| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/02/2001 | CN2428866Y 叠层式散热器 Stacked radiators |
| 05/02/2001 | CN1293884A Electronic ballast with piezoelectric cooling fan |
| 05/02/2001 | CN1293774A System for cooling device in computer |
| 05/02/2001 | CN1293485A Electron element packaging method |
| 05/02/2001 | CN1293473A Adapter connector |
| 05/02/2001 | CN1293454A Integrated circuit possessing differentisl signal line balancing intorsion |
| 05/02/2001 | CN1293453A Electronics module |
| 05/02/2001 | CN1293218A Epoxy resin composition, adhesive film and preimpregnatel blank and multilayer printing circuit board |
| 05/02/2001 | CN1065259C Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same |
| 05/01/2001 | US6226782 Apparatus for automated pillar layout |
| 05/01/2001 | US6226394 Non-lot based method for assembling integrated circuit devices |
| 05/01/2001 | US6226187 Integrated circuit package |
| 05/01/2001 | US6226186 Fastener for CPU radiating module |
| 05/01/2001 | US6226185 Heat sink having anti-electromagnetic wave device |
| 05/01/2001 | US6226184 Enclosure mounted heat sink |
| 05/01/2001 | US6226183 Arrangement including a substrate for power components and a heat sink, and a method for manufacturing the arrangement |
| 05/01/2001 | US6226171 Power conducting substrates with high-yield integrated substrate capacitor |
| 05/01/2001 | US6225878 Millimeter wave module and radio apparatus |
| 05/01/2001 | US6225821 Package migration for related programmable logic devices |
| 05/01/2001 | US6225818 Integrated circuits including function identification circuits having operating modes that identify corresponding functions of the integrated circuits |
| 05/01/2001 | US6225704 Flip-chip type semiconductor device |
| 05/01/2001 | US6225703 Semiconductor device |
| 05/01/2001 | US6225702 Ball grid array to prevent shorting between a power supply and ground terminal |
| 05/01/2001 | US6225701 Semiconductor device provided with heat-sink and method of manufacturing the same |
| 05/01/2001 | US6225700 Package for a semiconductor element having depressions containing solder terminals |
| 05/01/2001 | US6225699 Chip-on-chip interconnections of varied characteristics |
| 05/01/2001 | US6225698 Method for making semiconductor devices having gradual slope contacts |
| 05/01/2001 | US6225697 Semiconductor device and method for manufacturing the same |
| 05/01/2001 | US6225696 Advanced RF electronics package |
| 05/01/2001 | US6225695 Grooved semiconductor die for flip-chip heat sink attachment |
| 05/01/2001 | US6225694 Semiconductor device |
| 05/01/2001 | US6225693 Semiconductor package for radio frequency |
| 05/01/2001 | US6225692 Flip chip package for micromachined semiconductors |
| 05/01/2001 | US6225691 Integrated circuit packaging structure |
| 05/01/2001 | US6225690 Plastic ball grid array package with strip line configuration |
| 05/01/2001 | US6225688 Stacked microelectronic assembly and method therefor |
| 05/01/2001 | US6225687 Chip package with degassing holes |
| 05/01/2001 | US6225686 Semiconductor device |
| 05/01/2001 | US6225685 Lead frame design for reduced wire sweep having a defined gap between tie bars and lead pins |
| 05/01/2001 | US6225684 Low temperature coefficient leadframe |
| 05/01/2001 | US6225683 Die size-increasing integrated circuit leads and thermally enhanced leadframe |
| 05/01/2001 | US6225681 Microelectronic interconnect structures and methods for forming the same |
| 05/01/2001 | US6225677 Inductance device formed on semiconductor substrate |
| 05/01/2001 | US6225675 Integrated circuitry, methods of fabricating integrated circuitry, methods of forming local interconnects, and methods of forming conductive lines |
| 05/01/2001 | US6225674 Semiconductor structure and method of manufacture |
| 05/01/2001 | US6225671 Method of reducing defects in anti-reflective coatings and semiconductor structures fabricated thereby |
| 05/01/2001 | US6225652 Vertical laser fuse structure allowing increased packing density |
| 05/01/2001 | US6225651 Structure with a micro-electronic component made of a semi-conductor material difficult to etch and with metallized holes |
| 05/01/2001 | US6225632 Image detection device |
| 05/01/2001 | US6225571 Heatsink with high thermal conductivity dielectric |
| 05/01/2001 | US6225569 Wiring substrate and method of manufacturing the same |
| 05/01/2001 | US6225558 Chip size semiconductor package and fabrication method thereof |
| 05/01/2001 | US6225433 Curable silicone composition and electronic components |
| 05/01/2001 | US6225418 Thermosetting resin composition |
| 05/01/2001 | US6225379 Epoxy resin composition for bonding semiconductor chips |
| 05/01/2001 | US6225377 Producing latently reactive prepolymer epoxy resin mixture powder |
| 05/01/2001 | US6225236 Method for reforming undercoating surface and method for production of semiconductor device |
| 05/01/2001 | US6225227 Method for manufacturing semiconductor device |
| 05/01/2001 | US6225226 Method for processing and integrating copper interconnects |
| 05/01/2001 | US6225218 Improve the long-term reliability of a tft or a liquid crystal display device by improving the reliability of contacts. |
| 05/01/2001 | US6225217 Method of manufacturing semiconductor device having multilayer wiring |
| 05/01/2001 | US6225206 Flip chip C4 extension structure and process |
| 05/01/2001 | US6225205 Method of forming bump electrodes |
| 05/01/2001 | US6225182 Simplified high Q inductor substrate |
| 05/01/2001 | US6225172 Integrated circuitry and method of forming a field effect transistor |
| 05/01/2001 | US6225147 Methods of forming ICS conductive lines, a conductive grid, a conductive network, an electrical interconnection to a node location, an electrical interconnection with a transistor source/drain region and ICS |
| 05/01/2001 | US6225146 Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device |
| 05/01/2001 | US6225143 Flip-chip integrated circuit routing to I/O devices |
| 05/01/2001 | US6225136 Method of producing a contaminated wafer |
| 05/01/2001 | US6225028 Fiberglass-reinforced epoxy resins, fr4, or polytetrafluorethylene (e.g., teflon), in lieu of ceramic materials. |
| 05/01/2001 | US6224737 Immersing semiconductor into electroplating solution containing predetermined concentration of brighteners and levelers |
| 05/01/2001 | US6224703 Method of making laminate ceramic substrate with domed pads |
| 05/01/2001 | US6224690 Copper-free layer of nickel, cobalt, iron or alloys thereof; solder balls of tin and bismuth, silver, and/or antimony; avoids alpha-particle emission and soft logic errors |
| 05/01/2001 | US6223893 Surface package type semiconductor package and method of producing semiconductor memory |
| 05/01/2001 | US6223815 Cooling unit for cooling a heat-generating component and electronic apparatus having the cooling unit |
| 05/01/2001 | US6223814 Flexible foil finned heatsink structure and method of making same |
| 05/01/2001 | US6223813 Ultra high-density, high-performance heat sink |
| 05/01/2001 | US6223810 Extended air cooling with heat loop for dense or compact configurations of electronic components |
| 05/01/2001 | US6223429 Method of production of semiconductor device |
| 05/01/2001 | CA2199112C Lead frame flash removing method and apparatus |
| 04/26/2001 | WO2001030123A1 Flexible electronic circuitry and method of making same |
| 04/26/2001 | WO2001029892A1 Self-aligned metal caps for interlevel metal connections |
| 04/26/2001 | WO2001029891A1 Conformal lining layers for damascene metallization |
| 04/26/2001 | WO2001029890A2 Method relating to anodic bonding |
| 04/26/2001 | WO2001029889A1 A wire for semiconductor and a manufacturing method thereof |
| 04/26/2001 | WO2001029847A1 Infiltrated nanoporous materials and methods of producing same |
| 04/26/2001 | WO2001029843A2 Method for identifying an integrated circuit |
| 04/26/2001 | WO2001029283A1 Plating method, wiring forming method and devices therefor |
| 04/26/2001 | WO2001029280A1 Deposition of transition metal carbides |
| 04/26/2001 | US20010000427 Method of incorporating interconnect systems into an integrated circuit process flow |
| 04/26/2001 | US20010000416 Copper wire-bonding pad |
| 04/26/2001 | US20010000415 Method of processing films prior to chemical vapor deposition using electron beam processing |
| 04/26/2001 | US20010000411 Semiconductor device and method for fabricating the same |
| 04/26/2001 | DE19951048A1 Procedure for identification of integrated circuit by generation of faulty or erroneous memory cells within memory and identification of the circuit from the faulty memory cell pattern, with no need to hard-wire a serial number |
| 04/26/2001 | DE19950885A1 Production of elastic contacts comprises partially anisotropically plasma etching a polymer film located below a copper-etched hole |
| 04/26/2001 | DE19946497A1 Joint for connecting semiconductor chips to circuit boards comprises a first coupling element fixed to a first surface and a second coupling element in the form of a step running along a plane |
| 04/26/2001 | DE19946254A1 Transponder tag and method of manufacture in which a transponder chip and coil are encased in grout compound on a former to provide a simple and economic production process |
| 04/26/2001 | DE10050601A1 Holder for holding integrated semiconductor circuits consists of an elastic material having a conducting adhesion surface |
| 04/26/2001 | DE10049596A1 Dielectric ceramic composition used in computer includes a glass component containing at least silicon oxide and boron oxide which is mixed in a dielectric ceramic component |
| 04/26/2001 | DE10045025A1 Protecting structure for package of integrated circuit |