| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/17/2001 | US6262474 Semiconductor device |
| 07/17/2001 | US6262473 Film carrier tape and semiconductor device, method of making the same and circuit board |
| 07/17/2001 | US6262435 Etch bias distribution across semiconductor wafer |
| 07/17/2001 | US6262434 Integrated circuit structures and methods to facilitate accurate measurement of the IC devices |
| 07/17/2001 | US6262388 Laser marking station with enclosure and method of operation |
| 07/17/2001 | US6262376 Chip carrier substrate |
| 07/17/2001 | US6262362 Radiation shielding of three dimensional multi-chip modules |
| 07/17/2001 | US6262360 Electric capacitor |
| 07/17/2001 | US6262357 Thermoelectric devices and methods for making the same |
| 07/17/2001 | US6261975 Method for depositing and planarizing fluorinated BPSG films |
| 07/17/2001 | US6261964 Material removal method for forming a structure |
| 07/17/2001 | US6261960 High density contacts having rectangular cross-section for dual damascene applications |
| 07/17/2001 | US6261956 Modified product mask for bridging detection |
| 07/17/2001 | US6261952 Method of forming copper interconnects with reduced in-line diffusion |
| 07/17/2001 | US6261951 Plasma treatment to enhance inorganic dielectric adhesion to copper |
| 07/17/2001 | US6261950 Self-aligned metal caps for interlevel metal connections |
| 07/17/2001 | US6261949 Method for manufacturing semiconductor device |
| 07/17/2001 | US6261948 Method of forming contact openings |
| 07/17/2001 | US6261945 Crackstop and oxygen barrier for low-K dielectric integrated circuits |
| 07/17/2001 | US6261944 Method for forming a semiconductor device having high reliability passivation overlying a multi-level interconnect |
| 07/17/2001 | US6261942 Dual metal-oxide layer as air bridge |
| 07/17/2001 | US6261939 Pad metallization over active circuitry |
| 07/17/2001 | US6261937 Method for forming a semiconductor fuse |
| 07/17/2001 | US6261927 Method of forming defect-free ceramic structures using thermally depolymerizable surface layer |
| 07/17/2001 | US6261919 Semiconductor device and method of manufacturing the same |
| 07/17/2001 | US6261918 Method for creating and preserving alignment marks for aligning mask layers in integrated circuit manufacture |
| 07/17/2001 | US6261908 Buried local interconnect |
| 07/17/2001 | US6261883 Semiconductor integrated circuit device, and fabrication process and designing method thereof |
| 07/17/2001 | US6261882 Method for fabricating a semiconductor device |
| 07/17/2001 | US6261873 Pedestal fuse |
| 07/17/2001 | US6261872 Method of producing an advanced RF electronic package |
| 07/17/2001 | US6261871 Method and structure for temperature stabilization in flip chip technology |
| 07/17/2001 | US6261870 Backside failure analysis capable integrated circuit packaging |
| 07/17/2001 | US6261869 Hybrid BGA and QFP chip package assembly and process for same |
| 07/17/2001 | US6261868 Semiconductor component and method for manufacturing the semiconductor component |
| 07/17/2001 | US6261867 Method of making a package for microelectronic devices using iron oxide as a bonding agent |
| 07/17/2001 | US6261865 Multi chip semiconductor package and method of construction |
| 07/17/2001 | US6261864 Low-pin-count chip package and manufacturing method thereof |
| 07/17/2001 | US6261863 Components with releasable leads and methods of making releasable leads |
| 07/17/2001 | US6261703 Copper circuit junction substrate and method of producing the same |
| 07/17/2001 | US6261680 Electronic assembly with charge-dissipating transparent conformal coating |
| 07/17/2001 | US6261508 Method for making a shielding composition |
| 07/17/2001 | US6261492 Method for fitting a semiconductor chip |
| 07/17/2001 | US6261467 Direct deposit thin film single/multi chip module |
| 07/17/2001 | US6261404 Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device |
| 07/17/2001 | US6261382 Wafer marking |
| 07/17/2001 | US6261114 Socket for electrical parts |
| 07/17/2001 | US6260613 Transient cooling augmentation for electronic components |
| 07/17/2001 | US6260611 Heat dissipation module |
| 07/17/2001 | US6260610 Convoluted fin heat sinks with base topography for thermal enhancement |
| 07/17/2001 | US6260266 Method of forming wire interconnection wire |
| 07/17/2001 | US6260264 Methods for making z-axis electrical connections |
| 07/17/2001 | US6260259 Solder ball mounting device |
| 07/12/2001 | WO2001050825A1 Method, facility and device for producing an electrical connecting element, electrical connecting element and semi-finished product |
| 07/12/2001 | WO2001050533A1 Apparatus for current ballasting esd sensitive devices |
| 07/12/2001 | WO2001050531A1 Interconnection device and method |
| 07/12/2001 | WO2001050530A1 Anti tamper encapsulation for an integrated circuit |
| 07/12/2001 | WO2001050529A1 Method for making an anti-fuse |
| 07/12/2001 | WO2001050528A1 A backend process for fuse link opening |
| 07/12/2001 | WO2001050527A1 A semiconductor device having a reduced signal processing time and a method of fabricating the same |
| 07/12/2001 | WO2001050526A1 Optimized driver layout for integrated circuits with staggered bond pads |
| 07/12/2001 | WO2001050525A2 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size |
| 07/12/2001 | WO2001050517A1 Semiconductor package and enhanced fbg manufacturing |
| 07/12/2001 | WO2001050198A2 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 07/12/2001 | WO2001049431A1 Production method of multi-gauge strips |
| 07/12/2001 | US20010007797 Method of forming a tungsten plug in a semiconductor device |
| 07/12/2001 | US20010007794 Method for fabricating a repair fuse box for a semiconductor device |
| 07/12/2001 | US20010007786 Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns |
| 07/12/2001 | US20010007784 Connecting semiconductor to lead frame |
| 07/12/2001 | US20010007782 Integrated circuit chip and method for fabricating the same |
| 07/12/2001 | US20010007781 Semiconductor device and manufacturing method thereof |
| 07/12/2001 | US20010007780 Resin-molded semicondutor device, method for manufacturing the same, and leadframe |
| 07/12/2001 | US20010007375 Semiconductor chip package with fan-in leads |
| 07/12/2001 | US20010007373 Tape carrier for semiconductor device and method of producing same |
| 07/12/2001 | US20010007372 Micromachined chip scale package |
| 07/12/2001 | US20010007371 IC package and method of making the same |
| 07/12/2001 | US20010007370 Microelectronic mounting with multiple lead deformation using restraining straps |
| 07/12/2001 | US20010007356 Integrated circuit and fabricating method and evaluating method of integrated circuit |
| 07/12/2001 | US20010007330 Ball mount apparatus |
| 07/12/2001 | US20010007285 Resin sealed semiconductor device, circuit member for use therein and method of manufacturing circuit member |
| 07/12/2001 | US20010007262 Method of manufacturing semiconductor device |
| 07/12/2001 | US20010007254 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 07/12/2001 | DE19964055A1 Arrangement for carrying away waste heat, especially for electrical components, has fluid-conducting cooling body with elastically deformable contact membrane for connection to bearer |
| 07/12/2001 | DE19962176A1 Production of a ball grid array housing used for a chip comprises applying a copper foil with conducting pathways on a carrier and inserting reinforcements into the foil and/or into the carrier |
| 07/12/2001 | DE19958328A1 Production of an electrical connection between chip contact element units and external contact connections comprises pressing the contact element material into the contact connection material by stamping or pressing |
| 07/12/2001 | DE10059808A1 Verfahren zur Verbindung einer integrierten Schaltung und einer flexiblen Schaltung A method of connecting an integrated circuit and a flexible circuit |
| 07/12/2001 | DE10000746A1 Bauelement mit Ableitung für Pyrospannungen und Herstellverfahren Component with dissipation for Pyrospannungen and manufacturing |
| 07/12/2001 | CA2395656A1 Anti tamper encapsulation for an integrated circuit |
| 07/11/2001 | EP1115154A1 Power semiconductor module and motor drive system |
| 07/11/2001 | EP1115153A2 Semiconductor substrate and process for its production |
| 07/11/2001 | EP1115152A1 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame |
| 07/11/2001 | EP1115151A1 Flat semiconductor device, method for manufacturing the same, and converter comprising the same |
| 07/11/2001 | EP1115129A2 Multilayer capacitor |
| 07/11/2001 | EP1114882A2 Apparatus and method for depositing an electroless solution |
| 07/11/2001 | EP1114845A1 Paste composition, and protective film and semiconductor device both obtained with the same |
| 07/11/2001 | EP1114834A1 Epoxy resin composition and process for producing silane-modified epoxy resin |
| 07/11/2001 | EP1114807A1 Composite material and semiconductor device using the same |
| 07/11/2001 | EP1114573A1 A method for controlling stress in thin film layers deposited over a high density interconnect common circuit base |
| 07/11/2001 | EP1114462A1 Ternary nitride-carbide barrier layers |
| 07/11/2001 | EP1114460A1 Semiconductor chip with surface coating |