| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/21/2001 | WO2001044342A1 Sealing agent for liquid-crystal display cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element |
| 06/21/2001 | WO2001044143A1 Joint body of glass-ceramic and aluminum nitride sintered compact and method for producing the same |
| 06/21/2001 | WO2001043938A1 Microreaction systems and molding methods |
| 06/21/2001 | WO2000042659A9 System and method for esd protection |
| 06/21/2001 | US20010004651 Comprising an epoxy resin, a curing agent, and an inorganic filler in the form of porous silica having a specific surface area of 6 to 200 m2/g, a true specific gravity of 2.0 to 2.2, and a mean particle size of 2-50 micro m |
| 06/21/2001 | US20010004556 Contact structure and production method thereof and probe contact assembly using same |
| 06/21/2001 | US20010004551 No grain boundary is contained in region of wiring between upper and lower plugs; difference in thermal expansion coefficient between material of wiring and material of upper and lower plugs is so small that no void is generated |
| 06/21/2001 | US20010004550 Damascene-type interconnection structure and its production process |
| 06/21/2001 | US20010004549 Electrically blowable fuse with reduced cross-sectional area |
| 06/21/2001 | US20010004546 Heat conductive mold and manufacturing method thereof |
| 06/21/2001 | US20010004539 Dielectric layer comprising at least one polymer material selected from the group consisting of polybenzoxazole, polynorbornene, and their derivatives |
| 06/21/2001 | US20010004536 Laminated glass fabric body made by laminating a plurality of glass fabrics and impregnating with resin, semiconductor pellet disposed on wiring substrate has a plurality of projected electrodes coupled to pad electrodes |
| 06/21/2001 | US20010004477 Solution containing metal component, method of and apparatus for forming thin metal film |
| 06/21/2001 | US20010004370 Heat sink and semiconductor laser apparatus and semiconductor laser stack apparatus using the same |
| 06/21/2001 | US20010004313 Cooling unit for cooling circuit component generating heat and electronic apparatus comprising the cooling unit |
| 06/21/2001 | US20010004312 Heat sink and semiconductor laser apparatus and semiconductor laser stack apparatus using the same |
| 06/21/2001 | US20010004189 Cylindrical electrical component having two electrodes on bottom face |
| 06/21/2001 | US20010004180 Piezoelectric acoustic components and method of manufacturing the same |
| 06/21/2001 | US20010004135 Flip-chip bonded semiconductor device |
| 06/21/2001 | US20010004133 Semiconductor device and manufacturing method therefor |
| 06/21/2001 | US20010004132 Method and an arrangement relating to chip carriers |
| 06/21/2001 | US20010004131 Adhesion method and electronic component |
| 06/21/2001 | US20010004130 Semiconductor device and production method thereof |
| 06/21/2001 | US20010004129 High-frequency package |
| 06/21/2001 | US20010004128 Semiconductor package and manufacturing method thereof |
| 06/21/2001 | US20010004127 Semiconductor device and manufacturing method thereof |
| 06/21/2001 | US20010004126 Configuration for trimming reference voltages in semiconductor chips, in particular semiconductor memories |
| 06/21/2001 | US20010004125 Ultra-thin piezoelectric resonator |
| 06/21/2001 | US20010004122 Semiconductor device having dummy gates and its manufacturing method |
| 06/21/2001 | US20010004119 Non-volatile memory device and manufacturing process thereof |
| 06/21/2001 | US20010004115 Power transistor module, power amplifier and method in the fabrication thereof |
| 06/21/2001 | US20010004085 Method for hermetically encapsulating microsystems in situ |
| 06/21/2001 | US20010004021 Electronic equipment |
| 06/21/2001 | DE19960498A1 Heat sink body for electronic component has region with closed cross-section supplied with cooling medium for transfer of waste heat |
| 06/21/2001 | DE19959725A1 Integrierte elektronische Schaltung mit wenigstens einer Induktivität und Verfahren zu ihrer Herstellung Integrated electronic circuit comprising at least an inductor and process for their preparation |
| 06/21/2001 | DE10062542A1 Semiconductor chip arrangement for flip chip; has base plate metallized rear surface and source and gate contacts connected to contacts of connection frame and has casing with window near rear surface |
| 06/21/2001 | DE10059234A1 Electrically conducting paste used in the production of printed circuit boards comprises complexes produced by mixing an electrically conducting filler and a heating element, and a resin |
| 06/21/2001 | DE10019839A1 Laminate capacitor for high frequency circuit has penetration conduction bodies connected internal electrodes and peripheral conduction bodies connected to peripheries of internal electrodes |
| 06/21/2001 | CA2393781A1 Microreaction systems and molding methods |
| 06/21/2001 | CA2392837A1 Integrated circuit package formed at a wafer level |
| 06/21/2001 | CA2327734A1 Ultra-thin piezoelectric resonator |
| 06/20/2001 | EP1109432A1 Heat dissipation in electrical apparatus |
| 06/20/2001 | EP1109227A2 Via capacitor |
| 06/20/2001 | EP1109222A1 Arrangement for trimming voltage references in semiconductor chips, especially in semiconductor memories |
| 06/20/2001 | EP1109221A2 Damascene interconnection structure and method for forming the same |
| 06/20/2001 | EP1109220A2 Dielectric filling of electrical wiring levels |
| 06/20/2001 | EP1109219A2 Semiconductor device having a wiring layer |
| 06/20/2001 | EP1109218A2 Heat conducting mold and manufacturing method thereof |
| 06/20/2001 | EP1109216A1 Process of making a semiconductor device having regions of insulating material formed in a semiconductor substrate |
| 06/20/2001 | EP1109214A1 Device and method to contact circuit components |
| 06/20/2001 | EP1109213A2 Method for producing a semiconductor device |
| 06/20/2001 | EP1108766A2 Adhesion method and electronic component |
| 06/20/2001 | EP1108677A1 Method of hermetic In Situ encapsulation of microsystems |
| 06/20/2001 | EP1108348A1 A flexible circuit with conductive vias and a method of making |
| 06/20/2001 | EP1108267A1 Capacitors comprising roughened platinum layers, methods of forming roughened layers of platinum and methods of forming capacitors |
| 06/20/2001 | EP1021688A4 Multiple electrostatic gas phase heat pump and method |
| 06/20/2001 | CN1300362A Packaged device |
| 06/20/2001 | CN1300301A Reworkable thermosetting resin composition |
| 06/20/2001 | CN1300180A Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly |
| 06/20/2001 | CN1300133A Lead terminal and electronic device including terminal |
| 06/20/2001 | CN1300101A Carrier-belt automatic bonding type semiconductor device |
| 06/20/2001 | CN1300100A Surface mounting element and mounting structure for surface mounting element |
| 06/20/2001 | CN1299993A Cooling unit for cooling heating circuit assembly and electronic apparatus including said cooling unit |
| 06/19/2001 | US6249472 Semiconductor memory device with antifuse |
| 06/19/2001 | US6249452 Semiconductor device having offset twisted bit lines |
| 06/19/2001 | US6249440 Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board |
| 06/19/2001 | US6249437 Heat sink with offset fin profile |
| 06/19/2001 | US6249436 Wire heat sink assembly and method of assembling |
| 06/19/2001 | US6249433 Heat-dissipating device for integrated circuit package |
| 06/19/2001 | US6249330 Display device and manufacturing method |
| 06/19/2001 | US6249173 Temperature stabilizing circuit |
| 06/19/2001 | US6249136 Bottom side C4 bumps for integrated circuits |
| 06/19/2001 | US6249117 Phosphosilicate glass layer containing phosphorus formed in the sio2 layer for providing the stabilized wafer by stabilizing an sio2 interface and containing oxygen ions. |
| 06/19/2001 | US6249056 Low resistance interconnect for a semiconductor device and method of fabricating the same |
| 06/19/2001 | US6249055 Self-encapsulated copper metallization |
| 06/19/2001 | US6249054 Semiconductor memory device with a stacked capacitance structure |
| 06/19/2001 | US6249053 Chip package and method for manufacturing the same |
| 06/19/2001 | US6249052 Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration |
| 06/19/2001 | US6249051 Composite bump flip chip bonding |
| 06/19/2001 | US6249050 Encapsulated transfer molding of a semiconductor die with attached heat sink |
| 06/19/2001 | US6249049 Ceramic package type electronic part which is high in connection strength to electrode |
| 06/19/2001 | US6249048 Polymer stud grid array |
| 06/19/2001 | US6249047 Ball array layout |
| 06/19/2001 | US6249046 Semiconductor device and method for manufacturing and mounting thereof, and circuit board mounted with the semiconductor device |
| 06/19/2001 | US6249045 Tented plated through-holes and method for fabrication thereof |
| 06/19/2001 | US6249044 Opaque metallization to cover flip chip die surface for light sensitive semiconductor devices |
| 06/19/2001 | US6249043 Resin-sealed type semiconductor device, and method of manufacturing the same |
| 06/19/2001 | US6249042 Member for lead |
| 06/19/2001 | US6249041 IC chip package with directly connected leads |
| 06/19/2001 | US6249039 Integrated inductive components and method of fabricating such components |
| 06/19/2001 | US6249038 Method and structure for a semiconductor fuse |
| 06/19/2001 | US6249037 Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry |
| 06/19/2001 | US6249036 Stepper alignment mark formation with dual field oxide process |
| 06/19/2001 | US6249032 Semiconductor device having patterned metal layer over a polysilicon line and method of fabrication thereof |
| 06/19/2001 | US6249024 Power module with repositioned positive and reduced inductance and capacitance |
| 06/19/2001 | US6249015 Semiconductor device and fabrication method thereof |
| 06/19/2001 | US6249014 Hydrogen barrier encapsulation techniques for the control of hydrogen induced degradation of ferroelectric capacitors in conjunction with multilevel metal processing for non-volatile integrated circuit memory devices |
| 06/19/2001 | US6249010 Dielectric-based anti-fuse cell with polysilicon contact plug and method for its manufacture |
| 06/19/2001 | US6248973 Laser marking method for semiconductor wafer |
| 06/19/2001 | US6248962 Electrically conductive projections of the same material as their substrate |