| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/26/2001 | CA2318721A1 Process and device for the thermal conditioning of electronic components |
| 04/25/2001 | EP1094697A2 Electronic module |
| 04/25/2001 | EP1094696A2 Connector |
| 04/25/2001 | EP1094519A1 Lead frame for semiconductor device |
| 04/25/2001 | EP1094518A1 Semiconductor device comprising a lead frame and method for fabricating the same |
| 04/25/2001 | EP1094517A2 Semiconductor device and method for producing the same |
| 04/25/2001 | EP1094516A2 Thermally conductive composition and method of forming thermally conductive film with use of same |
| 04/25/2001 | EP1094515A2 Microstructure control of copper interconnects |
| 04/25/2001 | EP1094512A1 Semiconductor chip resin-sealing method and adhesive tape for pasting lead frames or the like |
| 04/25/2001 | EP1094511A2 Low profile integrated circuit packages |
| 04/25/2001 | EP1094509A2 Low dielectric constant silicon oxide-based dielectric layer for integrated circuit structures having improved compatibility with via filler materials, and method of making same |
| 04/25/2001 | EP1094508A2 Void-free low K dielectric composite layer between metal lines in integrated circuit structure |
| 04/25/2001 | EP1094506A2 Capping layer for extreme low dielectric constant films |
| 04/25/2001 | EP1094504A2 PVD-IMP tungsten and tungsten nitride as a liner, barrier, and/or seed layer |
| 04/25/2001 | EP1094503A2 Barrier layer for aluminium metallisation |
| 04/25/2001 | EP1093909A2 Composite film |
| 04/25/2001 | EP1093668A1 Semiconductor device and method of manufacturing same |
| 04/25/2001 | EP1093407A1 Method of making an adhesive preform lid for electronic devices |
| 04/25/2001 | CN2427888Y Axle tube fixing device for heat radiation fan |
| 04/25/2001 | CN1292401A Resin composition for sealing semiconductor, and semiconductor using it and manufacturing method |
| 04/25/2001 | CN1292311A Electric contactor and alloy for electrode, preparing method thereof |
| 04/25/2001 | CN1065001C Gold alloy wire and use |
| 04/24/2001 | US6223273 Electronic circuit package |
| 04/24/2001 | US6223072 Apparatus and method for collecting data useful for determining the parameters of an alert window for timing delivery of ETC signals to a heart under varying cardiac conditions |
| 04/24/2001 | US6222738 Packaging structure for a semiconductor element flip-chip mounted on a mounting board having staggered bump connection location on the pads and method thereof |
| 04/24/2001 | US6222737 Universal package and method of forming the same |
| 04/24/2001 | US6222734 Clamping heat sinks to circuit boards over processors |
| 04/24/2001 | US6222731 Heat sink and mounting structure for heat sink |
| 04/24/2001 | US6222379 Conventionally sized temporary package for testing semiconductor dice |
| 04/24/2001 | US6222378 Probe adapter for a ball-grid-array package |
| 04/24/2001 | US6222279 Solder bump fabrication methods and structures including a titanium barrier layer |
| 04/24/2001 | US6222278 Input-output circuit cell and semiconductor integrated circuit apparatus |
| 04/24/2001 | US6222276 Through-chip conductors for low inductance chip-to-chip integration and off-chip connections |
| 04/24/2001 | US6222273 System having vias including conductive spacers |
| 04/24/2001 | US6222272 Film carrier and semiconductor device using same |
| 04/24/2001 | US6222270 Integrated circuit bonding pads including closed vias and closed conductive patterns |
| 04/24/2001 | US6222269 Semiconductor device and fabrication process thereof |
| 04/24/2001 | US6222267 Semiconductor device and manufacturing thereof |
| 04/24/2001 | US6222266 Miniaturization of a semiconductor chip |
| 04/24/2001 | US6222264 Cooling apparatus for an electronic package |
| 04/24/2001 | US6222263 Chip assembly with load-bearing lid in thermal contact with the chip |
| 04/24/2001 | US6222260 Integrated circuit device with integral decoupling capacitor |
| 04/24/2001 | US6222259 Stack package and method of fabricating the same |
| 04/24/2001 | US6222258 Semiconductor device and method for producing a semiconductor device |
| 04/24/2001 | US6222256 Semiconductor device and method of manufacturing the same |
| 04/24/2001 | US6222254 Thermal conducting trench in a semiconductor structure and method for forming the same |
| 04/24/2001 | US6222246 Flip-chip having an on-chip decoupling capacitor |
| 04/24/2001 | US6222244 Electrically blowable fuse with reduced cross-sectional area |
| 04/24/2001 | US6222231 Semiconductor device of high breakdown voltage using semiconductive film and its manufacturing method |
| 04/24/2001 | US6222228 Method for reducing gate oxide damage caused by charging |
| 04/24/2001 | US6222213 Semiconductor integrated circuit device |
| 04/24/2001 | US6222151 Low profile welding fixture |
| 04/24/2001 | US6222118 Semiconductor device and method of manufacturing the same |
| 04/24/2001 | US6221790 Stable thin film oxide standard |
| 04/24/2001 | US6221765 Method for manufacturing a semiconductor device |
| 04/24/2001 | US6221762 Method for fabricating semiconductor device having improved step coverage and low resistivity contacts |
| 04/24/2001 | US6221760 Semiconductor device having a silicide structure |
| 04/24/2001 | US6221757 Method of making a microelectronic structure |
| 04/24/2001 | US6221753 Flip chip technique for chip assembly |
| 04/24/2001 | US6221751 Wafer fabrication of die-bottom contacts for electronic devices |
| 04/24/2001 | US6221750 Fabrication of deformable leads of microelectronic elements |
| 04/24/2001 | US6221749 Semiconductor device and production thereof |
| 04/24/2001 | US6221729 Method of jointly forming stacked capacitors and antifuses, method of blowing antifuses, and antifuses and stacked capacitors constituting a part of integrated circuitry |
| 04/24/2001 | US6221726 Process for fabricating device structures for real-time process control of silicon doping |
| 04/24/2001 | US6221711 Methods of electrically contacting to conductive plugs, methods of forming contact openings, and methods of forming dynamic random access memory circuitry |
| 04/24/2001 | US6221697 Chip scale package and manufacturing method thereof |
| 04/24/2001 | US6221695 Method for fabricating a compression layer on the dead frame to reduce stress defects |
| 04/24/2001 | US6221694 Method of making a circuitized substrate with an aperture |
| 04/24/2001 | US6221692 Method of fabricating solder-bearing silicon semiconductor device and circuit board mounted therewith |
| 04/24/2001 | US6221690 Semiconductor package and production method thereof |
| 04/24/2001 | US6221682 Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects |
| 04/24/2001 | US6221681 On-chip misalignment indication |
| 04/24/2001 | US6221510 Blend of epoxy resin, hardener, coupler and release agent |
| 04/24/2001 | US6221509 Containing cristobalite filler |
| 04/24/2001 | US6221507 High temperature laminated structural panels and method of producing the same |
| 04/24/2001 | US6221503 Electrode modification using an unzippable polymer paste |
| 04/24/2001 | US6221427 Interface regions between metal and ceramic in a metal/ceramic substrate |
| 04/24/2001 | US6220915 Method for manufacturing lamp tiles |
| 04/24/2001 | US6220204 Film deposition method for forming copper film |
| 04/24/2001 | US6219912 Method for manufacture electronic component device |
| 04/24/2001 | US6219911 Flip chip mounting technique |
| 04/24/2001 | US6219908 Method and apparatus for manufacturing known good semiconductor die |
| 04/21/2001 | CA2313551A1 Wafer integrated rigid support ring |
| 04/19/2001 | WO2001028303A1 Electromagnetic shield wiring structure of wiring board |
| 04/19/2001 | WO2001028003A1 Face-to-face chips |
| 04/19/2001 | WO2001027997A2 Power semiconductor module |
| 04/19/2001 | WO2001027996A1 Reconfigurable pinout ball grid array |
| 04/19/2001 | WO2001027995A1 Packaged device adapter assembly and mounting apparatus |
| 04/19/2001 | WO2001027983A1 Method and apparatus for forming interconnection |
| 04/19/2001 | WO2001026910A1 Non-contact data carrier and ic chip |
| 04/19/2001 | WO2001003186A9 Semiconductor device, method of manufacturing the same, and structure for mounting semiconductor device |
| 04/19/2001 | WO2000077827A3 Low-inductance semiconductor component |
| 04/19/2001 | DE19948570A1 Semiconductor body conductor-paths wiring arrangement |
| 04/19/2001 | DE19947021A1 EMV-optimierte On-Chip-Stromversorgung EMC optimized on-chip power supply |
| 04/19/2001 | DE19946203A1 Support structure for semiconductor type stacked fuse |
| 04/19/2001 | DE19943385A1 Production of electrical connection between front and rear sides of semiconductor chips comprises applying metal seed forming layer, radiating the metal seed forming layer and forming conducting path |
| 04/19/2001 | DE10006638A1 Semiconductor component formed for combination with substrate or support, with array substrate containing first surface with preset conductive tracks |
| 04/18/2001 | EP1093327A2 An improved method to embed passive components |
| 04/18/2001 | EP1093169A1 Method of manufacturing semiconductor device, semicondutor device, narrow pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device |
| 04/18/2001 | EP1093165A1 Integrated circuit assembly |