Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2013
11/13/2013CN103390562A Production method of cooler
11/13/2013CN103390541A Capacitor and method for fabricating the same
11/13/2013CN102884872B Multilayer wiring board and method for manufacturing multilayer wiring board
11/13/2013CN102420200B Transfer plate with metal vertical interconnection structure and manufacture method thereof
11/13/2013CN102393607B Positive photosensitive resin composition, and semiconductor device and display using same
11/13/2013CN102214637B Line structure, semiconductor integrated circuit having line structure and design method
11/13/2013CN102201387B OFN semiconductor package and fabrication method thereof
11/13/2013CN102109291B Metal and conductive plastic composite micro heat exchanger
11/13/2013CN102105981B Semiconductor package with integrated interference shielding and method of manufacture therof
11/13/2013CN102064142B Semiconductor device and method of manufacturing the semiconductor device
11/13/2013CN101877331B Flexible substrate for display panel and manufacturing method thereof
11/13/2013CN101840912B 半导体装置及其制造方法 Semiconductor device and manufacturing method
11/13/2013CN101687716B Method for producing a metallized component, corresponding component, and a substate for supporting the component during metalization
11/13/2013CN101651123B 功率半导体模块 Power semiconductor module
11/13/2013CN101540333B Thin-film transistor substrate and display device having the same
11/12/2013US8582317 Method for manufacturing a semiconductor component and structure therefor
11/12/2013US8581424 Information recording/reproducing device
11/12/2013US8581423 Double solid metal pad with reduced area
11/12/2013US8581422 Semiconductor module
11/12/2013US8581421 Semiconductor package manufacturing method and semiconductor package
11/12/2013US8581420 Under-bump metallization (UBM) structure and method of forming the same
11/12/2013US8581419 Multi-chip stack structure
11/12/2013US8581418 Multi-die stacking using bumps with different sizes
11/12/2013US8581417 Semiconductor device stack with bonding layer and wire retaining member
11/12/2013US8581416 Method of forming a semiconductor device and leadframe therefor
11/12/2013US8581415 Semiconductor device and a method of manufacturing the same
11/12/2013US8581413 Semiconductor device and method for manufacturing the same
11/12/2013US8581412 Semiconductor device comprising an electromagnetic waveguide
11/12/2013US8581411 Semiconductor device
11/12/2013US8581410 Semiconductor device and method of manufacturing the same
11/12/2013US8581408 Semiconductor device
11/12/2013US8581407 Electronic system modules and method of fabrication
11/12/2013US8581406 Flip chip mounted monolithic microwave integrated circuit (MMIC) structure
11/12/2013US8581405 Integrated circuit having a semiconductor substrate with barrier layer
11/12/2013US8581404 Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures
11/12/2013US8581403 Electronic component mounting structure, electronic component mounting method, and electronic component mounting board
11/12/2013US8581402 Molded chip interposer structure and methods
11/12/2013US8581401 Mechanisms for forming copper pillar bumps using patterned anodes
11/12/2013US8581400 Post-passivation interconnect structure
11/12/2013US8581399 Metal bump structure
11/12/2013US8581398 Trap rich layer with through-silicon-vias in semiconductor devices
11/12/2013US8581397 Substrate for semiconductor package with improved bumping of chip bumps and contact pads and semiconductor package having the same
11/12/2013US8581396 Semiconductor device
11/12/2013US8581395 Hybrid integrated circuit device and electronic device
11/12/2013US8581394 Semiconductor package module and electric circuit assembly with the same
11/12/2013US8581393 Thermally conductive LED assembly
11/12/2013US8581392 Silicon based microchannel cooling and electrical package
11/12/2013US8581390 Semiconductor device with heat dissipation
11/12/2013US8581389 Uniformity control for IC passivation structure
11/12/2013US8581388 Multilayered wiring substrate
11/12/2013US8581387 Through wire interconnect (TWI) having bonded connection and encapsulating polymer layer
11/12/2013US8581386 Chip package
11/12/2013US8581385 Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same
11/12/2013US8581384 Semiconductor package structure
11/12/2013US8581383 3-D semiconductor die structure with containing feature and method
11/12/2013US8581382 Integrated circuit packaging system with leadframe and method of manufacture thereof
11/12/2013US8581381 Integrated circuit (IC) package stacking and IC packages formed by same
11/12/2013US8581380 Integrated circuit packaging system with ultra-thin die
11/12/2013US8581379 Lead frame and semiconductor device
11/12/2013US8581378 Semiconductor device and method of manufacturing the same
11/12/2013US8581377 TSOP with impedance control
11/12/2013US8581375 Leadframe-based mold array package heat spreader and fabrication method therefor
11/12/2013US8581374 Placing heat sink into packaging by strip formation assembly
11/12/2013US8581373 Tape package
11/12/2013US8581372 Semiconductor storage device and a method of manufacturing the semiconductor storage device
11/12/2013US8581370 Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die
11/12/2013US8581369 Semiconductor chip and semiconductor wafer
11/12/2013US8581368 Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer
11/12/2013US8581362 Wireless communication devices with in-package integrated passive components
11/12/2013US8581349 3D memory semiconductor device and structure
11/12/2013US8581345 Charge-balance power device comprising columnar structures and having reduced resistance, and method and system of same
11/12/2013US8581343 Electrical connectivity for circuit applications
11/12/2013US8581305 Semiconductor memory device
11/12/2013US8581285 Semiconductor light-emitting element for flip-chip mounting
11/12/2013US8581251 Device for protecting an electronic integrated circuit housing against physical or chemical ingression
11/12/2013US8581250 Method and apparatus of fabricating a pad structure for a semiconductor device
11/12/2013US8581249 Film thickness monitoring structure for semiconductor substrate
11/12/2013US8581117 Conductive substrate for formation of LED package structures thereon
11/12/2013US8581109 Method for manufacturing a circuit board structure
11/12/2013US8580683 Apparatus and methods for molding die on wafer interposers
11/12/2013US8580679 Designs and methods for conductive bumps
11/12/2013DE202012012767U1 Leistungshalbleitermodulsystem Power semiconductor module system
11/12/2013CA2589183C Heat sink with microchannel cooling for power devices
11/12/2013CA2536799C Semiconductor package and method of manufacturing the same
11/12/2013CA2351822C Light extractor apparatus
11/07/2013WO2013166021A1 Transparent through - glass conductive via in a transparent substrate
11/07/2013WO2013165652A1 Sensor array package
11/07/2013WO2013164756A1 Method for increasing heat conductivity in systems that use high power density leds
11/07/2013WO2013164307A1 Thermoelectric conversion module and method for making it
11/07/2013WO2013134054A4 3d packaging with low-force thermocompression bonding of oxidizable materials
11/07/2013WO2013109308A3 Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate
11/07/2013WO2013044094A3 Methods for reducing thermal resistance of carbon nanotube arrays or sheets
11/07/2013US20130295762 Cu pillar bump with electrolytic metal sidewall protection
11/07/2013US20130295724 Power Semiconductor Chip Package
11/07/2013US20130295722 Method of Forming an Integrated Circuit Package Including a Direct Connect Pad, A Blind Via, and a Bond Pad Electrically Coupled to the Direct Connect Pad
11/07/2013US20130294032 Through-hole mounting system with heat sinking elements clamped to one another against insulating body
11/07/2013US20130293816 Chip-on-film package and device assembly including the same
11/07/2013US20130293809 Array substrate for liquid crystal panel, and liquid crystal panel
11/07/2013US20130293808 Curable composition
11/07/2013US20130293292 Interlayer communications for 3d integrated circuit stack
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