| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/03/2001 | US6255376 Thermoconductive filler particles dispersed within a thermoplastic carrier resin including a dispersant having both hydrophilic and hydrophobic groups whereby thermal expansion stress is relieved by the low temperature plasticity |
| 07/03/2001 | US6255365 Rapid curability and fluidity, solder crack resistance |
| 07/03/2001 | US6255218 Semiconductor device and fabrication method thereof |
| 07/03/2001 | US6255217 Plasma treatment to enhance inorganic dielectric adhesion to copper |
| 07/03/2001 | US6255213 Method of forming a structure upon a semiconductive substrate |
| 07/03/2001 | US6255212 Method of making a void-free aluminum film |
| 07/03/2001 | US6255210 Semiconductor dielectric structure and method for making the same |
| 07/03/2001 | US6255196 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 07/03/2001 | US6255192 Methods for barrier layer formation |
| 07/03/2001 | US6255189 Method of manufacturing a semiconductor device in a silicon body, a surface of said silicon body being provided with an alignment grating and an at least partly recessed oxide pattern |
| 07/03/2001 | US6255156 Method for forming porous silicon dioxide insulators and related structures |
| 07/03/2001 | US6255151 Semiconductor integrated circuit device and method of manufacturing same |
| 07/03/2001 | US6255144 Repairing fuse for semiconductor device and method for fabricating the same |
| 07/03/2001 | US6255143 Flip chip thermally enhanced ball grid array |
| 07/03/2001 | US6255141 Method of packaging fuses |
| 07/03/2001 | US6255140 Flip chip chip-scale package |
| 07/03/2001 | US6255139 Method for providing a thermal path through particles embedded in a thermal cap |
| 07/03/2001 | US6255137 Method for making air pockets in an HDI context |
| 07/03/2001 | US6255136 Method of making electronic package with compressible heatsink structure |
| 07/03/2001 | US6255135 Quad flat pack integrated circuit package |
| 07/03/2001 | US6255125 Method and apparatus for compensating for critical dimension variations in the production of a semiconductor wafer |
| 07/03/2001 | US6254972 Polytetrafluoroethylene matrix containing particules overlaying conductive layer |
| 07/03/2001 | US6254971 Resin-having metal foil for multilayered wiring board, process for producing the same, multilayered wiring board, and electronic device |
| 07/03/2001 | US6254423 Power diode terminal holder mounting arrangement |
| 07/03/2001 | US6254415 Zero insertion force electrical connector |
| 07/03/2001 | US6254107 Electrically conductive seal and a process for the manufacture thereof |
| 07/03/2001 | US6253986 Solder disc connection |
| 07/03/2001 | US6253838 Clad casing for laptop computers and the like |
| 07/03/2001 | US6253836 Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus |
| 07/03/2001 | US6253835 Isothermal heat sink with converging, diverging channels |
| 07/03/2001 | US6253834 Apparatus to enhance cooling of electronic device |
| 07/03/2001 | US6253829 Heat sink, and process and apparatus for manufacturing the same |
| 07/03/2001 | US6253556 Electrical system with cooling or heating |
| 07/03/2001 | US6253452 Method for manufacturing cylindrical radiator |
| 07/03/2001 | CA2206786C Electronic module of extra-thin construction |
| 06/28/2001 | WO2001047333A2 Integrated convection and conduction heat sink for multiple mounting positions |
| 06/28/2001 | WO2001047018A1 Electrostatic discharge proteciton network having distributed components connected with inductors |
| 06/28/2001 | WO2001047016A1 Method and apparatus for encoding information in an ic package |
| 06/28/2001 | WO2001047015A2 Electronic component protection devices and methods |
| 06/28/2001 | WO2001047014A1 Organic flip chip packages with an array of through hole pins |
| 06/28/2001 | WO2001047013A1 Organic packages with solders for reliable flip chip connections |
| 06/28/2001 | WO2001047008A1 Pad metallization over active circuitry |
| 06/28/2001 | WO2001046320A1 Encapsulant compositions with thermal shock resistance |
| 06/28/2001 | WO2001004941B1 Fabrication process for dishing-free cu damascene structures |
| 06/28/2001 | WO2000068972A3 Method of creating an electrical interconnect device bearing an array of electrical contact pads |
| 06/28/2001 | US20010005635 Performing ashing by the use of a plasma of a mixed gas of oxygen and nitrogen |
| 06/28/2001 | US20010005633 Providing in core and monitor areas a select oxide layer, a select gate layer, an insulating layer, a control gate layer, and a cap layer on the substrate, placing a mask over core and monitor areas, performing second gate etch |
| 06/28/2001 | US20010005632 Laminating a first insulating layer containing carbon and a second insulating layer containing carbon on a substrate, patterning the second insulating layer into a preset shape, forming grooves in first layer by etching with reactive gas |
| 06/28/2001 | US20010005629 Depositing barrier/wetting layer over surfaces of aperture, the barrier/wetting layer comprising tantalum, tantalum nitride, tungsten, tungsten nitride, and combinations thereof, depositing a conformal metal layer over the surface |
| 06/28/2001 | US20010005628 Method of fabricating semiconductor device |
| 06/28/2001 | US20010005627 Semiconductor device and method of fabricating the same |
| 06/28/2001 | US20010005624 Semiconductor integrated circuit device and process for manufacturing the same |
| 06/28/2001 | US20010005617 Dicing configuration for separating a semiconductor component from a semiconductor wafer |
| 06/28/2001 | US20010005604 Fuse area structure including protection film on sidewall of fuse opening in semiconductor device and method of forming the same |
| 06/28/2001 | US20010005601 Semiconductor Package Having Semiconductor Chip Within Central Aperture Of Substrate |
| 06/28/2001 | US20010005600 Method of manufacturing semiconductor device including semiconductor elements mounted on base plate |
| 06/28/2001 | US20010005599 Member for mounting of semiconductor and a method for producing thereof |
| 06/28/2001 | US20010005548 Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same |
| 06/28/2001 | US20010005314 Interconnection process for module assembly and rework |
| 06/28/2001 | US20010005313 Unit interconnection substrate, interconnection substrate, mount structure of electronic parts, electronic device, method for mounting electronic parts, and method for manufacturing electronic device |
| 06/28/2001 | US20010005312 Integral design features for heatsink attach for electronic packages |
| 06/28/2001 | US20010005311 Heat sink for chip stacking applications |
| 06/28/2001 | US20010005060 Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device |
| 06/28/2001 | US20010005059 Three-dimensional semiconductor integrated circuit apparatus and manufacturing method therefor |
| 06/28/2001 | US20010005057 Process for making integrated circuit structure with thin dielectric between at least local interconnect level and first metal interconnect level |
| 06/28/2001 | US20010005056 Multiple seed layers for metallic interconnects |
| 06/28/2001 | US20010005055 Semiconductor device and manufacturing method thereof |
| 06/28/2001 | US20010005054 Method of forming a ball bond using a bonding capillary |
| 06/28/2001 | US20010005053 Electronic part, an electronic part mounting element and an process for manufacturing such the articles |
| 06/28/2001 | US20010005052 Method of designing and structure for visual and electrical test of semiconductor devices |
| 06/28/2001 | US20010005051 Semiconductor package and semiconductor device |
| 06/28/2001 | US20010005050 Semiconductor device, method making the same, and electronic device using the same |
| 06/28/2001 | US20010005049 Memory device with multiple input/output connections |
| 06/28/2001 | US20010005048 Circuit board arrangement |
| 06/28/2001 | US20010005047 Flip chip C4 extension structure and process |
| 06/28/2001 | US20010005046 Direct contact through hole type wafer structure |
| 06/28/2001 | US20010005045 Integrated circuit chip and method for fabricating the same |
| 06/28/2001 | US20010005044 Microelectronic assemblies having exposed conductive terminals and methods therefor |
| 06/28/2001 | US20010005043 Semiconductor device and a method of manufacturing the same |
| 06/28/2001 | US20010005042 Method of manufacturing a surface mount package |
| 06/28/2001 | US20010005040 Wafer-level package |
| 06/28/2001 | US20010005039 Method and apparatus for delivering electrical power to a semiconductor die |
| 06/28/2001 | US20010005038 Integrated circuit chip and method for fabricating the same |
| 06/28/2001 | US20010005037 Semiconductor device having a multilayer interconnection structure |
| 06/28/2001 | US20010005034 Inductor with magnetic material layers |
| 06/28/2001 | US20010005025 Heterojunction bipolar transistor and its fabrication method |
| 06/28/2001 | US20010004934 Compressed mesh wick, method for manufacturing same, and plate type heat pipe including compressed mesh wick |
| 06/28/2001 | DE19959248A1 Isolationsverbesserung bei Hochleistungs-Halbleitermodulen Isolation improvement in high-power semiconductor modules |
| 06/28/2001 | DE19957844A1 Checking device for semiconductor integrated circuit arrangement on support has anisotropic leading material which electrically contacts first contacts on first surface of support |
| 06/28/2001 | DE10064042A1 Copper wiring production comprises forming intermediate insulating layer on semiconductor layer, forming contact hole and trench, depositing copper and chemical-mechanical polishing |
| 06/28/2001 | DE10064041A1 Copper wiring production comprises forming intermediate insulating layer on semiconductor layer, forming contact hole and trench, depositing copper seed layer, plating with copper and chemical-mechanical polishing |
| 06/28/2001 | DE10051599A1 Semiconductor device with an improved contact pin structure and method for producing it places a conductive contact pin in an intermediate insulating film layer and on an insulating layer to insulate semiconductor elements. |
| 06/28/2001 | DE10048377A1 Semiconductor power module used as a power transistor comprises a conductor frame, a power switching circuit, an insulator, and a seal |
| 06/28/2001 | CA2394064A1 Integrated convection and conduction heat sink for multiple mounting positions |
| 06/27/2001 | EP1111970A2 Circuit board for use at high voltage |
| 06/27/2001 | EP1111738A1 Semiconductor device and substrate for semiconductor device |
| 06/27/2001 | EP1111724A2 Electric socket apparatus |
| 06/27/2001 | EP1111677A2 Cooling structure for multichip module |
| 06/27/2001 | EP1111676A2 Unit interconnection substrate for electronic parts |
| 06/27/2001 | EP1111674A2 Circuit component built-in module, radio device having the same, and method for producing the same |