| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/18/2001 | EP1093164A1 Lateral high-Q inductor for semiconductor devices |
| 04/18/2001 | EP1093163A2 Electronic interconnect structure |
| 04/18/2001 | EP1093162A1 Hermatic firewall for mems packaging in flip-chip bonded geometry |
| 04/18/2001 | EP1093161A1 Method and composite arrangement inhibiting corrosion of a metal layer following chemical mechanical polishing |
| 04/18/2001 | EP1093159A1 Method for encapsulating electronic components |
| 04/18/2001 | EP1092739A1 Epoxy resin composition and uses thereof |
| 04/18/2001 | EP1092340A1 Cooling system for a power electronic unit for operating at least one electrical group of a motor vehicle |
| 04/18/2001 | EP1092339A1 Molded housing with integral heatsink |
| 04/18/2001 | EP1092338A1 Assembly of an electronic component with spring packaging |
| 04/18/2001 | EP1092239A1 Field effect transistors, integrated circuitry, methods of forming field effect transistor gates, and methods of forming integrated circuitry |
| 04/18/2001 | EP1092237A1 Method of severing electrically conductive links with ultraviolet laser output |
| 04/18/2001 | EP1092234A1 Porous insulating compounds and method for making same |
| 04/18/2001 | EP0946980A4 Improved integrated circuit structures and methods to facilitate accurate measurement of the ic devices |
| 04/18/2001 | CN1292153A Bipolar transistor with insulated gate electrode |
| 04/18/2001 | CN1292151A Vertically integrated circuit system |
| 04/18/2001 | CN1292150A Low-inductance gate-controlled thyristor |
| 04/18/2001 | CN1292092A Method for controlling IC handler and control system using same |
| 04/18/2001 | CN1292019A Polyarylene sulfide resin composition for electronic part encapsulation |
| 04/18/2001 | CN1291791A Metal wire fused wire structure possessing cavity body |
| 04/18/2001 | CN1291790A Crack baffle plate between adjecent fuse wires to prevent burning break of fuse wire |
| 04/18/2001 | CN1291789A Manufacturing method of lead-wire frame and resin sealing type semiconductor device |
| 04/18/2001 | CN1291788A Radiator |
| 04/18/2001 | CN1064780C Bottom lead semiconductor chip stack package |
| 04/17/2001 | US6219789 Microprocessor with coprocessing capabilities for secure transactions and quick clearing capabilities |
| 04/17/2001 | US6219364 Semiconductor laser module having improved metal substrate on peltier element |
| 04/17/2001 | US6219254 Chip-to-board connection assembly and method therefor |
| 04/17/2001 | US6219253 Molded electronic package, method of preparation using build up technology and method of shielding |
| 04/17/2001 | US6219248 Heat sink alignment apparatus and method |
| 04/17/2001 | US6219246 Heat sink apparatus |
| 04/17/2001 | US6219245 Electrically isolated power switching device mounting assembly for EMI reduction |
| 04/17/2001 | US6219244 Securing fixture for a heat sink for a CPU |
| 04/17/2001 | US6219243 Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units |
| 04/17/2001 | US6219238 Structure for removably attaching a heat sink to surface mount packages |
| 04/17/2001 | US6219237 Structure and method for an electronic assembly |
| 04/17/2001 | US6219236 Cooling system for multichip module |
| 04/17/2001 | US6219215 Chip thermal protection device |
| 04/17/2001 | US6218889 Semiconductor integrated circuit device, and method of manufacturing the same |
| 04/17/2001 | US6218865 Semiconductor device having function blocks with obliquely arranged signal terminals connected through two-dimensionally extensible signal lines |
| 04/17/2001 | US6218855 Datapath global routing using flexible pins for side exiting buses |
| 04/17/2001 | US6218849 Device for detecting proper mounting of an IC for testing in an IC testing apparatus |
| 04/17/2001 | US6218736 Circuit board and semiconductor device, and method of manufacturing the same |
| 04/17/2001 | US6218735 Process to improve adhesion of cap layers in intergrated circuits |
| 04/17/2001 | US6218734 Copper adhered to a diffusion barrier surface |
| 04/17/2001 | US6218733 Semiconductor device having a titanium-aluminum compound |
| 04/17/2001 | US6218732 Copper bond pad process |
| 04/17/2001 | US6218731 Tiny ball grid array package |
| 04/17/2001 | US6218730 Apparatus for controlling thermal interface gap distance |
| 04/17/2001 | US6218729 Apparatus and method for an integrated circuit having high Q reactive components |
| 04/17/2001 | US6218728 Mold-BGA-type semiconductor device and method for making the same |
| 04/17/2001 | US6218726 Built-in stress pattern on IC dies and method of forming |
| 04/17/2001 | US6218722 Antifuse based on silicided polysilicon bipolar transistor |
| 04/17/2001 | US6218721 Semiconductor device and method of manufacturing the same |
| 04/17/2001 | US6218694 Semiconductor memory device and method for manufacturing same |
| 04/17/2001 | US6218685 Semiconductor device and method for fabricating the same |
| 04/17/2001 | US6218631 Structure for reducing cross-talk in VLSI circuits and method of making same using filled channels to minimize cross-talk |
| 04/17/2001 | US6218628 Foil circuit boards and semifinished products and method for the manufacture thereof |
| 04/17/2001 | US6218610 Structure for shielding an electronic circuit from radio waves |
| 04/17/2001 | US6218302 Method for forming a semiconductor device |
| 04/17/2001 | US6218287 Method of fabricating a semiconductor structure |
| 04/17/2001 | US6218283 Method of fabricating a multi-layered wiring system of a semiconductor device |
| 04/17/2001 | US6218282 Method of forming low dielectric tungsten lined interconnection system |
| 04/17/2001 | US6218279 Vertical fuse and method of fabrication |
| 04/17/2001 | US6218272 Method for fabricating conductive pad |
| 04/17/2001 | US6218263 Method of forming an alignment key on a semiconductor wafer |
| 04/17/2001 | US6218262 Semiconductor device and method of manufacturing the same |
| 04/17/2001 | US6218248 Semiconductor device and method for fabricating the same |
| 04/17/2001 | US6218223 Process for producing electrode for semiconductor element and semiconductor device having the electrode |
| 04/17/2001 | US6218218 Method for reducing gate oxide damage caused by charging |
| 04/17/2001 | US6218216 Transverse hybrid LOC package |
| 04/17/2001 | US6218214 Integrated circuit package for flip chip and method of forming same |
| 04/17/2001 | US6218213 Microelectronic components with frangible lead sections |
| 04/17/2001 | US6218202 Semiconductor device testing and burn-in methodology |
| 04/17/2001 | US6218200 Multi-layer registration control for photolithography processes |
| 04/17/2001 | US6218199 Silicon substrate with identification data |
| 04/17/2001 | US6218049 Metal oxide |
| 04/17/2001 | US6217990 Multilayer circuit board having no local warp on mounting surface thereof |
| 04/17/2001 | US6217989 Conductive line features for enhanced reliability of multi-layer ceramic substrates |
| 04/17/2001 | US6217949 Marking a semiconductor and exposure to energy |
| 04/17/2001 | US6217821 Applying conductive material to green ceramic tape |
| 04/17/2001 | US6217721 Filling plug having high aspect ratio by precoating interior of plug hole or other aperture with liner layer deposited by physical vapor deposition utilizing high-density plasma |
| 04/17/2001 | US6217343 Multipoint conductive sheet |
| 04/17/2001 | US6217213 Temperature sensing systems and methods |
| 04/17/2001 | US6216771 Method and apparatus for arranging heat transport |
| 04/17/2001 | CA2154833C Metallized ceramic substrate having smooth plating layer and method for producing the same |
| 04/15/2001 | CA2322978A1 Hermatic firewall for mems packaging in flip-chip bonded geometry |
| 04/12/2001 | WO2001026432A1 Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment |
| 04/12/2001 | WO2001026162A1 Photo-interrupter and semiconductor device using it |
| 04/12/2001 | WO2001026155A1 Semiconductor device, method and device for producing the same, circuit board, and electronic equipment |
| 04/12/2001 | WO2001026154A1 Die pad crack absorption integrated circuit chip and fabrication process |
| 04/12/2001 | WO2001026153A1 Method of bonding a plurality of thermally conductive elements to a substrate |
| 04/12/2001 | WO2001026152A1 Semiconductor device |
| 04/12/2001 | WO2001026151A1 Method for insulating an integrated circuit chip by substance deposit on the active surface |
| 04/12/2001 | WO2001026150A1 System and method for repairing interconnect links |
| 04/12/2001 | WO2001026147A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 04/12/2001 | WO2001026146A1 Semiconductor device and method of manufacture thereof |
| 04/12/2001 | WO2001026145A1 Seed layers for interconnects and methods and apparatus for their fabrication |
| 04/12/2001 | WO2001024967A1 Method for soft soldering of components and a soft soldered device |
| 04/12/2001 | US20010000210 Method of improving parallelism of a die to package using a modified lead frame |
| 04/12/2001 | US20010000199 Method and apparatus for manufacturing a semiconductor integrated circuit |
| 04/12/2001 | DE19950026A1 Leistungshalbleitermodul The power semiconductor module |