| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/11/2001 | EP1114459A1 High voltage shield |
| 07/11/2001 | EP1114458A1 Buried local interconnect |
| 07/11/2001 | EP1114457A1 Method for producing integrated switching circuits and semiconductor wafer comprising integrated switching circuits |
| 07/11/2001 | EP1114456A1 Collective method for conditioning a plurality of components initially formed in a common substrate |
| 07/11/2001 | EP1114450A1 A system and a method for plating of a conductive pattern |
| 07/11/2001 | EP1114449A1 Ruthenium silicide diffusion barrier layers and methods of forming same |
| 07/11/2001 | EP1114448A1 A method of manufacturing a semiconductor device |
| 07/11/2001 | EP1114445A1 Electronic device with a thermal control capability |
| 07/11/2001 | EP1114444A1 Semiconductor processing method, semiconductor circuitry and gate stack |
| 07/11/2001 | EP1114439A2 Method for forming low-impedance high-density deposited-on-laminate structures having reduced stress |
| 07/11/2001 | EP1114428A1 Integrated inductive components and method of fabricating such components |
| 07/11/2001 | EP1113982A2 Method of and apparatus for sealing an hermetic lid to a microelectronic machine |
| 07/11/2001 | EP1113894A1 Functionally graded metal substrates and process for making same |
| 07/11/2001 | CN2439104Y 芯片散热器 Chipset Cooler |
| 07/11/2001 | CN2439103Y Improvement of radiating fin structure |
| 07/11/2001 | CN2439102Y Fixing device for radiating element fixed fastening |
| 07/11/2001 | CN1303521A Method for making micromodule and storage medium comprising such micromodule |
| 07/11/2001 | CN1303520A 半导体器件 Semiconductor devices |
| 07/11/2001 | CN1303519A Method of severing electrically conductive links with ultravoilet laser output |
| 07/11/2001 | CN1303130A Semi-conductor device and its manufacturing method |
| 07/11/2001 | CN1303086A Resin hermetically sealed type semiconductor device and liquid crystal display assembly block |
| 07/11/2001 | CN1068457C Hidden lead wire chip package |
| 07/11/2001 | CN1068350C Epoxy resin mixture for prepregs and composites |
| 07/11/2001 | CN1068348C Epoxy resin mixtures for prepregs and composites |
| 07/10/2001 | US6260181 Integrated circuit and the design method thereof |
| 07/10/2001 | US6259937 Implantable substrate sensor |
| 07/10/2001 | US6259608 Conductor pattern for surface mount devices and method therefor |
| 07/10/2001 | US6259603 Electronic control unit |
| 07/10/2001 | US6259602 Heat conductive device |
| 07/10/2001 | US6259408 RFID transponders with paste antennas and flip-chip attachment |
| 07/10/2001 | US6259307 Temperature compensated voltage gain stage |
| 07/10/2001 | US6259164 Offset alignment marks method and apparatus |
| 07/10/2001 | US6259163 Bond pad for stress releif between a substrate and an external substrate |
| 07/10/2001 | US6259161 Circuit electrode connected to a pattern formed on an organic substrate and method of forming the same |
| 07/10/2001 | US6259160 Apparatus and method of encapsulated copper (Cu) Interconnect formation |
| 07/10/2001 | US6259159 Reflowed solder ball with low melting point metal cap |
| 07/10/2001 | US6259158 Semiconductor device utilizing an external electrode with a small pitch connected to a substrate |
| 07/10/2001 | US6259157 Hybrid integrated circuit device, and method of manufacturing thereof |
| 07/10/2001 | US6259156 Semiconductor device and method for manufacturing same |
| 07/10/2001 | US6259155 Polymer enhanced column grid array |
| 07/10/2001 | US6259154 Semiconductor device and method of manufacturing the same |
| 07/10/2001 | US6259153 Transverse hybrid LOC package |
| 07/10/2001 | US6259152 Hybrid leadframe having conductive leads less deformable and semiconductor device using the same |
| 07/10/2001 | US6259148 Modular high frequency integrated circuit structure |
| 07/10/2001 | US6259147 Semiconductor device having a fuse layer |
| 07/10/2001 | US6259146 Self-aligned fuse structure and method with heat sink |
| 07/10/2001 | US6259038 Semiconductor chip mounting board and method of inspecting the same mounting board |
| 07/10/2001 | US6259037 Polytetrafluoroethylene thin film chip carrier |
| 07/10/2001 | US6259036 Method for fabricating electronic assemblies using semi-cured conductive elastomeric bumps |
| 07/10/2001 | US6259022 Chip card micromodule as a surface-mount device |
| 07/10/2001 | US6259018 Conductor structure |
| 07/10/2001 | US6258715 Process for low-k dielectric with dummy plugs |
| 07/10/2001 | US6258713 Method for forming dual damascene structure |
| 07/10/2001 | US6258712 Method for forming a borderless contact |
| 07/10/2001 | US6258710 Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity |
| 07/10/2001 | US6258709 Formation of electrical interconnect lines by selective metal etch |
| 07/10/2001 | US6258707 Triple damascence tungsten-copper interconnect structure |
| 07/10/2001 | US6258706 Method for fabricating a stress buffered bond pad |
| 07/10/2001 | US6258704 Methods for fabricating dimpled contacts for metal-to-semiconductor connections |
| 07/10/2001 | US6258700 Silicide agglomeration fuse device |
| 07/10/2001 | US6258688 Method to form a high Q inductor |
| 07/10/2001 | US6258683 Local interconnection arrangement with reduced junction leakage and method of forming same |
| 07/10/2001 | US6258649 Semiconductor integrated circuit device and method of manufacturing the same |
| 07/10/2001 | US6258647 Method of fabricating semiconductor device |
| 07/10/2001 | US6258633 Laser-programmable interconnect process for integrated circuit chips |
| 07/10/2001 | US6258632 Molded packaging for semiconductor device and method of manufacturing the same |
| 07/10/2001 | US6258631 Semiconductor package and the manufacturing method |
| 07/10/2001 | US6258630 Resin-sealed semiconductor device having island for mounting semiconductor element coupled to heat spreader |
| 07/10/2001 | US6258629 Electronic device package and leadframe and method for making the package |
| 07/10/2001 | US6258625 Method of interconnecting electronic components using a plurality of conductive studs |
| 07/10/2001 | US6258624 Semiconductor package having downset leadframe for reducing package bow |
| 07/10/2001 | US6258622 Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method |
| 07/10/2001 | US6258621 Method of fabricating a semiconductor device having insulating tape interposed between chip and chip support |
| 07/10/2001 | US6258613 Control methods of semiconductor manufacturing process, semiconductor manufacturing equipment, and semiconductor manufacturing environment |
| 07/10/2001 | US6258449 Low-thermal expansion circuit board and multilayer circuit board |
| 07/10/2001 | US6258437 Test structure and methodology for characterizing etching in an integrated circuit fabrication process |
| 07/10/2001 | US6258314 Preparing lead frame having an inner lead portion and die pad portion, a semiconductor chip being bonded on die pad portion; attaching sealing sheet; placing in mold; applying tension; pressing; encapsulating to form resin molding |
| 07/10/2001 | US6258192 Multi-thickness, multi-layer green sheet processing |
| 07/10/2001 | US6258191 Method and materials for increasing the strength of crystalline ceramic |
| 07/10/2001 | US6257533 CPU heat sink attachment |
| 07/10/2001 | US6257328 Thermal conductive unit and thermal connection structure using the same |
| 07/10/2001 | US6257327 Heat sink including pedestal |
| 07/10/2001 | US6257320 Heat sink device for power semiconductors |
| 07/10/2001 | US6257312 Preparation of metal-matrix composite materials with high particulate loadings by concentration |
| 07/10/2001 | US6257215 Resin-sealed electronic apparatus for use in internal combustion engines |
| 07/10/2001 | US6256996 Nanoscopic thermoelectric coolers |
| 07/10/2001 | US6256880 Method for preparing side attach pad traces through buried conductive material |
| 07/10/2001 | US6256877 Method for transforming a substrate with edge contacts into a ball grid array |
| 07/10/2001 | US6256875 Method for manufacturing semiconductor device |
| 07/10/2001 | US6256846 Fastening device |
| 07/05/2001 | WO2001048870A2 Interconnect for microelectronic structures with enhanced spring characteristics |
| 07/05/2001 | WO2001048820A1 Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding |
| 07/05/2001 | WO2001048819A2 Interconnect structure and method of fabrication therefor |
| 07/05/2001 | WO2001048818A1 Resilient interconnect structure for electronic components and method for making the same |
| 07/05/2001 | WO2001048817A1 Electronics circuit board assembly apparatus and method |
| 07/05/2001 | WO2001048816A1 Heat sink material and method of manufacturing the heat sink material |
| 07/05/2001 | WO2001048815A1 Stress isolated integrated circuit and manufacturing method thereof |
| 07/05/2001 | WO2001048802A1 Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer |
| 07/05/2001 | WO2001048275A1 Plating device and plating method |
| 07/05/2001 | WO2001047659A1 Energy-efficient, laser-based method and system for processing target material |