| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/12/2001 | DE19947914A1 Verfahren zum Weichlöten von Komponenten und weichgelötete Anordnung A method for soft soldering of components and assembly weichgelötete |
| 04/12/2001 | DE19945131A1 Elektronisches Bauelement und Beschichtungs-Mittel Electronic component and coating agent |
| 04/12/2001 | DE10043014A1 Heat sink for electronic elements has base with vertical pillars in which air flows around pillars |
| 04/12/2001 | DE10031951A1 Multiple chip semiconducting module has adhesive layers with openings coinciding with contact points, conducting bodies for connecting between first and second chip contact points |
| 04/12/2001 | DE10022982A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 04/12/2001 | CA2322933A1 Heat sink devices for use in electronic devices |
| 04/11/2001 | EP1091627A1 Process for providing electrical connections on the surface of a semiconductor package using electrical connection bumps |
| 04/11/2001 | EP1091499A1 Microwave module |
| 04/11/2001 | EP1091407A1 Overvoltage protection device for a semiconductor device |
| 04/11/2001 | EP1091406A2 Multilayer Interconnection board for semiconductor device, method of forming the same and mounting the semiconductor chip thereon |
| 04/11/2001 | EP1091404A1 Multifunction lead frame and integrated circuit package incorporating the same |
| 04/11/2001 | EP1091403A2 Heat sink |
| 04/11/2001 | EP1091402A2 Process for manufacturing heat sink |
| 04/11/2001 | EP1091401A2 Semiconductor device package and process for production |
| 04/11/2001 | EP1091399A1 Semiconductor device and method for manufacturing the same |
| 04/11/2001 | EP1091398A1 IC-package with bonding wire inductor and bonding method |
| 04/11/2001 | EP1091371A2 Aqueous dispersion for electrodeposition, high dielectric constant film and electronic parts |
| 04/11/2001 | EP1091016A2 Self ionized plasma for sputtering copper |
| 04/11/2001 | EP1091009A2 Alloy for electrical contacts and electrodes and method of making |
| 04/11/2001 | EP1090942A1 Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same |
| 04/11/2001 | EP1090423A1 Thin film capacitor element with protection elements |
| 04/11/2001 | EP1090419A1 Device and method for forming a device having a cavity with controlled atmosphere |
| 04/11/2001 | EP1090057A1 Reworkable thermosetting resin compositions |
| 04/11/2001 | EP1089874A1 LOW $g(k) DIELECTRIC INORGANIC/ORGANIC HYBRID FILMS AND METHOD OF MAKING |
| 04/11/2001 | CN1291375A Process for manufacturing an Electronic component, in particular a surface wave component working with acoustic surface wave |
| 04/11/2001 | CN1291352A Integrated circuit with capacity element |
| 04/11/2001 | CN1291350A Gettering device for ion capture |
| 04/11/2001 | CN1291348A Semiconductor device |
| 04/11/2001 | CN1290963A Lead frame and its electroplating method |
| 04/11/2001 | CN1290962A Electronic device, its producing method and its producing device |
| 04/11/2001 | CN1290961A Custum made lid for improving heat property of module by inverse mounting |
| 04/11/2001 | CN1290940A Low resistivity tantalum |
| 04/11/2001 | CN1290722A Aromatic polysulphone resin composition and its moulded product |
| 04/10/2001 | WO2001073843A1 Semiconductor device |
| 04/10/2001 | US6216055 Partial semiconductor wafer processing |
| 04/10/2001 | US6215682 Semiconductor power converter and its applied apparatus |
| 04/10/2001 | US6215681 Bus bar heat sink |
| 04/10/2001 | US6215670 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 04/10/2001 | US6215662 Circuit board with interleaved TO-220 heat sinks |
| 04/10/2001 | US6215401 Non-laminated coating for radio frequency transponder (RF tag) |
| 04/10/2001 | US6215377 Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format |
| 04/10/2001 | US6215322 Conventionally sized temporary package for testing semiconductor dice |
| 04/10/2001 | US6215197 Semiconductor device having a trench isolation structure and an alignment mark area |
| 04/10/2001 | US6215196 Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals |
| 04/10/2001 | US6215192 Integrated circuit package and integrated circuit package control system |
| 04/10/2001 | US6215191 Compliant lead structures for microelectronic devices |
| 04/10/2001 | US6215189 Semiconductor device having interconnect layer and method of manufacturing therefor |
| 04/10/2001 | US6215186 System and method of forming a tungstein plug |
| 04/10/2001 | US6215185 Power semiconductor module |
| 04/10/2001 | US6215184 Optimized circuit design layout for high performance ball grid array packages |
| 04/10/2001 | US6215182 Semiconductor device and method for producing the same |
| 04/10/2001 | US6215181 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
| 04/10/2001 | US6215180 Dual-sided heat dissipating structure for integrated circuit package |
| 04/10/2001 | US6215179 Semiconductor device |
| 04/10/2001 | US6215178 Semiconductor device |
| 04/10/2001 | US6215177 Tape under frame for conventional-type IC package assembly |
| 04/10/2001 | US6215176 Dual leadframe package |
| 04/10/2001 | US6215175 Semiconductor package having metal foil die mounting plate |
| 04/10/2001 | US6215174 Lead frame, mold for producing a resin-sealed semiconductor device, resin-sealed semiconductor device using such a lead frame |
| 04/10/2001 | US6215173 Redundancy fuse block having a small occupied area |
| 04/10/2001 | US6215171 IC module |
| 04/10/2001 | US6215169 Semiconductor device with adhesive tape not overlapping an opening in the uppermost surface of the semiconductor element surface |
| 04/10/2001 | US6215167 Power semiconductor device employing field plate and manufacturing method thereof |
| 04/10/2001 | US6215166 Radio frequency electronic device and method for regulating an amount of power delivered to a radio frequency electronic device |
| 04/10/2001 | US6215158 Device and method for forming semiconductor interconnections in an integrated circuit substrate |
| 04/10/2001 | US6215157 Electrostatic discharge protection circuit for a semiconductor integrated circuit and layout thereof |
| 04/10/2001 | US6215130 Thin film transistors |
| 04/10/2001 | US6215129 Via alignment, etch completion, and critical dimension measurement method and structure |
| 04/10/2001 | US6215063 Radio frequency component and method of making same |
| 04/10/2001 | US6214905 Encapsulating semiconductors |
| 04/10/2001 | US6214904 Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device |
| 04/10/2001 | US6214749 Process for producing semiconductor devices |
| 04/10/2001 | US6214748 Dielectric multilayer thin films with resins |
| 04/10/2001 | US6214742 Construction of semiconductors layer of interlayer dielectric, wherein the metal structures have a layer of tin formed on the surface of the metal |
| 04/10/2001 | US6214731 Forming opening in dielectric layer, lining with barrier metal layer, treating exposed surface of lining with silane or dichlorosilane to form thin layer of silicon, depositing layer of copper or copper alloy, reacting to form copper silicide |
| 04/10/2001 | US6214730 Fluorine barrier layer between conductor and insulator for degradation prevention |
| 04/10/2001 | US6214728 Forming hole in insulation layer down to doped silicon substrate surface, forming metal diffusion barrier on walls and bottom of hole, filling with copper to predetermined depth, depositing encapsulating metal to fill hole, polishing |
| 04/10/2001 | US6214723 Method of manufacturing a semiconductor device |
| 04/10/2001 | US6214722 Method for improving wafer topography to provide more accurate transfer of interconnect patterns |
| 04/10/2001 | US6214714 Forming titanium film on substrate, forming intermediate layer comprising silicon on titanium film, forming titanium nitride film on intermediate layer, wherein intermediate layer protects titanium film from chemical attack during process |
| 04/10/2001 | US6214663 Methods of fabricating integrated circuit devices having contact pads which are separated by sidewall spacers |
| 04/10/2001 | US6214648 Semiconductor chip package and method for fabricating the same |
| 04/10/2001 | US6214647 Method for bonding heatsink to multiple-height chip |
| 04/10/2001 | US6214645 Method of molding ball grid array semiconductor packages |
| 04/10/2001 | US6214641 Method of fabricating a multi-chip module |
| 04/10/2001 | US6214640 Method of manufacturing a plurality of semiconductor packages |
| 04/10/2001 | US6214638 Bond pad functional layout on die to improve package manufacturability and assembly |
| 04/10/2001 | US6214630 Wafer level integrated circuit structure and method of manufacturing the same |
| 04/10/2001 | US6214525 Printed circuit board with circuitized cavity and methods of producing same |
| 04/10/2001 | US6214523 Laser irradiation to remove unwanted areas of green ceramic paste pad positioned onto green ceramic substrate to write a label pattern, then sintering |
| 04/10/2001 | US6214455 Bisphenol a epoxy resin, novolak epoxy resin, reactive phosphoric acid ester, curing agent of nitrogen-containing phenolic resin prepared by the co-condensation of a phenolic compound, a guanamine compound, and an aldehyde compound |
| 04/10/2001 | US6214446 Resin film and a method for connecting electronic parts by the use thereof |
| 04/10/2001 | US6214445 Printed wiring board that has built-in capacitor in vicinity of an integrated circuit chip to be mounted thereon; simplified fabrication; minimizing loss due to defective capacitor during fabrication |
| 04/10/2001 | US6214259 Dispersion containing Cu ultrafine particles individually dispersed therein |
| 04/10/2001 | US6214180 Method for shorting pin grid array pins for plating |
| 04/10/2001 | US6214156 Semiconductor device mounted on board by flip-chip and method for mounting the same |
| 04/10/2001 | US6214152 Lead frame moisture barrier for molded plastic electronic packages |
| 04/10/2001 | US6213806 IC socket |
| 04/10/2001 | US6213803 IC socket |
| 04/10/2001 | US6213789 Method and apparatus for interconnecting devices using an adhesive |