| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/24/2001 | US6263955 Heat sink with open region |
| 07/24/2001 | US6263697 Sorber having flexible housing |
| 07/24/2001 | US6263563 Method of manufacturing and checking electronic components |
| 07/24/2001 | CA2280904C Methods for forming a structured metallization on a semiconductor wafer |
| 07/19/2001 | WO2001052410A2 Component with drain for pyroelectrical voltages and a method for production thereof |
| 07/19/2001 | WO2001052325A1 Microwave ic package with dual mode wave guide |
| 07/19/2001 | WO2001052324A1 Chip with all-round protection of sensitive circuit components using shielding by means of an auxiliary chip |
| 07/19/2001 | WO2001052323A2 Thermal joint and method of use |
| 07/19/2001 | WO2001052322A1 Semiconductor device, metal laminated plate for fabricating circuit on semiconductor, and method of fabricating circuit |
| 07/19/2001 | WO2001052315A1 Semiconductor device and method for producing the same |
| 07/19/2001 | WO2001051991A1 Resin composition, cured object obtained therefrom, and article thereof |
| 07/19/2001 | WO2001051580A1 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof |
| 07/19/2001 | WO2001051562A1 Epoxy resin composition and electronic part |
| 07/19/2001 | WO2001051243A2 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths |
| 07/19/2001 | WO2001015219A3 Method for producing an integrated circuit having at least one metalicized surface |
| 07/19/2001 | US20010009032 Structure having multiple levels of programmable integrated circuits for interconnecting electronic components |
| 07/19/2001 | US20010008796 Phosphorus atom containing gas such as phosphine is added to the reactive gas to carry out tungsten silicide deposition; enhanced yields without forming voids in the electrode and/or wiring |
| 07/19/2001 | US20010008792 Apparatus comprising bonding station, a semiconductor device support at the bonding station, an energy source providing energy beams, and an optical structure for directing the beams to bonding sites; bonds can be made simultaneously |
| 07/19/2001 | US20010008780 Encapsulating integrated circuits (IC's) by defining an encapsulation chamber about an IC die; filling the chamber with encapsulant; and controlling overflow of encapsulant by providing a collection cavity proximate to said chamber |
| 07/19/2001 | US20010008779 Semiconductor device and manufacturing method |
| 07/19/2001 | US20010008777 Flip chip technique for chip assembly |
| 07/19/2001 | US20010008776 Heat-dissipating structure for integrated circuit package |
| 07/19/2001 | US20010008703 Heat dissipation surfaces |
| 07/19/2001 | US20010008685 Method for forming a gold plating electrode a substrate based on the electrode forming method ,and a wire bonding method utilizing this electrode forming method. |
| 07/19/2001 | US20010008484 Light-emitting system |
| 07/19/2001 | US20010008481 Heat dissipation in electrical apparatus |
| 07/19/2001 | US20010008479 Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate |
| 07/19/2001 | US20010008430 System and method for providing a low power receiver design |
| 07/19/2001 | US20010008313 Chip package with degassing holes |
| 07/19/2001 | US20010008312 Method for forming wiring pattern of a semiconductor integrated circuit |
| 07/19/2001 | US20010008311 Semiconductor device and method for fabricating the same and apparatus for chemical mechanical polishing and method of chemical mechanical polishing |
| 07/19/2001 | US20010008310 Method for forming bumps, semiconductor device, and solder paste |
| 07/19/2001 | US20010008309 Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof |
| 07/19/2001 | US20010008308 Integrated circuit chip and method for fabricating the same |
| 07/19/2001 | US20010008307 Integrated circuit chip and method for fabricating the same |
| 07/19/2001 | US20010008306 Laminate type semiconductor apparatus |
| 07/19/2001 | US20010008305 Leadless plastic chip carrier with etch back pad singulation |
| 07/19/2001 | US20010008304 Semiconductor device and manufacturing method thereof |
| 07/19/2001 | US20010008303 Semiconductor apparatus, a method of fabrication of the same, and a reinforcing tape used in fabrication of the same |
| 07/19/2001 | US20010008302 Semiconductor device |
| 07/19/2001 | US20010008301 Semiconductor device |
| 07/19/2001 | US20010008247 Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies |
| 07/19/2001 | US20010008071 Computer enclosure cooling unit |
| 07/19/2001 | DE19963262A1 Electro-optical or opto-electronic module for transmitting and/or receiving light |
| 07/19/2001 | DE19962431A1 Verfahren zum Herstellen einer Halbleiteranordnung A method of manufacturing a semiconductor device |
| 07/19/2001 | DE10104427A1 Chip housing has substrate provided with termination layer having thin ceramic plate with fine conductor paths and elastic wire insulation plate wound with projecting conductor wires |
| 07/19/2001 | DE10065852A1 Semiconductor device has bridging capacitor providing connection between 2 separate circuits formed in semiconductor substrate |
| 07/19/2001 | DE10031678A1 Power semiconductor module has intermediate connection terminal and connection piece for providing releasable connection between control semiconductor element and power semiconductor |
| 07/19/2001 | DE10019482A1 Semiconductor element with leadframe e.g. thin small outline package or dual inline package |
| 07/19/2001 | DE10018638A1 Compact semiconductor element comprises a wafer having a chip region, a substrate arranged on the chip region, conducting bodies, a distancing device between the wafer and the substrate and component contacts |
| 07/19/2001 | DE10009678C1 Heat conducting adhesive joint between two workpieces used in the production of electronic components comprises a layer of heat conducting material having two flat sided surfaces with openings on each surface |
| 07/19/2001 | CA2395960A1 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths |
| 07/18/2001 | EP1117284A2 Heat sink retainer and heat sink assembly using same |
| 07/18/2001 | EP1117134A2 Encapsulant for light-emitting devices |
| 07/18/2001 | EP1117131A2 Method of forming alignment marks |
| 07/18/2001 | EP1117130A2 Heatsink method of manufacturing the same and cooling apparatus using the same |
| 07/18/2001 | EP1116424A1 Electronic assembly comprising a sole plate forming a heat sink |
| 07/18/2001 | EP1116277A1 Connection arrangement for a semiconductor device and method of manufacturing same |
| 07/18/2001 | EP1116273A1 Semiconductor device comprising a high-voltage circuit element |
| 07/18/2001 | EP1116272A1 Interconnection for integrated high voltage electronic devices |
| 07/18/2001 | EP1116271A2 A capsule for semiconductor components |
| 07/18/2001 | EP1116268A2 Method and device for buried chips |
| 07/18/2001 | EP1116180A1 Method for contacting a circuit chip |
| 07/18/2001 | EP1115898A1 Tantalum films and methods for their deposition |
| 07/18/2001 | EP1115781A1 Salt-modified electrostatic dissipative polymers |
| 07/18/2001 | EP0900477B1 Electronic component, in particular a component using acoustical surface acoustic waves |
| 07/18/2001 | CN1304634A Wiring method and wiring device |
| 07/18/2001 | CN1304550A Porous insulating compounds and method for making same |
| 07/18/2001 | CN1304284A Flexible wiring board with multilayer structure and its making method |
| 07/18/2001 | CN1304275A Piezo-electric acoustical component and its making method |
| 07/18/2001 | CN1304212A Ultrathin piezoelectric resonator |
| 07/18/2001 | CN1304184A Package structure with light emitting diode adhered on its surface and its manufacturing method |
| 07/18/2001 | CN1304175A 半导体器件 Semiconductor devices |
| 07/18/2001 | CN1304174A Electronic packaged component with high density interconnection layer |
| 07/18/2001 | CN1304172A Method for manufacturing semiconductor device |
| 07/18/2001 | CN1304171A Lead bracket design of high power semiconductor in plastic packaged product |
| 07/18/2001 | CN1304168A Method for forming deelectric transferred structure by doping |
| 07/18/2001 | CN1304068A Radiator-fan holding device and heat radiating device by said holding device |
| 07/18/2001 | CN1068546C Semiconductor device |
| 07/17/2001 | US6263193 Microwave transmitter/receiver module |
| 07/17/2001 | US6262895 Stackable chip package with flex carrier |
| 07/17/2001 | US6262893 Heat sink with integral component clip |
| 07/17/2001 | US6262877 Low inductance high capacitance capacitor and method of making same |
| 07/17/2001 | US6262587 Semiconductor wafer with connecting leads between the dies |
| 07/17/2001 | US6262584 IC device temperature control system and IC device inspection apparatus incorporating the same |
| 07/17/2001 | US6262579 Method and structure for detecting open vias in high density interconnect substrates |
| 07/17/2001 | US6262518 Housing for piezoelectric transformer device |
| 07/17/2001 | US6262513 Electronic component and method of production thereof |
| 07/17/2001 | US6262490 Substrate strip for use in packaging semiconductor chips |
| 07/17/2001 | US6262488 Semiconductor memory module having double-sided memory chip layout |
| 07/17/2001 | US6262487 Semiconductor integrated circuit device, semiconductor integrated circuit wiring method, and cell arranging method |
| 07/17/2001 | US6262486 Conductive implant structure in a dielectric |
| 07/17/2001 | US6262483 Semiconductor chip module and method for manufacturing the same |
| 07/17/2001 | US6262482 Semiconductor device |
| 07/17/2001 | US6262481 Folded heat sink for semiconductor device package |
| 07/17/2001 | US6262480 Package for electronic device having a fully insulated dissipator |
| 07/17/2001 | US6262479 Semiconductor packaging structure |
| 07/17/2001 | US6262478 Aluminum conductors separated by dielectric; barrier layer of tantalum, niobium, hafnium, titanium, or zirconium; integrated circuit chips |
| 07/17/2001 | US6262477 Ball grid array electronic package |
| 07/17/2001 | US6262475 Lead frame with heat slug |