| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/15/2001 | US6232251 Diopside oxide crystal phase; at least one crystal phase selected from the group consisting of a quartz crystal phase and a composite oxide crystal phase containing ti and mg or zn; and a glass phase; coefficient of thermal expansion |
| 05/15/2001 | US6232246 Method of fabricating semiconductor device |
| 05/15/2001 | US6232223 High integrity borderless vias with protective sidewall spacer |
| 05/15/2001 | US6232221 Borderless vias |
| 05/15/2001 | US6232213 Method of making a semiconductor chip package |
| 05/15/2001 | US6232212 Flip chip bump bonding |
| 05/15/2001 | US6232211 Two-step projecting bump for semiconductor chip and method for forming the same |
| 05/15/2001 | US6232210 Fuse, memory incorporating same and method |
| 05/15/2001 | US6232206 Method for forming electrostatic discharge (ESD) protection transistors |
| 05/15/2001 | US6232200 Method of reconstructing alignment mark during STI process |
| 05/15/2001 | US6232157 Thin film transistors |
| 05/15/2001 | US6232153 Plastic package assembly method for a ferroelectric-based integrated circuit |
| 05/15/2001 | US6232152 Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures |
| 05/15/2001 | US6232151 Power electronic module packaging |
| 05/15/2001 | US6232149 Sockets for “springed” semiconductor devices |
| 05/15/2001 | US6232148 Method and apparatus leads-between-chips |
| 05/15/2001 | US6232147 Method for manufacturing semiconductor device with pad structure |
| 05/15/2001 | US6232146 Semiconductor device including combed bond pad opening, assemblies and methods |
| 05/15/2001 | US6232145 Method and apparatus for filling a gap between spaced layers of a semiconductor |
| 05/15/2001 | US6231997 Blend of crystalline epoxy resin, phenolic resin, organicphosphorus curing agent, aminosilane coupling agent and filler |
| 05/15/2001 | US6231918 Film on integrated circuits with oxide layers |
| 05/15/2001 | US6231707 Method of forming a multilayer ceramic substrate with max-punched vias |
| 05/15/2001 | US6230791 Heat transfer cold plate arrangement |
| 05/15/2001 | US6230789 Heat dissipating device and method making the same |
| 05/15/2001 | US6230788 Heat sink |
| 05/15/2001 | US6230497 Semiconductor circuit temperature monitoring and controlling apparatus and method |
| 05/15/2001 | US6230400 Method for forming interconnects |
| 05/15/2001 | US6230399 Backside encapsulation of tape automated bonding device |
| 05/15/2001 | CA2231635C Dual-mode micrometer/millimeter wave integrated circuit package |
| 05/15/2001 | CA2198088C Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 05/10/2001 | WO2001033925A1 Method fabricating a laminated printed circuit board |
| 05/10/2001 | WO2001033715A1 On-chip decoupling capacitor system with parallel fuse |
| 05/10/2001 | WO2001033649A1 Method of producing vertical interconnects between thin film microelectronic devices and products comprising such vertical interconnects |
| 05/10/2001 | WO2001033644A1 Semiconductor device and method of manufacture thereof |
| 05/10/2001 | WO2001033632A1 Planar hybrid diode rectifier bridge |
| 05/10/2001 | WO2001033630A2 Methods and compositions for detection and treatment of breast cancer, based on breast cancer-associated polypeptides |
| 05/10/2001 | WO2001033629A2 Device for thermal coupling of an electronic component with a cooling element |
| 05/10/2001 | WO2001033621A2 Methods for forming openings in a substrate and methods for creating assemblies |
| 05/10/2001 | WO2001032362A1 Method and apparatus for deposition on and polishing of a semiconductor surface |
| 05/10/2001 | US20010001080 Interconnect assemblies and methods |
| 05/10/2001 | US20010001077 Alignment mark strategy for oxide CMP |
| 05/10/2001 | US20010001070 Method for improving the liquid dispensing of IC packages |
| 05/10/2001 | US20010001069 Metal stud array packaging |
| 05/10/2001 | US20010001068 Structures formed using excess oxygen containing material |
| 05/10/2001 | US20010000929 Flip chip with integrated flux and underfill |
| 05/10/2001 | US20010000928 Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming same |
| 05/10/2001 | US20010000927 Semiconductor and flip chip packages and method having a back-side connection |
| 05/10/2001 | US20010000925 Method of forming BGA interconnections having mixed solder profiles |
| 05/10/2001 | US20010000924 Molded plastic package with heat sink and enhanced electrical performance |
| 05/10/2001 | US20010000917 Method of producing self-trimming sublithographic electrical wiring |
| 05/10/2001 | US20010000915 Mechanically-stabilized area-array device package |
| 05/10/2001 | US20010000880 Supplemental heating for variable load evaporative cold plates |
| 05/10/2001 | DE19961790C1 Semiconductor chip separation device |
| 05/10/2001 | DE10054115A1 Forming barrier layer in elongated recess in dielectric layer on semiconductor disc |
| 05/10/2001 | DE10046910A1 Semiconductor device comprises a lower layer with a main surface and a capacitor formed on the main surface of the lower layer |
| 05/10/2001 | DE10042909A1 Multilayered ceramic substrate comprises substrate ceramic layers each containing a ceramic material that sinters at a low temperature, a shrinkage-preventing layer containing an inorganic material in the non-sintered state and wiring cable |
| 05/10/2001 | DE10041565A1 Metallic intermediate connection used in the production of integrated circuits comprises a barrier layer formed on the insulating film, an adhesion layer containing zirconium and an intermediate connection material containing copper |
| 05/10/2001 | DE10019840A1 Multilayer capacitor for use in high frequency circuits e.g. CPU, has inner electrode electrically connected to main surface connection electrodes, through hole conductor |
| 05/09/2001 | EP1098369A2 Semiconductor module and inverter device |
| 05/09/2001 | EP1098368A1 Module component and method of manufacturing the same |
| 05/09/2001 | EP1098367A2 An electronics package having an integrated filter |
| 05/09/2001 | EP1098366A1 Semiconductor connection structure and method |
| 05/09/2001 | EP1098363A2 Testing integrated circuits |
| 05/09/2001 | EP1098361A2 Particle material, anisotropic conductive connection and anisotropic conductive connection material |
| 05/09/2001 | EP1097901A2 Method of fabricating micro electro mechanical system structure which can be vacuum-packaged at wafer level |
| 05/09/2001 | EP1097619A1 Integrated circuit module having springy contacts of at least two different types for reduced stress, and subassembly for such module |
| 05/09/2001 | EP1097479A1 Integrated electronic micromodule and method for making same |
| 05/09/2001 | EP1097478A2 Semiconductor component in a chip format and method for the production thereof |
| 05/09/2001 | EP1097477A2 Electronic device having fibrous interface |
| 05/09/2001 | EP1097476A2 Curved ceramic moulded part |
| 05/09/2001 | EP1097467A1 Ic stack utilizing secondary leadframes |
| 05/09/2001 | EP1097020A1 Solder ball placement apparatus |
| 05/09/2001 | EP0974162A4 a low-stress metal film with low electrical resistivity |
| 05/09/2001 | CN2429917Y Heat radiator |
| 05/09/2001 | CN2429916Y Improved heat radiating buckle |
| 05/09/2001 | CN1294789A Microwave module |
| 05/09/2001 | CN1294758A High-frequency module and method of manufacture thereof |
| 05/09/2001 | CN1294757A Inductance device |
| 05/09/2001 | CN1294756A Semiconductor device, circuit board, method of mfg. circuit board, and electronic device |
| 05/09/2001 | CN1294755A Method for generating electrical conducting or semiconducting structures in two or three dimensions, method for erasing same structures and electric field generator/modulator |
| 05/09/2001 | CN1294540A Method for machining work by laser beam |
| 05/09/2001 | CN1294483A Plastic substrate containing metal frame for package and its making method |
| 05/09/2001 | CN1294413A 半导体装置 Semiconductor device |
| 05/09/2001 | CN1065708C Electronic part |
| 05/09/2001 | CN1065663C 半导体器件 Semiconductor devices |
| 05/09/2001 | CN1065662C Semiconductor chip package and mfg. method thereof |
| 05/09/2001 | CN1065661C package for mounting semiconductor package |
| 05/09/2001 | CN1065660C Substrate for semiconductor package, fabrication method thereof, and package of semiconductor |
| 05/09/2001 | CN1065659C Plate type semiconductor package having heat sink |
| 05/09/2001 | CN1065657C Mfg. method of semiconductor device |
| 05/08/2001 | US6229726 Integrated circuit chip having multiple package options |
| 05/08/2001 | US6229711 Flip-chip mount board and flip-chip mount structure with improved mounting reliability |
| 05/08/2001 | US6229706 Reverse cantilever spring clip |
| 05/08/2001 | US6229705 Clip for securing heat sink to electronic device package |
| 05/08/2001 | US6229703 Cooler device |
| 05/08/2001 | US6229702 Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability |
| 05/08/2001 | US6229324 Test system with mechanical alignment for semiconductor chip scale packages and dice |
| 05/08/2001 | US6229227 Programmable-value on-chip passive components for integrated circuit (IC) chips, and systems utilizing same |
| 05/08/2001 | US6229223 Flexible printed board |
| 05/08/2001 | US6229222 Semiconductor device and method of fabricating the same |