| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/05/2001 | WO2000004579A9 Process for mapping metal contaminant concentration on a silicon wafer surface |
| 07/05/2001 | US20010007151 Fully integrated tuner architecture |
| 07/05/2001 | US20010007092 Method in an integrated circuit (IC) manufacturing process for indentifying and redirecting IC's mis-processed during their manufacture |
| 07/05/2001 | US20010006868 Electrically insulating non-woven fabric, a prepreg and a laminate |
| 07/05/2001 | US20010006847 Connectors in flash memory |
| 07/05/2001 | US20010006846 Method and structure for bonding layers in a semiconductor device |
| 07/05/2001 | US20010006841 Process for forming a metal interconnect |
| 07/05/2001 | US20010006830 Method of producing a semiconductor device |
| 07/05/2001 | US20010006828 Coupling semiconductor dies to shelves |
| 07/05/2001 | US20010006759 Radiation sensitive compositions |
| 07/05/2001 | US20010006715 Transferrable compliant fibrous thermal interface |
| 07/05/2001 | US20010006701 Chemical vapor deposition (CVD); trimethylvinylsilyl hexafluoroacetylacetonate (hfac) copper(I) with small deposition rate and allyltrimethylsilyl (hfac) copper(I) with large deposition rate to form copper interconnect film |
| 07/05/2001 | US20010006456 Method of manufacturing electronic parts |
| 07/05/2001 | US20010006455 Method for mounting semiconductor device and structure thereof |
| 07/05/2001 | US20010006454 Heat sink clip |
| 07/05/2001 | US20010006259 Semiconductor device and method of producing the same |
| 07/05/2001 | US20010006258 Stacked semiconductor package and fabricating method thereof |
| 07/05/2001 | US20010006257 Method of fabricating a three-dimensional system-on-chip and its structure |
| 07/05/2001 | US20010006256 Semiconductor device |
| 07/05/2001 | US20010006255 Semiconductor device having improved metal line structure and manufacturing method therefor |
| 07/05/2001 | US20010006253 Components with releasable leads and methods of making releasable leads |
| 07/05/2001 | US20010006252 Stacked microelectronic assembly and method therefor |
| 07/05/2001 | US20010006251 Semiconductor device and manufacturing method |
| 07/05/2001 | US20010006250 Leadframe and semiconductor chip package having cutout portions and increased lead count |
| 07/05/2001 | US20010006249 Co-planar si and ge composite substrate and method of producing same |
| 07/05/2001 | US20010006243 Input-output protection device for semiconductor integrated circuit |
| 07/05/2001 | US20010006233 Semiconductor devices having backside probing capability |
| 07/05/2001 | US20010006119 Circuit board-providing article, circuit board, semiconductor device and process for the production of the same |
| 07/05/2001 | US20010006114 Curved ceramic moulded part |
| 07/05/2001 | US20010006101 Extended air cooling with heat loop for dense or compact configurations of electronic components |
| 07/05/2001 | US20010006041 Method and apparatus for application of spray adhesive to a leadframe for chip bonding |
| 07/05/2001 | US20010005936 Electrically conductive paste and method of forming circuit |
| 07/05/2001 | DE19962628A1 Surface-mount-device (SMD) type semiconductor device for LSI integrated circuits |
| 07/05/2001 | DE19961116A1 Leiterplattenanordnung Printed circuit board assembly |
| 07/05/2001 | DE19961103A1 Dielektrische Füllung von elektrischen Verdrahtungsebenen Dielectric filling of electrical wiring levels |
| 07/05/2001 | DE19960841A1 Stromrichtergerät mit einer Zweiphasen-Wärmetransportvorrichtung The converter assembly with a two-phase heat transport apparatus |
| 07/05/2001 | DE19960249A1 Verfahren zur Herstellung eines Halbleiterbausteins A process for producing a semiconductor device |
| 07/05/2001 | DE19960246A1 Gehäuseanordnung eines Halbleiterbausteins Housing arrangement of a semiconductor device |
| 07/05/2001 | DE19958906A1 Herstellung von integrierten Schaltungen Manufacture of integrated circuits |
| 07/05/2001 | DE19926499C2 Anordnung von Fuses bei Halbleiterstrukturen mit Cu-Metallisierung Arrangement of fuses in semiconductor structures with Cu metallization |
| 07/05/2001 | DE10039185A1 Semiconductor device with electrical fuse for memory circuit, makes thin insulating film available on surface of active zone for functioning as electrical fuse |
| 07/04/2001 | EP1113497A2 Semiconductor package with conductor impedance selected during assembly |
| 07/04/2001 | EP1113496A1 Heatsink, and semiconductor laser device and semiconductor laser stack using heatsink |
| 07/04/2001 | EP1113495A2 Surface mounted power transistor with heat sink |
| 07/04/2001 | EP1113490A2 Resin sealing method for semiconductors and release film used therefor |
| 07/04/2001 | EP1112674A1 Laminates for encapsulating devices |
| 07/04/2001 | EP1112672A1 Low-impedance high-density deposited-on-laminate structures having reduced stress |
| 07/04/2001 | EP1112612A1 Array with light-emitting power semiconductor component and corresponding production method |
| 07/04/2001 | EP1112592A1 Semiconductor device and method of manufacturing same |
| 07/04/2001 | EP1112125A2 Metallization structures for microelectronic applications and process for forming the structures |
| 07/04/2001 | EP0764393B1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
| 07/04/2001 | CN2438271Y Bidirectional thyristor relay |
| 07/04/2001 | CN1302455A Laminated integrated circuit package |
| 07/04/2001 | CN1302254A Low K dielectric inorganic/organic hybrid films and method of making |
| 07/04/2001 | CN1302177A Flexible wiring board and electronic device using said board |
| 07/04/2001 | CN1302083A Surface mounting assembly including terminal at side |
| 07/04/2001 | CN1301880A Self ionizing plasma for sputter copper |
| 07/04/2001 | CN1301665A Some improvement of micro electromechanical device |
| 07/04/2001 | CN1068064C Conducting wire frame and method for producing same |
| 07/03/2001 | US6256207 Chip-sized semiconductor device and process for making same |
| 07/03/2001 | US6256206 Electronic circuit for an active implantable medical device and method of manufacture |
| 07/03/2001 | US6256203 Free standing, three dimensional, multi-chip, carrier package with air flow baffle |
| 07/03/2001 | US6256202 Integrated circuit intercoupling component with heat sink |
| 07/03/2001 | US6256201 Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe |
| 07/03/2001 | US6256200 Symmetrical package for semiconductor die |
| 07/03/2001 | US6256199 Integrated circuit cartridge and method of fabricating the same |
| 07/03/2001 | US6256189 Heat slug design which facilitates mounting of discrete components on a package without losing lands or pins in the package |
| 07/03/2001 | US6255742 Semiconductor package incorporating heat dispersion plate inside resin molding |
| 07/03/2001 | US6255741 Semiconductor device with a protective sheet to affix a semiconductor chip |
| 07/03/2001 | US6255740 Semiconductor device having a lead portion with outer connecting terminals |
| 07/03/2001 | US6255739 Semiconductor device |
| 07/03/2001 | US6255738 Filled curable polysiloxane encapsulants having bi- and tri-modal particle packing distributions of filler particles covalently bonded to polysiloxane chain; increased tensile strength and solvent resistance |
| 07/03/2001 | US6255737 Semiconductor device and method of making the same, circuit board, and electronic instrument |
| 07/03/2001 | US6255736 Three-dimensional MCM, method for manufacturing the same, and storage medium storing data for the method |
| 07/03/2001 | US6255735 Dual damascene arrangement for metal interconnection with low k dielectric constant materials in dielectric layers |
| 07/03/2001 | US6255734 Passivated copper line semiconductor device structure |
| 07/03/2001 | US6255733 Copper and less than 5% niobium or palladium; oxidation and corrosion resistance; nondiffusing; low electical resistance; transistors; capacitors |
| 07/03/2001 | US6255732 Semiconductor device and process for producing the same |
| 07/03/2001 | US6255731 SOI bonding structure |
| 07/03/2001 | US6255730 Integrated low cost thick film RF module |
| 07/03/2001 | US6255729 Multi chip package (MCP) applicable to failure analysis mode |
| 07/03/2001 | US6255726 Vertical interconnect process for silicon segments with dielectric isolation |
| 07/03/2001 | US6255723 Layered lead structures |
| 07/03/2001 | US6255722 High current capacity semiconductor device housing |
| 07/03/2001 | US6255720 Modified bus bar with Kapton tape or insulative material on LOC packaged part |
| 07/03/2001 | US6255719 Semiconductor device including thermal neutron absorption material |
| 07/03/2001 | US6255715 Fuse window guard ring structure for nitride capped self aligned contact processes |
| 07/03/2001 | US6255712 Semi-sacrificial diamond for air dielectric formation |
| 07/03/2001 | US6255706 Thin film transistor and method of manufacturing same |
| 07/03/2001 | US6255701 Semiconductor device containing local interconnection and method of manufacturing the same |
| 07/03/2001 | US6255697 Integrated circuit devices including distributed and isolated dummy conductive regions |
| 07/03/2001 | US6255686 Semiconductor storage device including short circuit avoiding structure and method of fabricating thereof |
| 07/03/2001 | US6255685 Semiconductor device and method of manufacturing the same |
| 07/03/2001 | US6255671 Metal embedded passivation layer structure for microelectronic interconnect formation, customization and repair |
| 07/03/2001 | US6255601 Conductive feedthrough for a ceramic body and method of fabricating same |
| 07/03/2001 | US6255600 Electronic interconnection medium having offset electrical mesh plane |
| 07/03/2001 | US6255599 Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination |
| 07/03/2001 | US6255586 Interlocked bonding pad structures and methods of fabrication therefor |
| 07/03/2001 | US6255579 Method and apparatus for utilizing heat dissipated from an electrical device |
| 07/03/2001 | US6255409 Epoxy resin composition and resin-encapsulated semiconductor device |