| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/01/2001 | EP0970333B1 Electromagnetic wave-activated sorption refrigeration system |
| 08/01/2001 | EP0970332B1 Method and apparatus for cooling electrical components |
| 08/01/2001 | CN1306676A Lead frame for semiconductor device |
| 08/01/2001 | CN1306675A Electronic device having fibrous interface |
| 08/01/2001 | CN1306476A Method of making adhesive preform lid for electronic devices |
| 08/01/2001 | CN1306475A Transferrable compliant fibrous thermal interface |
| 08/01/2001 | CN1306327A Sheet-shape surging absorber and its mfg. method |
| 08/01/2001 | CN1306301A Prodn tech of semiconductor device and its conductive structure |
| 08/01/2001 | CN1306300A Semiconductor device and its mfg. method |
| 08/01/2001 | CN1305944A Air tight method for packing micro system in-situ |
| 07/31/2001 | US6269327 System and method for generating wire bond fingers |
| 07/31/2001 | US6269209 Resin sealed optical module |
| 07/31/2001 | US6269003 Heat dissipater structure |
| 07/31/2001 | US6269002 Heat sink with flow guide |
| 07/31/2001 | US6269001 System for enhanced cooling and latching of pluggable electronic component |
| 07/31/2001 | US6268779 Integrated oscillators and tuning circuits |
| 07/31/2001 | US6268717 Semiconductor test structure with intentional partial defects and method of use |
| 07/31/2001 | US6268662 Wire bonded flip-chip assembly of semiconductor devices |
| 07/31/2001 | US6268661 Semiconductor device and method of its fabrication |
| 07/31/2001 | US6268660 Silicon packaging with through wafer interconnects |
| 07/31/2001 | US6268659 Semiconductor body with layer of solder material comprising chromium |
| 07/31/2001 | US6268658 Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof |
| 07/31/2001 | US6268656 Method and structure for uniform height solder bumps on a semiconductor wafer |
| 07/31/2001 | US6268655 Semiconductor device including edge bond pads and methods |
| 07/31/2001 | US6268654 Integrated circuit package having adhesive bead supporting planar lid above planar substrate |
| 07/31/2001 | US6268653 High power; containing high temperature solder |
| 07/31/2001 | US6268652 CSP type semiconductor device with reduced package size |
| 07/31/2001 | US6268650 Semiconductor device, ball grid array connection system, and method of making |
| 07/31/2001 | US6268649 Stackable ball grid array package |
| 07/31/2001 | US6268648 Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device |
| 07/31/2001 | US6268647 Electronic component with an insulating coating |
| 07/31/2001 | US6268646 Lead frame for lead on chip |
| 07/31/2001 | US6268645 Semiconductor device |
| 07/31/2001 | US6268644 Semiconductor device |
| 07/31/2001 | US6268643 Lead frame device for delivering electrical power to a semiconductor die |
| 07/31/2001 | US6268642 Wafer level package |
| 07/31/2001 | US6268641 Semiconductor wafer having identification indication and method of manufacturing the same |
| 07/31/2001 | US6268638 Metal wire fuse structure with cavity |
| 07/31/2001 | US6268619 Integrated circuits |
| 07/31/2001 | US6268616 Electrical wiring board and method for identifying same |
| 07/31/2001 | US6268568 Printed circuit board with oval solder ball lands for BGA semiconductor packages |
| 07/31/2001 | US6268291 Method for forming electromigration-resistant structures by doping |
| 07/31/2001 | US6268290 Method of forming wirings |
| 07/31/2001 | US6268284 In situ titanium aluminide deposit in high aspect ratio features |
| 07/31/2001 | US6268279 Trench and via formation in insulating films utilizing a patterned etching stopper film |
| 07/31/2001 | US6268278 Semiconductor device and manufacturing process thereof |
| 07/31/2001 | US6268277 Method of producing air gap for reducing intralayer capacitance in metal layers in damascene metalization process and product resulting therefrom |
| 07/31/2001 | US6268262 Method for forming air bridges |
| 07/31/2001 | US6268239 Semiconductor chip cooling structure and manufacturing method thereof |
| 07/31/2001 | US6268237 Stress-free silicon wafer and a die or chip made therefrom and method |
| 07/31/2001 | US6268236 Method of manufacturing a semiconductor device having a package structure, and semiconductor device manufactured thereby |
| 07/31/2001 | US6268090 Process for manufacturing semiconductor device and exposure mask |
| 07/31/2001 | US6268058 Security card comprising a thin glass layer |
| 07/31/2001 | US6268033 Polyimide |
| 07/31/2001 | US6268017 Plating, overcoating zones with gelatin |
| 07/31/2001 | US6268016 Electroless deposition of metals |
| 07/31/2001 | US6267287 Apparatus and method of clamping semiconductor devices using sliding finger supports |
| 07/31/2001 | US6267178 Built-up heat exchanger |
| 07/31/2001 | US6267167 Method and apparatus for application of adhesive tape to semiconductor devices |
| 07/31/2001 | US6266872 Method for making a connection component for a semiconductor chip package |
| 07/31/2001 | CA2209326C Apparatus for heating and cooling an electronic device |
| 07/26/2001 | WO2001054232A2 Flexible compliant interconnect assembly |
| 07/26/2001 | WO2001054196A1 Dual-sided, surface mountable integrated circuit package |
| 07/26/2001 | WO2001054195A1 Integrated circuit package incorporating programmable elements |
| 07/26/2001 | WO2001054194A1 Personalized hardware |
| 07/26/2001 | WO2001054193A2 Flat support for a chip module and method for producing a chip module |
| 07/26/2001 | WO2001054191A1 Damascene structure and method for forming a damascene structure |
| 07/26/2001 | WO2001054169A2 Cooling apparatus |
| 07/26/2001 | WO2001054148A1 Coil and coil system to be integrated in a microelectronic circuit, and a microelectronic circuit |
| 07/26/2001 | WO2001054058A1 Method to manufacture a smart label inlet web and a smart label inlet web |
| 07/26/2001 | WO2001053890A1 Photosensitive resin composition |
| 07/26/2001 | WO2001001453A3 Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards |
| 07/26/2001 | WO2000067320B1 Integrated circuit inductor with high self-resonance frequency |
| 07/26/2001 | WO2000028664A3 Fully integrated tuner architecture |
| 07/26/2001 | US20010010093 Layout design method |
| 07/26/2001 | US20010010064 Semiconductor multi-chip module |
| 07/26/2001 | US20010009806 Reducing contact resistance generated on the P-type impurity area without increasing a chip size |
| 07/26/2001 | US20010009804 Conductive layer on the insulating layer is polished to leave the conductive layer in the groove by a CMP method to form electrodes wire |
| 07/26/2001 | US20010009802 Closed conductive pattern in the dielectric layer, electrically connecting the two spaced conductive patterns |
| 07/26/2001 | US20010009795 Simplified high Q inductor substrate |
| 07/26/2001 | US20010009789 Semiconductor device and manufacturing method thereof |
| 07/26/2001 | US20010009787 Method for forming a bottom electrode of a storage capacitor |
| 07/26/2001 | US20010009782 Multi-layer electronic device package comprising first and second outer layers and a plurality of signal layers disposed between the outer layers, signal layers including signal traces and ground traces interleaved with signal traces |
| 07/26/2001 | US20010009780 Semiconductor device and process for fabrication thereof |
| 07/26/2001 | US20010009779 Circuit chip package and fabrication method |
| 07/26/2001 | US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging |
| 07/26/2001 | US20010009342 Electronic component and method of production thereof |
| 07/26/2001 | US20010009305 Microelectronic elements with deformable leads |
| 07/26/2001 | US20010009304 Semiconductor device |
| 07/26/2001 | US20010009303 Local interconnect structures for integrated circuits and methods for making the same |
| 07/26/2001 | US20010009302 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion |
| 07/26/2001 | US20010009301 Semiconductor devices having different package sizes made by using common parts |
| 07/26/2001 | US20010009300 Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element |
| 07/26/2001 | US20010009299 Flexible wiring board, method of manufacturing flexible wiring board and display device equipped with flexible wiring board |
| 07/26/2001 | US20010009298 Chip scale surface mount packages for semiconductor device |
| 07/26/2001 | US20010009297 Bonding pad on a semiconductor chip |
| 07/26/2001 | US20010009296 Process for forming an integrated circuit |
| 07/26/2001 | US20010009295 Semiconductor device and process for producing the same |
| 07/26/2001 | US20010009294 Method of forming an alignment key on a semiconductor wafer |
| 07/26/2001 | US20010009293 Encapped oligomeric polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid esters as precursors for dielectric compounds |