating, forming second coating by applying conductor paste which contains metal of second metal coating, binder, glass, drying, firing |
| 03/27/2001 | US6206985 A1 alloy films and melting A1 alloy sputtering targets for depositing A1 alloy films |
| 03/27/2001 | US6206087 Heat sink fan |
| 03/27/2001 | US6205799 Spray cooling system |
| 03/27/2001 | US6205796 Sub-dew point cooling of electronic systems |
| 03/27/2001 | US6205662 Method of producing a built-up heat exchanger and product thereof |
| 03/27/2001 | US6205660 Method of making an electronic contact |
| 03/27/2001 | US6205654 Method of manufacturing a surface mount package |