| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/29/2001 | US6238469 Dual-valent rare earth additives to polishing slurries |
| 05/29/2001 | US6238454 Heat-dissipating microcircuit packaging composite having similar coefficient of thermal expansion as microcircuit and comprising powder metallurgically formed, sintered mixture of copper, carbon and wetting agent metals which form carbides |
| 05/29/2001 | US6238223 Method of depositing a thermoplastic polymer in semiconductor fabrication |
| 05/29/2001 | US6238181 Heat dissipating device for portable apparatus |
| 05/29/2001 | US6238086 Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation fins |
| 05/29/2001 | US6237682 Cooling module including a pressure relief mechanism |
| 05/29/2001 | US6237223 Method of forming a phase change heat sink |
| 05/29/2001 | US6237222 Method of producing a radiator and product thereof |
| 05/29/2001 | CA2202576C Electronic circuit assembly |
| 05/25/2001 | WO2001037621A2 Method for producing a support element for an integrated circuit (ic) component |
| 05/25/2001 | WO2001037376A1 Arrangement for electrically connecting chips in a circuit that is embodied in a three-dimensional manner |
| 05/25/2001 | WO2001037341A1 Multichip ic-card comprising a bus structure |
| 05/25/2001 | WO2001037340A1 Programmable semiconductor device structures and methods for making the same |
| 05/25/2001 | WO2001037339A1 Air gap dielectric in self-aligned via structures |
| 05/25/2001 | WO2001037338A2 Method for integrating a chip in a printed board and integrated circuit |
| 05/25/2001 | WO2001037337A1 Ball grid substrate for lead-on-chip semiconductor package |
| 05/25/2001 | WO2001037336A1 Multi-chip module for use in high-power applications |
| 05/25/2001 | WO2001037335A2 Packaging for a semiconductor chip |
| 05/25/2001 | WO2001037323A2 Vertical transformer |
| 05/25/2001 | WO2001037322A2 System and method for product yield prediction using a logic characterization vehicle |
| 05/25/2001 | WO2001037288A1 An arrangement for electrically insulating a high voltage component |
| 05/25/2001 | WO2001037285A1 Method for testing semiconductor memory |
| 05/25/2001 | WO2001037150A1 System and method for product yield prediction using device and process neighborhood characterization vehicle |
| 05/25/2001 | WO2001036992A1 The passive multiplexor test structure for intergrated circuit manufacturing |
| 05/25/2001 | WO2001036990A2 Wafer level interposer |
| 05/25/2001 | WO2001036917A1 Integrated circuit device and correction method for integrated circuit device |
| 05/25/2001 | WO2001036349A1 Method for attaching a body, which is comprised of a metal matrix composite (mmc) material, to a ceramic body |
| 05/25/2001 | WO2001035718A2 System and method for product yield prediction |
| 05/25/2001 | WO2001011661A3 Passive electrical components formed on carbon coated insulating substrates |
| 05/25/2001 | WO2000063950A3 Sub-package bypass capacitor mounting for an array packaged integrated circuit |
| 05/24/2001 | US20010001741 Process for the production of semiconductor device |
| 05/24/2001 | US20010001740 Semiconductor encapsulated in a hollow package, made by housing a chip in a plurality of cavities of a plate-like substrate, bonding a plate-like cap to teh substrate, and separating the bonded members along space between cavities |
| 05/24/2001 | US20010001735 Method for restoring an alignment mark after planarization of a dielectric layer |
| 05/24/2001 | US20010001727 By forming a protective film on the surface by High-Density Plasma Chemical Vapor Deposition; better filling of gaps between metal lines |
| 05/24/2001 | US20010001714 Forming electronic circuit on wafer in region defined by scribe line, attaching circuit substrate carrying predetermined conductor pattern on wafer, interconnecting by wire bonding, forming spherical electrode, dicing |
| 05/24/2001 | US20010001594 Electronic package with stacked connections and method for making same |
| 05/24/2001 | US20010001593 Electronic package with stacked connections and method for making same |
| 05/24/2001 | US20010001592 Lossy RF shield for integrated circuits |
| 05/24/2001 | US20010001507 Substrate for a semiconductor device, a semiconductor device, a card type module, and a data memory device |
| 05/24/2001 | US20010001506 Method of forming contact openings |
| 05/24/2001 | US20010001505 Tape ball grid array with interconnected ground plane |
| 05/24/2001 | US20010001504 Semiconductor device |
| 05/24/2001 | US20010001503 Contact level via and method of selective formation of a barrier layer for a contact level via |
| 05/24/2001 | US20010001498 Field effect transistors, integrated circuitry, methods of forming field effect transistor gates, and methods of forming integrated circuitry |
| 05/24/2001 | US20010001496 Semiconductor devices |
| 05/24/2001 | US20010001428 Circuit board and semiconductor device, and method of manufacturing the same |
| 05/24/2001 | US20010001427 Electrical interconnect structure and method of forming electrical interconnects having electromigration-inhibiting segments |
| 05/24/2001 | US20010001416 Heat sink and method for making the same |
| 05/24/2001 | US20010001406 Embossing a channel or opening into the green tape of the desired size under heat and pressure, screen printing an ink of conductive material to fill embossed channel or openings, firing the green tape |
| 05/23/2001 | EP1102525A1 Printed wiring board and method for producing the same |
| 05/23/2001 | EP1102316A1 Multichip IC card with bus structure |
| 05/23/2001 | EP1102315A2 A method to avoid copper contamination on the sidewall of a via or a dual damascene structure |
| 05/23/2001 | EP1102182A2 Method of automatic layout design for LSI, mask set and semiconductor integrated circuit manufactured by the method, and recording medium storing the program |
| 05/23/2001 | EP1101837A1 Moisture corrosion inhibitor layer for Al-alloy metallization layers, particularly for electronic devices and corresponding manufacturing method |
| 05/23/2001 | EP1101834A2 Method of depositing materials on substrates |
| 05/23/2001 | EP1101250A1 Lead frame attachment for optoelectronic device |
| 05/23/2001 | EP1101248A2 Substrate for high-voltage modules |
| 05/23/2001 | DE19955277A1 Method to influence thermal economy of body, e.g. electronic equipment |
| 05/23/2001 | DE19954895A1 Anordnung zur elektrischen Verbindung zwischen Chips in einer dreidimensional ausgeführten Schaltung Arrangement for electrical connection between circuit chips in a three-dimensionally performed |
| 05/23/2001 | DE19954888A1 Verpackung für einen Halbleiterchip Package for a semiconductor chip |
| 05/23/2001 | DE10026067A1 Düsen-Lotzufuhrgerät und Lötverfahren Nozzle Lotzufuhrgerät and soldering |
| 05/23/2001 | DE10000759C1 Production of justifying marks in a structure with integrated circuits comprises applying a first planar metal layer over a semiconductor substrate, applying an insulating layer, inserting metal and depositing a second metal layer |
| 05/23/2001 | CN2431643Y Radiating device combination |
| 05/23/2001 | CN2431642Y Radiating device combination |
| 05/23/2001 | CN1296642A RF circuit module |
| 05/23/2001 | CN1296641A 显示装置 Display device |
| 05/23/2001 | CN1296640A Anisotropic conductor film, semiconductor chip, and method of packaging |
| 05/23/2001 | CN1296638A Semiconductor device with transparent link area for silicide applications and fabrication thereof |
| 05/23/2001 | CN1296289A Semiconductor device |
| 05/23/2001 | CN1296088A Steel wire spring clamp head, wire-guiding frame conveying belt and electroplating system |
| 05/22/2001 | US6236612 Integrated semiconductor memory configuration with self-buffering of supply voltages |
| 05/22/2001 | US6236569 Attaching heat sinks to integrated circuits |
| 05/22/2001 | US6236568 Heat-dissipating structure for integrated circuit package |
| 05/22/2001 | US6236567 Electronic device package with enhanced heat dissipation effect |
| 05/22/2001 | US6236566 Cooling element for a power electronic device and power electronic device comprising same |
| 05/22/2001 | US6236565 Chip stack with active cooling system |
| 05/22/2001 | US6236297 Combinational inductor |
| 05/22/2001 | US6236228 Structure and method of repair of integrated circuits |
| 05/22/2001 | US6236129 Motor with hydrodynamic bearing and heat sink device employing this motor |
| 05/22/2001 | US6236116 Semiconductor device having a built-in heat sink and process of manufacturing same |
| 05/22/2001 | US6236115 High density integrated circuit packaging with chip stacking and via interconnections |
| 05/22/2001 | US6236114 Bonding pad structure |
| 05/22/2001 | US6236112 Semiconductor device, connecting substrate therefor, and process of manufacturing connecting substrate |
| 05/22/2001 | US6236111 Hybrid circuit substrate mountable micro-electromechanical component |
| 05/22/2001 | US6236110 Power semiconductor module |
| 05/22/2001 | US6236109 Multi-chip chip scale package |
| 05/22/2001 | US6236108 Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package |
| 05/22/2001 | US6236107 Encapsulate resin LOC package and method of fabrication |
| 05/22/2001 | US6236106 Wiring structure with divided wiring conductors to achieve planarity in an overlying SOG layer |
| 05/22/2001 | US6236105 Semiconductor device with improved planarity achieved through interlayer films with varying ozone concentrations |
| 05/22/2001 | US6236103 Integrated high-performance decoupling capacitor and heat sink |
| 05/22/2001 | US6236101 Metallization outside protective overcoat for improved capacitors and inductors |
| 05/22/2001 | US6236098 Heat spreader |
| 05/22/2001 | US6236092 Mixed mode device |
| 05/22/2001 | US6236091 Method of forming a local interconnect with improved etch selectivity of silicon dioxide/silicide |
| 05/22/2001 | US6236090 Semiconductor device and method for reducing contact resistance between an electrode and a semiconductor substrate |
| 05/22/2001 | US6236061 Semiconductor crystallization on composite polymer substrates |
| 05/22/2001 | US6235997 LSI package with equal length transmission Lines |
| 05/22/2001 | US6235996 Interconnection structure and process module assembly and rework |
| 05/22/2001 | US6235648 Semiconductor device including insulation film and fabrication method thereof |