H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2013
11/14/2013	US20130299960 Thermally enhanced semiconductor packages and related methods
11/14/2013	US20130299959 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
11/14/2013	US20130299958 Lead structures with vertical offsets
11/14/2013	US20130299957 Semiconductor device
11/14/2013	US20130299956 Semiconductor device manufacturing method and semiconductor device
11/14/2013	US20130299955 Film based ic packaging method and a packaged ic device
11/14/2013	US20130299953 Method for lower thermal budget multiple cures in semiconductor packaging
11/14/2013	US20130299950 Semiconductor structure with buried through substrate vias
11/14/2013	US20130299949 Through Silicon Via and Method of Forming the Same
11/14/2013	US20130299948 Semiconductor device
11/14/2013	US20130299947 Passivated test structures to enable saw singulation of wafer
11/14/2013	US20130299940 Beol anti-fuse structures for gate last semiconductor devices
11/14/2013	US20130299845 Semiconductor device, semiconductor device module and method of fabricating semiconductor device
11/14/2013	US20130299843 Semiconductor device
11/14/2013	US20130299559 Ultrasonic bonding systems and methods of using the same
11/14/2013	US20130299226 Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
11/14/2013	US20130299218 Multilayer printed wiring board
11/14/2013	DE19800574B4 Mikromechanisches Bauelement Micromechanical component
11/14/2013	DE112011104880T5 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
11/14/2013	DE102013208350A1 Herstellungsverfahren für einen kühler Manufacturing method for a radiator
11/14/2013	DE102013104952A1 Halbleiterpackages und Verfahren zu deren Ausbildung Semiconductor packages and methods of training
11/14/2013	DE102013100611A1 Integrally-formed multi-layer light emitting device has lead frame with conductive rods arranged in sleeve, so that rod ends are extended from sleeve, and rods are connected to light emitting chip by metal-wire bonding
11/14/2013	DE102012208033A1 Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung Hybrid integrated component and method for its production
11/14/2013	DE102012208032A1 Hybrid integriertes Bauteil Hybrid integrated component
11/14/2013	DE102012208031A1 +Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung + Hybrid integrated component and method for its production
11/14/2013	DE102012207772A1 Varistor paste for forming geometric flexible varistor for electronic component device, comprises carrier matrix consisting of electrical insulative material that exhibits varistor properties and is selected from elastomer
11/14/2013	DE102012207678A1 Vorrichtung zum formen einer gehäusestruktur für eine mehrzahl von elektronischen bauteilen und gehäusestruktur für eine mehrzahl von elektronischen bauteilen An apparatus for forming a housing structure for a plurality of electronic components and housing structural components for a plurality of electronic
11/14/2013	DE102012207675A1 Anordnung zur Wärmeableitung für ein Kunststoffgehäuse mit darin angeordneten elektronischen Bauelementen Arrangement for heat dissipation for a plastic housing with electronic components therein
11/14/2013	DE102012108666B3 Vorrichtung und Verfahren für ein Carbon Nanotube-Interconnect mit niedrigem Übergangswiderstand Apparatus and method for a carbon nanotube interconnect with low contact resistance
11/14/2013	DE102012104903A1 Verfahren zum Herstellen von Metall-Keramik-Substraten sowie nach diesem Verfahren hergestelltes Metall-Keramik-Substrat A method for producing metal-ceramic substrates and manufactured by this process the metal-ceramic substrate
11/14/2013	DE102010038746B4 Verfahren zum Reduzieren der Topographie in Isolationsgebieten eines Halbleiterbauelements durch Anwenden einer Abscheide/Ätzsequenz vor der Herstellung des Zwischenschichtdielektrikums A method of reducing topography in insulation regions of a semiconductor device by applying a deposition / etch sequence before making the interlayer dielectric
11/14/2013	DE102004048238B4 Feldeffekttransistor mit geknicktem oder gebogenem Gatebereich in einer Fuselatch-Schaltung Field-effect transistor with kinked or bent gate area in a Fuselatch circuit
11/13/2013	EP2663070A1 Image sensor module for a camera, and method and bending tool for producing same
11/13/2013	EP2662893A1 Semiconductor device and manufacturing method thereof
11/13/2013	EP2662892A2 Stacked interposer leadframes
11/13/2013	EP2662891A1 Aluminium coated copper bond wire and method of making the same
11/13/2013	EP2662890A1 Aluminium coated copper bond wire and method of making the same
11/13/2013	EP2662889A1 Aluminium coated copper ribbon
11/13/2013	EP2662888A1 Methods for protecting a die surface with photocurable materials
11/13/2013	EP2662413A2 Curable composition
11/13/2013	EP2662412A2 Curable composition
11/13/2013	EP2662411A2 Curable composition
11/13/2013	EP2662410A2 Curable composition
11/13/2013	EP2661771A1 Alternative surface finishes for flip-chip ball grid arrays
11/13/2013	EP2661770A1 Electronic assembly with improved thermal management
11/13/2013	EP2661598A1 Cooling system and method for cooling a heat generating unit
11/13/2013	EP2661560A1 Synthetic jet packaging
11/13/2013	CN203289815U Speedy radiator
11/13/2013	CN203289802U Fan-shaped heat-radiating fins
11/13/2013	CN203288623U Photovoltaic wiring box with improved conducting assembly
11/13/2013	CN203288621U Photovoltaic wiring box
11/13/2013	CN203288601U Thin film transistor pixel structure, array substrate and display device
11/13/2013	CN203288597U Insulated gate bipolar transistor
11/13/2013	CN203288589U Combined ultrathin diode
11/13/2013	CN203288588U Chip stacking structure with pins
11/13/2013	CN203288587U Power semiconductor module system
11/13/2013	CN203288586U Double-layer shallow cavity type circuit package casing
11/13/2013	CN203288585U A wafer electroplated nickel gold product
11/13/2013	CN203288584U 半导体装置 Semiconductor device
11/13/2013	CN203288583U Novel jumper wire
11/13/2013	CN203288582U Diode assembly with improved lower lead structure
11/13/2013	CN203288581U Recess-containing electrode pad
11/13/2013	CN203288580U Packaging structure for radiofrequency chip
11/13/2013	CN203288579U Wafer encapsulation structure
11/13/2013	CN203288578U Dissipation sheet module with microgroove flat heat tubes
11/13/2013	CN203288577U IGBT liquid cooling radiator structure for extra-high voltage flexible DC power transmission
11/13/2013	CN203288576U System with power semiconductor module and driving device
11/13/2013	CN203288575U Semiconductor device
11/13/2013	CN103392230A Semiconductor device and method for manufacturing semiconductor device
11/13/2013	CN103392229A Electronic component package, electronic component, and method for manufacturing electronic component package
11/13/2013	CN103392210A Moistureproof insulation material
11/13/2013	CN103392198A Electrode substrate and display device and touch panel comprising same
11/13/2013	CN103391017A Power conversion apparatus
11/13/2013	CN103390618A Embedded gate-grounded N-channel metal oxide semiconductor (NMOS)-triggered silicon-controlled transient voltage suppressor
11/13/2013	CN103390612A Semiconductor device, semiconductor device module and method of fabricating semiconductor device
11/13/2013	CN103390611A Single-ended inductor
11/13/2013	CN103390610A Electronic component module and method for manufacturing same
11/13/2013	CN103390609A Semiconductor device and forming method thereof
11/13/2013	CN103390608A Conductive structure and method for forming the same
11/13/2013	CN103390607A 铜互连结构及其形成方法 Copper interconnect structure and method of forming
11/13/2013	CN103390606A 半导体器件 Semiconductor devices
11/13/2013	CN103390605A Inductor
11/13/2013	CN103390604A Semiconductor device manufacturing method and semiconductor device
11/13/2013	CN103390603A Lead frame and semiconductor device package using the lead frame
11/13/2013	CN103390602A Semiconductor package and packaging substrate
11/13/2013	CN103390601A Chip package and method for forming the same
11/13/2013	CN103390600A Semiconductor package and fabrication method thereof
11/13/2013	CN103390599A Chip-on-film device
11/13/2013	CN103390598A Semiconductor package and fabrication method thereof
11/13/2013	CN103390597A 半导体装置 Semiconductor device
11/13/2013	CN103390596A Insulation packaging device of semiconductor and manufacturing method of insulation packaging device
11/13/2013	CN103390595A Ruggedized photonic crystal sensor packaging
11/13/2013	CN103390594A Multichip flip-chip encapsulation module and related manufacturing method
11/13/2013	CN103390593A Semiconductor substrate and manufacturing method thereof
11/13/2013	CN103390579A Layout design with via routing structure
11/13/2013	CN103390577A Low K dielectric barrier layer and forming method thereof
11/13/2013	CN103390576A 铜互连结构及其形成方法 Copper interconnect structure and method of forming
11/13/2013	CN103390565A Electric connecting structure comprising preferred oriented Cu6Sn5 grains and method for fabricating the same
11/13/2013	CN103390564A Film based IC packaging method and packaged IC device
11/13/2013	CN103390563A Metal circuit board structure and technique of flip chip of firstly-packaged and then-etched three-dimensional system level

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