| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/31/2001 | US20010002051 Semiconductor device |
| 05/31/2001 | US20010001989 Microelectronic connections with liquid conductive elements |
| 05/31/2001 | US20010001983 Localized thermo manager for semiconductor devices |
| 05/31/2001 | US20010001981 Heat pipe type cooler |
| 05/31/2001 | US20010001976 Apparatus and method for fabricating buried and flat metal features |
| 05/31/2001 | US20010001954 Forming a titanium/titanium nitride film on a semiconductor substrate surface by vapor deposition where the substrate support has a protective silicon nitride coating to prevent contamination the support material; no current leakage |
| 05/31/2001 | US20010001898 Heat sink and method for making the same |
| 05/31/2001 | DE19957302A1 Substrate used in the production of integrated circuits comprises a first insulating layer on the substrate, a second insulating layer on the first insulating layer, hollow chambers |
| 05/31/2001 | DE19956903A1 Process for the integration of PIN diodes comprises depositing a diode structure on a substrate, structuring a mesa structure, producing a metal bump, bonding a heat sink to the bump |
| 05/31/2001 | DE19956565A1 Manufacturing heat sink for electrical components involves structuring metallisation on at least one of two or more substrates with metallisation and channel openings on ceramic layer |
| 05/31/2001 | DE19955537A1 Verfahren zur Herstellung eines Trägerelements für einen IC-Baustein A process for producing a carrier element for an IC module |
| 05/31/2001 | DE19952768A1 Vorrichtung zum thermischen Verbinden eines elektronischen Bauelementes mit einem Kühlkörper Apparatus for thermally bonding an electronic component to a heat sink |
| 05/31/2001 | DE19950580A1 Überspannungsschutzanordnung Overvoltage protection order |
| 05/31/2001 | DE10058446A1 Semiconducting device with radiation structure has connecting components between first and second radiating components and chip with better conductivity than tungsten and molybdenum |
| 05/31/2001 | DE10056832A1 Semiconductor module has printed circuit board with opening aligned with heat dissipation surface of substrate, which is fastened directly on the heat sink using screw |
| 05/31/2001 | DE10043172A1 Halbleiter-Baustein und Verfahren zur Herstellung desselben Of the same semiconductor device and methods for making |
| 05/31/2001 | DE10020590A1 Mehrfachmass-Streifen und Verfahren zum Ausgleich desselben The same multiple mass strip and method of compensation |
| 05/30/2001 | EP1104226A1 Production method for flexible substrate |
| 05/30/2001 | EP1104225A1 Surface mounting component and mounted structure of surface mounting component |
| 05/30/2001 | EP1104026A2 Ground plane for a semiconductor chip |
| 05/30/2001 | EP1104025A1 Semiconductor device |
| 05/30/2001 | EP1104024A2 Semiconductor package and method for forming semiconductor package |
| 05/30/2001 | EP1104017A2 Method of flip-chip mounting a semiconductor chip to a circuit board |
| 05/30/2001 | EP1104016A1 Lead assembly for semiconductor devices and assembling method therefor |
| 05/30/2001 | EP1104015A2 Heat sink and method of fabricating same |
| 05/30/2001 | EP1103995A1 Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
| 05/30/2001 | EP1103858A2 Photolithographic method to make a fuse in integrated circuit with localised blowing point |
| 05/30/2001 | EP1103639A2 Plating apparatus and method |
| 05/30/2001 | EP1103634A1 Method for contact plated copper deposition |
| 05/30/2001 | EP1103633A1 Method for copper plating deposition |
| 05/30/2001 | EP1103168A2 High density printed circuit substrate and method of fabrication |
| 05/30/2001 | EP1103072A1 Thin-layered semiconductor structure comprising a heat distribution layer |
| 05/30/2001 | EP0826165B1 Alignment device and lithographic apparatus provided with such a device |
| 05/30/2001 | CN2432683Y Radiator fan |
| 05/30/2001 | CN2432629Y Fastener joining device |
| 05/30/2001 | CN1297584A Method of mfg. semiconductor device, semiconductor device, narrow pitch connector, electrostatic actuator, ink jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic device |
| 05/30/2001 | CN1297567A Conductive paste, ceramic multilayer substrate, and method for mfg. ceramic multilayer substrate |
| 05/30/2001 | CN1297255A Mixed fuse technique |
| 05/30/2001 | CN1297253A Wiring baseboard, semiconductor device with wiring baseboard, and mfg. and installing method thereof |
| 05/30/2001 | CN1066577C Heat-pipe type cooling apparatus |
| 05/30/2001 | CN1066575C Method and apparatus for transversely access of frame of IC guided line |
| 05/30/2001 | CN1066574C Method for mfg. encapsulated substrate type semiconductor device |
| 05/30/2001 | CN1066494C Process for producing metal-bonded-ceramic material |
| 05/29/2001 | US6240199 Electronic apparatus having improved scratch and mechanical resistance |
| 05/29/2001 | US6239987 Case for semiconductor circuit of a surge protector |
| 05/29/2001 | US6239983 Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board |
| 05/29/2001 | US6239980 Multimodule interconnect structure and process |
| 05/29/2001 | US6239974 Electrical assembly that includes a heat sink which is attached to a substrate by a clip |
| 05/29/2001 | US6239972 Integrated convection and conduction heat sink for multiple mounting positions |
| 05/29/2001 | US6239703 Communication pad structure for semiconductor devices |
| 05/29/2001 | US6239669 High frequency package |
| 05/29/2001 | US6239615 High-performance interconnect |
| 05/29/2001 | US6239591 Method and apparatus for monitoring SOI hysterises effects |
| 05/29/2001 | US6239499 Consistent alignment mark profiles on semiconductor wafers using PVD shadowing |
| 05/29/2001 | US6239497 Substrate for packing semiconductor device and method for packing a semiconductor device in the substrate |
| 05/29/2001 | US6239496 Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same |
| 05/29/2001 | US6239495 Multichip semiconductor device and memory card |
| 05/29/2001 | US6239494 Wire bonding CU interconnects |
| 05/29/2001 | US6239491 Integrated circuit structure with thin dielectric between at least local interconnect level and first metal interconnect level, and process for making same |
| 05/29/2001 | US6239489 Reinforcement of lead bonding in microelectronics packages |
| 05/29/2001 | US6239488 Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate |
| 05/29/2001 | US6239487 Lead frame with heat spreader and semiconductor package therewith |
| 05/29/2001 | US6239486 Semiconductor device having cap |
| 05/29/2001 | US6239485 Reduced cross-talk noise high density signal interposer with power and ground wrap |
| 05/29/2001 | US6239484 Underfill of chip-under-chip semiconductor modules |
| 05/29/2001 | US6239483 Semiconductor device |
| 05/29/2001 | US6239482 Integrated circuit package including window frame |
| 05/29/2001 | US6239480 Modified lead frame for improved parallelism of a die to package |
| 05/29/2001 | US6239479 Thermal neutron shielded integrated circuits |
| 05/29/2001 | US6239461 Semiconductor device capacitor having a recessed contact plug |
| 05/29/2001 | US6239402 Polycrystalline structure of incorporatesd aluminum nitride crystals and magnesium oxide to improve corrosion resistance against halogen-based corrosive gases; heat-insulating |
| 05/29/2001 | US6239384 Microelectric lead structures with plural conductors |
| 05/29/2001 | US6239383 Ball-grid array IC packaging frame |
| 05/29/2001 | US6239382 Device and method of controlling the bowing of a soldered or adhesively bonded assembly |
| 05/29/2001 | US6239381 Circuit board for a semiconductor device and method of making the same |
| 05/29/2001 | US6239380 Singulation methods and substrates for use with same |
| 05/29/2001 | US6239367 Multi-chip chip scale package |
| 05/29/2001 | US6239366 Face-to-face multi-chip package |
| 05/29/2001 | US6239042 Process for realizing an intermediate dielectric layer for enhancing the planarity in semiconductor electronic devices |
| 05/29/2001 | US6239031 Stepper alignment mark structure for maintaining alignment integrity |
| 05/29/2001 | US6239029 Sacrificial germanium layer for formation of a contact |
| 05/29/2001 | US6239026 Nitride etch stop for poisoned unlanded vias |
| 05/29/2001 | US6239025 High aspect ratio contact structure for use in integrated circuits |
| 05/29/2001 | US6239024 Method of filling gap with dielectrics |
| 05/29/2001 | US6239023 Method to reduce the damages of copper lines |
| 05/29/2001 | US6239021 Dual barrier and conductor deposition in a dual damascene process for semiconductors |
| 05/29/2001 | US6239019 Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics |
| 05/29/2001 | US6239016 Multilevel interconnection in a semiconductor device and method for forming the same |
| 05/29/2001 | US6238977 Method for fabricating a nonvolatile memory including implanting the source region, forming the first spacers, implanting the drain regions, forming the second spacers, and forming a source line on the source and second spacers |
| 05/29/2001 | US6238970 Method for fabricating a DRAM cell capacitor including etching upper conductive layer with etching byproduct forming an etch barrier on the conductive pattern |
| 05/29/2001 | US6238955 Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry |
| 05/29/2001 | US6238954 COF packaged semiconductor |
| 05/29/2001 | US6238953 Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
| 05/29/2001 | US6238952 Low-pin-count chip package and manufacturing method thereof |
| 05/29/2001 | US6238951 Process for producing a sealing and mechanical strength ring between a substrate and a chip hybridized by bumps on the substrate |
| 05/29/2001 | US6238950 Integrated circuit with tightly coupled passive components |
| 05/29/2001 | US6238949 Method and apparatus for forming a plastic chip on chip package module |
| 05/29/2001 | US6238948 Controlled collapse chip connection (C4) integrated circuit package that has a fillet which seals an underfill material |
| 05/29/2001 | US6238938 Methods of making microelectronic connections with liquid conductive elements |
| 05/29/2001 | US6238533 Integrated PVD system for aluminum hole filling using ionized metal adhesion layer |