| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/27/2001 | EP1111672A2 Semiconductor chip assemblies, methods of making same and components for same |
| 06/27/2001 | EP1111671A2 Process for fabricating a semiconductor device |
| 06/27/2001 | EP1111670A2 Device for the separation of semiconductor dies from a semiconductor wafer |
| 06/27/2001 | EP1111669A1 Method for making isolated metal interconnects in integrated circuits |
| 06/27/2001 | EP1111667A1 Semiconductor device and method for manufacturing the same |
| 06/27/2001 | EP1111664A2 Process and apparatus for the deposition of dielectric layers |
| 06/27/2001 | EP1111662A2 Apparatus and method for aligning semiconductor die to interconnect metal on flex substrate and product therefrom |
| 06/27/2001 | EP1110905A1 Micro-electromechanical device |
| 06/27/2001 | EP1110428A1 Low power compact heater for piezoelectric device |
| 06/27/2001 | EP1110243A1 Integrated component, composite body consisting of an integrated component and a conductive structure, chip card and method for producing the integrated component |
| 06/27/2001 | EP1110242A1 Thermal capacity for electronic component operating in long pulses |
| 06/27/2001 | EP1110241A1 Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristics |
| 06/27/2001 | EP1110238A1 Method of etching doped silicon dioxide with selectivity to undoped silicon dioxide with a high density plasma etcher |
| 06/27/2001 | EP1110226A2 Isolator |
| 06/27/2001 | CN1301479A Multiple printed panel for electronic components, and method for constructing bumps, soldering frames, spaces and similiar on said multiple printed panel |
| 06/27/2001 | CN1301399A Reflective sensor |
| 06/27/2001 | CN1301083A Method and apparatus for manufacture of electronic components, and method for driving the apparatus |
| 06/27/2001 | CN1301040A Semiconductor and manufacture thereof |
| 06/27/2001 | CN1301039A Device and method for aligning pipe core with interconnecting metal on flexible substrate, and products thereof |
| 06/27/2001 | CN1067804C Method for making self-aligning silicide |
| 06/26/2001 | US6253362 Method of designing dummy wiring |
| 06/26/2001 | US6252776 Heat radiating member for heat generating device |
| 06/26/2001 | US6252774 Multi-device heat sink assembly |
| 06/26/2001 | US6252773 Heat sink attachment apparatus and method |
| 06/26/2001 | US6252772 Removable heat sink bumpers on a quad flat package |
| 06/26/2001 | US6252771 Removable remote control amplifier |
| 06/26/2001 | US6252761 Embedded multi-layer ceramic capacitor in a low-temperature con-fired ceramic (LTCC) substrate |
| 06/26/2001 | US6252760 Discrete silicon capacitor |
| 06/26/2001 | US6252427 CMOS inverter and standard cell using the same |
| 06/26/2001 | US6252308 Packaged die PCB with heat sink encapsulant |
| 06/26/2001 | US6252307 Structure for preventing adhesive bleed onto surfaces |
| 06/26/2001 | US6252306 Method of producing semiconductor device and configuration thereof, and lead frame used in said method |
| 06/26/2001 | US6252303 Intergration of low-K SiOF as inter-layer dielectric |
| 06/26/2001 | US6252302 Heat transfer material for an improved die edge contacting socket |
| 06/26/2001 | US6252301 Compliant semiconductor chip assemblies and methods of making same |
| 06/26/2001 | US6252300 Direct contact through hole type wafer structure |
| 06/26/2001 | US6252299 Stacked semiconductor device including improved lead frame arrangement |
| 06/26/2001 | US6252298 Semiconductor chip package using flexible circuit board with central opening |
| 06/26/2001 | US6252295 Adhesion of silicon carbide films |
| 06/26/2001 | US6252294 Semiconductor device and semiconductor storage device |
| 06/26/2001 | US6252293 Laser antifuse using gate capacitor |
| 06/26/2001 | US6252292 Vertical electrical cavity-fuse |
| 06/26/2001 | US6252291 Modifiable semiconductor circuit element |
| 06/26/2001 | US6252266 Field effect transistor with comb electrodes and via holes |
| 06/26/2001 | US6252247 Thin film transistor, a method for producing the thin film transistor, and a liquid crystal display using a TFT array substrate |
| 06/26/2001 | US6252178 Semiconductor device with bonding anchors in build-up layers |
| 06/26/2001 | US6252175 Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate |
| 06/26/2001 | US6252012 Method for producing a diffusion barrier and polymeric article having a diffusion barrier |
| 06/26/2001 | US6252010 Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor device |
| 06/26/2001 | US6251978 Conductive composite material |
| 06/26/2001 | US6251798 Formation of air gap structures for inter-metal dielectric application |
| 06/26/2001 | US6251786 Method to create a copper dual damascene structure with less dishing and erosion |
| 06/26/2001 | US6251781 Method to deposit a platinum seed layer for use in selective copper plating |
| 06/26/2001 | US6251775 Self-aligned copper silicide formation for improved adhesion/electromigration |
| 06/26/2001 | US6251774 Method of manufacturing a semiconductor device |
| 06/26/2001 | US6251773 Method of designing and structure for visual and electrical test of semiconductor devices |
| 06/26/2001 | US6251769 Method of manufacturing contact pad |
| 06/26/2001 | US6251768 Method of arranging the staggered shape bond pads layers for effectively reducing the size of a die |
| 06/26/2001 | US6251766 Method for improving attachment reliability of semiconductor chips and modules |
| 06/26/2001 | US6251760 Semiconductor device and its wiring and a fabrication method thereof |
| 06/26/2001 | US6251745 Two-dimensional scaling method for determining the overlay error and overlay process window for integrated circuits |
| 06/26/2001 | US6251740 Method of forming and electrically connecting a vertical interdigitated metal-insulator-metal capacitor extending between interconnect layers in an integrated circuit |
| 06/26/2001 | US6251710 Method of making a dual damascene anti-fuse with via before wire |
| 06/26/2001 | US6251709 Method of manufacturing a cooling structure of a multichip module |
| 06/26/2001 | US6251708 Hybrid frame with lead-lock tape |
| 06/26/2001 | US6251707 Electrically connecting semiconductor chip to wiring surfaceusing pattern |
| 06/26/2001 | US6251706 Method for cooling the backside of a semiconductor device using an infrared transparent heat slug |
| 06/26/2001 | US6251705 Low profile integrated circuit packages |
| 06/26/2001 | US6251704 Method of manufacturing semiconductor devices having solder bumps with reduced cracks |
| 06/26/2001 | US6251703 CMS coated microelectronic component and its method of manufacture |
| 06/26/2001 | US6251702 Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device |
| 06/26/2001 | US6251696 Method of forming integrated circuit with evaluation contacts electrically connected by forming via holes through the chip, and bonding the chip with a substrate |
| 06/26/2001 | US6251695 Multichip module packaging process for known good die burn-in |
| 06/26/2001 | US6251694 Method of testing and packaging a semiconductor chip |
| 06/26/2001 | US6251501 Surface mount circuit device and solder bumping method therefor |
| 06/26/2001 | US6251471 Milling at least one trough to a depth of at least 0.005? in said substrate, filling trough with conductive film, metalizing conductive film by firing, forming at least one solid electrical trace, placing o-ring across trace |
| 06/26/2001 | US6251469 Method of rendering a substrate selectively non-wettable chip carrier with enhanced wire bondability |
| 06/26/2001 | US6251211 Circuitry interconnection method |
| 06/26/2001 | US6251199 Copper alloy having improved resistance to cracking due to localized stress |
| 06/26/2001 | US6250606 Substrate for semiconductor device, semiconductor device and manufacturing method thereof |
| 06/26/2001 | US6250541 Method of forming interconnections on electronic modules |
| 06/26/2001 | US6250375 Clip for securing heat sink to electronic device |
| 06/26/2001 | US6250192 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 06/26/2001 | US6250085 Temperature self-regulated integrated circuits and devices |
| 06/21/2001 | WO2001045480A1 A method and an arrangement relating to chip carriers |
| 06/21/2001 | WO2001045476A1 A module including one or more chips |
| 06/21/2001 | WO2001045172A1 Method and device for interconnecting electronic components in three dimensions |
| 06/21/2001 | WO2001045171A1 Ldmos power package with resistive-capacitive stabilizing element |
| 06/21/2001 | WO2001045170A1 An integrated circuit with a serpentine conductor track for circuit selection |
| 06/21/2001 | WO2001045169A1 Power transistor module, power amplifier and methods in the fabrication thereof |
| 06/21/2001 | WO2001045168A1 Power transistor module, power amplifier and method in the fabrication thereof |
| 06/21/2001 | WO2001045167A2 Integrated circuit package formed at a wafer level |
| 06/21/2001 | WO2001045166A2 Encasing arrangement for a semiconductor component |
| 06/21/2001 | WO2001045165A1 Bonding pad and support structure and method for their fabrication |
| 06/21/2001 | WO2001045164A1 Method for interconnecting integrated circuits |
| 06/21/2001 | WO2001045163A1 Stromrichter device comprising a two phase heat transport device |
| 06/21/2001 | WO2001045159A1 System and method for contacting switching circuits |
| 06/21/2001 | WO2001045152A1 Plasma processing of tungsten using a gas mixture comprising a fluorinated gas and oxygen |
| 06/21/2001 | WO2001045149A1 Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst |
| 06/21/2001 | WO2001044373A1 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |