| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/22/2001 | US6235642 Method for reducing plasma charging damages |
| 05/22/2001 | US6235637 Method for marking a wafer without inducing flat edge particle problem |
| 05/22/2001 | US6235629 Process for producing a semiconductor device |
| 05/22/2001 | US6235624 Paste connection plug, burying method, and semiconductor device manufacturing method |
| 05/22/2001 | US6235583 Non-volatile semiconductor memory and fabricating method therefor |
| 05/22/2001 | US6235557 Programmable fuse and method therefor |
| 05/22/2001 | US6235556 Method of improving parallelism of a die to package using a modified lead frame |
| 05/22/2001 | US6235555 Reel-deployed printed circuit board and method for manufacturing chip-on-board packages |
| 05/22/2001 | US6235554 Method for fabricating stackable chip scale semiconductor package |
| 05/22/2001 | US6235552 Chip scale package and method for manufacturing the same using a redistribution substrate |
| 05/22/2001 | US6235551 Semiconductor device including edge bond pads and methods |
| 05/22/2001 | US6235113 Apparatus and method for dispensing a liquid on electrical devices |
| 05/22/2001 | US6234246 Heat exchanger for cooling semi-conductor components |
| 05/22/2001 | US6234242 Two-phase thermosyphon including a porous structural material having slots disposed therein |
| 05/22/2001 | US6234239 Segmented heat sink |
| 05/22/2001 | US6233960 Spot cooling evaporator cooling system for integrated circuit chip modules |
| 05/22/2001 | US6233959 Dehumidified cooling assembly for IC chip modules |
| 05/22/2001 | US6233944 Thermoelectric module unit |
| 05/22/2001 | US6233817 Method of forming thick-film hybrid circuit on a metal circuit board |
| 05/19/2001 | CA2326260A1 Installation structure of a power circuit unit, installation structure of a circuit board and installation method of a power circuit unit |
| 05/17/2001 | WO2001035465A1 Semiconductor device having a field effect transistor and a method of manufacturing such a device |
| 05/17/2001 | WO2001035463A2 Overvoltage protection arrangement |
| 05/17/2001 | WO2001035462A1 Metal redistribution layer having solderable pads and wire bondable pads |
| 05/17/2001 | WO2001035461A1 Semiconductor device and method of manufacturing the same |
| 05/17/2001 | WO2001035460A1 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device |
| 05/17/2001 | WO2001035459A1 Ceramic substrate |
| 05/17/2001 | WO2001035199A1 Heat transfer apparatus using refrigerant and computer having the same |
| 05/17/2001 | WO2001035006A2 Metal-infiltrated ceramic seal |
| 05/17/2001 | WO2001011662A3 Vapor phase connection techniques |
| 05/17/2001 | WO2001003189A8 Multichip module and method for producing a multichip module |
| 05/17/2001 | US20010001297 Forming a titanium film upon a substrate, forming an intermediate layer comprising silicon upon said titanium film, and forming a titanium nitride film upon said intermediate layer; barrier |
| 05/17/2001 | US20010001293 Chip device and method for producing the same |
| 05/17/2001 | US20010001292 Substrate having active devices on front surface, first through-chip conductor passing an electrical/physical characteristic from front to back, and chip connector from active devices to a conductor on different level of packaging |
| 05/17/2001 | US20010001217 Semiconductor device, manufacturing method thereof and aggregate type semiconductor device |
| 05/17/2001 | US20010001216 Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package |
| 05/17/2001 | US20010001215 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
| 05/17/2001 | US20010001214 Technique for producing interconnecting conductive links |
| 05/17/2001 | DE10054466A1 Radiating structure of a power module used in integrated circuits comprises a radiating plate made of a semiconductor chip and ceramic elements, and a heat sink |
| 05/17/2001 | DE10053532A1 Electronic component e.g. surface acoustic wave device for communication device, has seal cover arranged on upper surface of seal frame through conductive structure or insulating structure |
| 05/17/2001 | DE10051834A1 Semiconductor base material for manufacturing semiconductor wafer or semiconductor device has 1 to 15 micrometer micro dot mark with height whose maximum length along marked surface is 0.01 to 5 micrometers |
| 05/17/2001 | DE10023369A1 Mounting support for heat generation element and heat sink device, has cover plate with bolts that are passed through holes in base of heat sink device and holes in circuit board |
| 05/17/2001 | CA2388926A1 Metal redistribution layer having solderable pads and wire bondable pads |
| 05/16/2001 | EP1100296A1 Wiring method and wiring device |
| 05/16/2001 | EP1100295A2 Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same |
| 05/16/2001 | EP1100294A2 Bus bar heat sink |
| 05/16/2001 | EP1100195A2 Lead terminal and electronic component including lead terminal |
| 05/16/2001 | EP1100125A1 Integrated circuit with identification signal writing circuitry distributed on multiple metal layers |
| 05/16/2001 | EP1100122A2 Die used for resin-sealing and molding an electronic component |
| 05/16/2001 | EP1100121A2 Process for forming low k silicon oxide dielectric material while suppressing pressure spiking and inhibiting increase in dielectric constant |
| 05/16/2001 | EP1100096A1 Electronic device and manufacture thereof |
| 05/16/2001 | EP1100039A2 Semiconductor apparatus for fingerprint recognition |
| 05/16/2001 | EP1099254A1 Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module |
| 05/16/2001 | EP1099253A1 Pbga package with integrated ball grid |
| 05/16/2001 | EP1099252A1 Electrically isolated power semiconductor package |
| 05/16/2001 | EP1099250A2 Method and apparatus for forming improved metal interconnects |
| 05/16/2001 | EP1099249A1 Integrated circuit interconnect lines having sidewall layers |
| 05/16/2001 | EP1099248A1 Misalignment tolerant techniques for dual damascene fabrication |
| 05/16/2001 | EP1099246A1 Method for producing a ceramic body having an integrated passive electronic component, such a body and use of same |
| 05/16/2001 | EP1099197A1 Device for supplying output data in reaction to input data, method for checking authenticity and method for encrypted data transmission |
| 05/16/2001 | EP1098757A1 Transferrable compliant fibrous thermal interface |
| 05/16/2001 | EP0811262B1 Diode laser component with cooling element |
| 05/16/2001 | CN1295720A Semiconductor device and manufacture thereof |
| 05/16/2001 | CN1295719A Method for generation of electrical conducting or semicnducting structures in three dimensionsand methods for earasure of the same structures |
| 05/16/2001 | CN1295611A Substrates for immobilizing and amplifying DNA DNA-immobilized chips having DNA immobilized on the substrates, and method for amplifying DNA |
| 05/16/2001 | CN1295346A Semiconductor device |
| 05/16/2001 | CN1295345A Heat sink with improved heat exchanger |
| 05/16/2001 | CN1295344A Flip-chip semiconductor device with stress absorption layer made of resin and its manufacture |
| 05/16/2001 | CN1295339A Dielectric material having intrinsic copper ion migration barrier low dielectric constant |
| 05/16/2001 | CN1295231A Method for manufacture of radiator |
| 05/16/2001 | CN1294954A Production process of high-density tin solder for SMT package |
| 05/15/2001 | US6233721 Power bus and method for generating power slits therein |
| 05/15/2001 | US6233487 Apparatus and method for setting the parameters of an alert window used for timing the delivery of ETC signals to a heart under varying cardiac conditions |
| 05/15/2001 | US6233339 Physical property based cryptographics |
| 05/15/2001 | US6233194 Method of anti-fuse repair |
| 05/15/2001 | US6233159 Bracket for supporting and aligning a circuit component with respect to a circuit board |
| 05/15/2001 | US6233146 Rotatable portable computer remote heat exchanger with heat pipe |
| 05/15/2001 | US6232680 Cooling apparatus for electronic device |
| 05/15/2001 | US6232668 Semiconductor device of chip-on-chip structure and semiconductor chip for use therein |
| 05/15/2001 | US6232667 Technique for underfilling stacked chips on a cavity MLC module |
| 05/15/2001 | US6232666 Interconnect for packaging semiconductor dice and fabricating BGA packages |
| 05/15/2001 | US6232665 Filling narrow, high aspect ratio holes; semiconductors, integrated circuits |
| 05/15/2001 | US6232664 Semiconductor device having A1 alloy wiring |
| 05/15/2001 | US6232663 Semiconductor device having interlayer insulator and method for fabricating thereof |
| 05/15/2001 | US6232662 System and method for bonding over active integrated circuits |
| 05/15/2001 | US6232661 Semiconductor device in BGA package and manufacturing method thereof |
| 05/15/2001 | US6232660 High-frequency semiconductor device provided with peripheral bumps on chip periphery that surround high-frequency semiconductor chip |
| 05/15/2001 | US6232659 Thin multichip module |
| 05/15/2001 | US6232657 Silicon nitride circuit board and semiconductor module |
| 05/15/2001 | US6232656 Semiconductor interconnect formed over an insulation and having moisture resistant material |
| 05/15/2001 | US6232655 Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element |
| 05/15/2001 | US6232653 TSOP type semiconductor device |
| 05/15/2001 | US6232652 Semiconductor device having a packaged semiconductor element and permanent vent and manufacturing method thereof |
| 05/15/2001 | US6232651 Lead frame for semiconductor device |
| 05/15/2001 | US6232650 Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting |
| 05/15/2001 | US6232645 Noise decoupling for semiconductor device with BiCMOS-type substrate |
| 05/15/2001 | US6232563 Bump electrode and method for fabricating the same |
| 05/15/2001 | US6232560 Arrangement of printed circuit traces |
| 05/15/2001 | US6232558 Electronic component mounting base board having heat slug with slits and projections |
| 05/15/2001 | US6232551 Substrate board for semiconductor package |
| 05/15/2001 | US6232363 Method for producing a diffusion barrier and polymeric article having a diffusion barrier |