| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/09/2001 | US20010012686 Semiconductor device and fabricating method thereof |
| 08/09/2001 | US20010012684 Method of forming interconnect |
| 08/09/2001 | US20010012683 Method of partially plating substrate for electronic devices |
| 08/09/2001 | US20010012680 Method of depositing a thermoplastic polymer in semiconductor fabrication |
| 08/09/2001 | US20010012674 Apparatus for improving alignment for metal masking |
| 08/09/2001 | US20010012673 Mos transistor having self-aligned well bias area and method of fabricating the same |
| 08/09/2001 | US20010012671 Semiconductor device and a method of manufacturing the same |
| 08/09/2001 | US20010012657 Methods of electrically contacting to conductive plugs, methods of forming contact openings, and methods of forming dynamic random access memory circuitry |
| 08/09/2001 | US20010012646 Semiconductor chip module and method for manufacturing the same |
| 08/09/2001 | US20010012645 Semiconductor devices and the manufacturing method |
| 08/09/2001 | US20010012644 Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate |
| 08/09/2001 | US20010012643 Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same |
| 08/09/2001 | US20010012642 Oxidizing a surface of a polymeric film, treating modified polymeric film with a polyamine coupling agent, and contacting a polymeric material for adhesion to polymeric film |
| 08/09/2001 | US20010012641 Semiconductor processing methods of forming encapsulant over semiconductive dies, and methods of forming die packages |
| 08/09/2001 | US20010012593 Wafer alignment marks protected by photoresist |
| 08/09/2001 | US20010012526 Package stack via bottom leaded plastic (BLP) packaging |
| 08/09/2001 | US20010012201 Biometric sensor and method for its production |
| 08/09/2001 | US20010012077 Array substrate for use in LCD device |
| 08/09/2001 | US20010011909 Integrated circuit approach, with a serpentine conductor track for circuit configuration selection |
| 08/09/2001 | US20010011777 Semiconductor device using a BGA package and method of producing the same |
| 08/09/2001 | US20010011776 Semiconductor integrated circuit device, semiconductor integrated circuit wiring method, and cell arranging method |
| 08/09/2001 | US20010011775 Interconnect structure of semiconductor device |
| 08/09/2001 | US20010011773 Electronic package utilizing protective coating |
| 08/09/2001 | US20010011772 Semiconductor device having a ball grid array and a fabrication process thereof |
| 08/09/2001 | US20010011771 Semiconductor device with flip-chip structure and method of manufacturing the same |
| 08/09/2001 | US20010011770 Semiconductor device and method for fabricating the same |
| 08/09/2001 | US20010011768 Semiconductor integrated circuit device and package structure for the same |
| 08/09/2001 | US20010011767 Semiconductor package with improved cross talk and grounding, and method of manufacturing same |
| 08/09/2001 | US20010011766 IC card |
| 08/09/2001 | US20010011764 Chip scale package using large ductile solder balls |
| 08/09/2001 | US20010011763 Tab type semiconductor device |
| 08/09/2001 | US20010011762 Integrated circuit package alignment feature |
| 08/09/2001 | US20010011761 Semiconductor device |
| 08/09/2001 | US20010011757 Pressure-contact type semiconductor device |
| 08/09/2001 | US20010011735 Semiconductor memory device for decreasing a coupling capacitance |
| 08/09/2001 | US20010011727 Semiconductor device and its manufacturing method |
| 08/09/2001 | US20010011675 Heat and pressure bonding high molecular weight polyethylene thermoplastic resin |
| 08/09/2001 | US20010011607 Multilayer thin-film wiring board |
| 08/09/2001 | US20010011605 Electrical connection with inwardly deformable contacts |
| 08/09/2001 | US20010011598 Electronic device |
| 08/09/2001 | US20010011571 Method for making high k dielectric material with low k dielectric sheathed signal vias |
| 08/09/2001 | US20010011515 Mixture of an urea and phenolic compound |
| 08/09/2001 | US20010011472 Manufacturing method of electronic component, manufacturing apparatus thereof, and driving method of manufacturing apparatus thereof |
| 08/09/2001 | US20010011413 Wiring method and wiring apparatus |
| 08/09/2001 | DE10046915A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same |
| 08/09/2001 | DE10005183A1 Gleichrichteranordnung Rectifier arrangement |
| 08/09/2001 | DE10004964A1 Micromechanical cap structure comprises substrate in the form of wafer with a cavern having a base surface and parallel side wall sections lying opposite each other with stabilizing wall sections connected to the side wall sections |
| 08/09/2001 | DE10003670A1 Semiconductor device for integrated circuits esp. with reference to housing technology, uses first and second contact pads, and has the electrically connected external connections |
| 08/08/2001 | EP1122991A2 Encapsulated power supply with a high thermal conductivity molded insert |
| 08/08/2001 | EP1122988A2 Mounting board, method of manufacturing the same and method of mounting electronic-circuit element |
| 08/08/2001 | EP1122808A1 High-frequency communication apparatus and method of manufacturing the same |
| 08/08/2001 | EP1122788A1 Soi substrate, method of manufacture thereof, and semiconductor device using soi substrate |
| 08/08/2001 | EP1122786A2 High performance multi-chip IC package |
| 08/08/2001 | EP1122785A1 Method for forming a thin-film, electrically blowable fuse with a reproducible blowing wattage |
| 08/08/2001 | EP1122784A2 Improved electrical fuses for semiconductor devices |
| 08/08/2001 | EP1122783A2 Method of fabrication of a semiconductor element with a silicon carrier substrate |
| 08/08/2001 | EP1122782A2 Etched tri-layer metal with integrated wire traces for wire bonding |
| 08/08/2001 | EP1122781A2 High-density mounted device employing an adhesive sheet |
| 08/08/2001 | EP1122780A2 Laminated radiation member, power semiconductor apparatus and method for producing the same |
| 08/08/2001 | EP1122779A2 Carbon fiber reinforced resin heat radiation fin mounted on a substrate |
| 08/08/2001 | EP1122778A2 Circuit device and manufacturing method of circuit device |
| 08/08/2001 | EP1122777A2 Semiconductor device and semiconductor modul using the same |
| 08/08/2001 | EP1122775A2 Treatment of a metal nitride/metal stack |
| 08/08/2001 | EP1122774A1 Plasma treatment of a titanium nitride film formed by chemical vapor deposition |
| 08/08/2001 | EP1122773A2 Semiconductor device manufacturing method |
| 08/08/2001 | EP1122769A1 Semiconductor device and method for manufacturing the same |
| 08/08/2001 | EP1121843A1 Spray cooled module with removable spray cooled sub-module |
| 08/08/2001 | EP1121717A1 Improved methods for barrier layer formation |
| 08/08/2001 | EP1121603A1 Method and system for manufacturing lamp tiles |
| 08/08/2001 | EP1121218A1 Method and apparatus for placing solder balls on a substrate |
| 08/08/2001 | EP0892988B1 Integrated circuit protection device and method |
| 08/08/2001 | EP0710401B1 Tamper resistant integrated circuit structure |
| 08/08/2001 | CN1307793A Assembly of an electronic component with spring packaging |
| 08/08/2001 | CN1307365A N channel metal-oxide-semiconductor drive circuit and its manufacture |
| 08/08/2001 | CN1307364A Semiconductor device and its manufacture |
| 08/08/2001 | CN1307363A Semiconductor device and its manufacture, chemical-mechanical grinding device and method |
| 08/08/2001 | CN1307362A Semiconductor chip package and its packaging method |
| 08/08/2001 | CN1307360A 半导体器件 Semiconductor devices |
| 08/08/2001 | CN1307248A Liquid crystal display, wiring substrate and making method thereof |
| 08/08/2001 | CN1069448C Self-aligning low profile socket for connecting ball grid array devices through dendritic interposer |
| 08/08/2001 | CN1069446C 半导体器件 Semiconductor devices |
| 08/08/2001 | CN1069445C Radiator assembly and manufacture thereof |
| 08/07/2001 | US6272020 Structure for mounting a semiconductor device and a capacitor device on a substrate |
| 08/07/2001 | US6272014 Heat sink device for a chip |
| 08/07/2001 | US6271602 Method for reducing the susceptibility to chemical-mechanical polishing damage of an alignment mark formed in a semiconductor substrate |
| 08/07/2001 | US6271600 Redundant wiring apparatus and a method of making the same |
| 08/07/2001 | US6271599 Wire interconnect structure for electrically and mechanically connecting an integrated circuit chip to a substrate |
| 08/07/2001 | US6271595 In semiconductor devices provided with an intervening layer of germanium oxide, copper (wire), copper germanide and/or germanium nitride between the copper and dielectric layer of silicon oxide or nitride |
| 08/07/2001 | US6271594 Semiconductor device and method of manufacturing the same |
| 08/07/2001 | US6271591 Copper-aluminum metallization |
| 08/07/2001 | US6271588 Semiconductor device and manufacturing method thereof |
| 08/07/2001 | US6271587 Connection arrangement for enbaling the use of identical chips in 3-dimensional stacks of chips requiring address specific to each chip |
| 08/07/2001 | US6271586 Integrated circuit chip and method for fabricating the same |
| 08/07/2001 | US6271585 A composite formed by impregnating melted copper into a molybdenum green compact and rolled into a plate having the differences in thermal expansion coefficients of <8%; uniform distribution; semiconductors for electric cars |
| 08/07/2001 | US6271584 Arrangement of electronic components on a bearer strip |
| 08/07/2001 | US6271583 Semiconductor device having resin encapsulated package structure |
| 08/07/2001 | US6271582 Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die |
| 08/07/2001 | US6271581 Semiconductor package structure having universal lead frame and heat sink |
| 08/07/2001 | US6271580 Leads under chip in conventional IC package |
| 08/07/2001 | US6271579 High-frequency passband microelectronics package |