| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/07/2001 | US6271576 Laser synthesized ceramic sensors and method for making |
| 08/07/2001 | US6271574 Integrated circuit fuse with localized fusing point |
| 08/07/2001 | US6271549 Process for fabricating a metal silicide layer of a semiconductor and apparatus |
| 08/07/2001 | US6271548 Master slice LSI and layout method for the same |
| 08/07/2001 | US6271539 Electrical diagnostic technique for silicon plasma-etch induced damage characterization |
| 08/07/2001 | US6271483 Wiring board having vias |
| 08/07/2001 | US6271482 Conductive elastomer interconnect |
| 08/07/2001 | US6271480 Electronic device |
| 08/07/2001 | US6271479 Method and apparatus for connecting an electric component to a printed circuit board |
| 08/07/2001 | US6271478 Multi-layer circuit board |
| 08/07/2001 | US6271471 Housing for electronic component, and method of producing the same |
| 08/07/2001 | US6271469 Direct build-up layer on an encapsulated die package |
| 08/07/2001 | US6271163 Controlling concentration |
| 08/07/2001 | US6271137 Method of producing an aluminum stacked contact/via for multilayer |
| 08/07/2001 | US6271135 Patterning photoresist; filling with copper; removal photoresist; encapsulation; prevention copper diffusion |
| 08/07/2001 | US6271126 Method of forming contact openings |
| 08/07/2001 | US6271114 System for adjusting the size of conductive lines based upon the contact size |
| 08/07/2001 | US6271112 Interlayer between titanium nitride and high density plasma oxide |
| 08/07/2001 | US6271111 High density pluggable connector array and process thereof |
| 08/07/2001 | US6271107 Semiconductor with polymeric layer |
| 08/07/2001 | US6271085 Method for forming a bottom electrode of a storage capacitor |
| 08/07/2001 | US6271060 Process of fabricating a chip scale surface mount package for semiconductor device |
| 08/07/2001 | US6271059 Chip interconnection structure using stub terminals |
| 08/07/2001 | US6271058 Method of manufacturing semiconductor device in which semiconductor chip is mounted facedown on board |
| 08/07/2001 | US6271057 Method of making semiconductor chip package |
| 08/07/2001 | US6270947 Printing a pattern |
| 08/07/2001 | US6270880 For use as an electrical insulator in a circuit board such as a multilayer circuit board |
| 08/07/2001 | US6270879 Release member for use in producing a multi-layer printed wiring board |
| 08/07/2001 | US6270848 Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same |
| 08/07/2001 | US6270712 Molding die and marking method for semiconductor devices |
| 08/07/2001 | US6270601 Method for producing filled vias in electronic components |
| 08/07/2001 | US6270357 Mounting for high frequency device packages |
| 08/07/2001 | US6270356 IC socket |
| 08/07/2001 | US6269866 Cooling device with heat pipe |
| 08/07/2001 | US6269864 Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors |
| 08/07/2001 | US6269863 Integrated processor mounting mechanism and heat sink |
| 08/07/2001 | CA2236999C Circuit structure having a flip-mounted matrix of devices |
| 08/07/2001 | CA2186695C Lead frame, method for partial noble plating of said lead frame and semiconductor device having said lead frame |
| 08/02/2001 | WO2001056346A1 Retention module, heat sink and electronic device |
| 08/02/2001 | WO2001056083A2 Ldmos power package with a plurality of ground signal paths |
| 08/02/2001 | WO2001056082A1 Auto-aligning power transistor package |
| 08/02/2001 | WO2001056081A1 Flip-chip bonding arrangement |
| 08/02/2001 | WO2001056079A2 A method for transferring and stacking of semiconductor devices |
| 08/02/2001 | WO2001056077A1 Method of fabricating copper interconnections in semiconductor devices |
| 08/02/2001 | WO2001056067A1 Micro electro-mechanical component and system architecture |
| 08/02/2001 | WO2001056063A2 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
| 08/02/2001 | WO2001056054A1 Electronic package with integrated capacitor |
| 08/02/2001 | WO2001055829A1 Character input device based on a two-dimensional movement sensor |
| 08/02/2001 | WO2001055662A1 Leak detector for a liquid cooling circuit |
| 08/02/2001 | WO2001055243A1 Solvent-free thermosetting resin composition, process for producing the same, and product therefrom |
| 08/02/2001 | WO2001054854A1 Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
| 08/02/2001 | WO2001008221A9 High frequency module |
| 08/02/2001 | US20010011362 Semiconductor layout design method and apparatus |
| 08/02/2001 | US20010011353 Secure module with microprocessor and co-processor |
| 08/02/2001 | US20010011013 System and method for on-chip filter tuning |
| 08/02/2001 | US20010010969 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry |
| 08/02/2001 | US20010010964 Method and structure for SOI wafers to avoid electrostatic discharge |
| 08/02/2001 | US20010010961 Method of forming contact holes of semiconductor device |
| 08/02/2001 | US20010010949 Plastic molded type semiconductor device and fabrication process thereof |
| 08/02/2001 | US20010010948 Method for preventing electrostatic discharge in an integrated circuit |
| 08/02/2001 | US20010010947 Film ball grid array (BGA) semiconductor package |
| 08/02/2001 | US20010010946 IC die power connection using canted coil spring |
| 08/02/2001 | US20010010945 Semiconductor device and method of manufacturing the same |
| 08/02/2001 | US20010010863 Stable thin film oxide standard |
| 08/02/2001 | US20010010627 Semiconductor device and manufacturing method therefor |
| 08/02/2001 | US20010010624 Heat sink and mounting structure for heat sink |
| 08/02/2001 | US20010010584 Optical electronic apparatus and method for producing the same |
| 08/02/2001 | US20010010471 High-performance interconnect |
| 08/02/2001 | US20010010409 Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor device |
| 08/02/2001 | US20010010408 Low-capacitance bonding pad for semiconductor device |
| 08/02/2001 | US20010010407 Low-capacitance bonding pad for semiconductor device |
| 08/02/2001 | US20010010404 Low-capacitance bonding pad for semiconductor device |
| 08/02/2001 | US20010010403 Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals |
| 08/02/2001 | US20010010402 Semiconductor device structure and method for manufacturing the same |
| 08/02/2001 | US20010010401 Semiconductor device having a wiring layer of copper |
| 08/02/2001 | US20010010400 Microelectronic assembly incorporating lead regions defined by GAPS in a sheet |
| 08/02/2001 | US20010010397 Semiconductor device and a method of manufacturing the same |
| 08/02/2001 | US20010010396 Semiconductor device and semiconductor module using the same |
| 08/02/2001 | US20010010395 Interleaved signal trace routing |
| 08/02/2001 | US20010010394 Semiconductor package |
| 08/02/2001 | US20010010392 Laser marking techniques |
| 08/02/2001 | US20010010387 Methods of fabricating integrated circuit devices including distributed and isolated dummy conductive regions |
| 08/02/2001 | US20010010370 Active matrix substrate plate and manufacturing method therefor |
| 08/02/2001 | US20010010272 Wiring substrate and process for producing the same |
| 08/02/2001 | US20010010264 Heat dissipating device |
| 08/02/2001 | DE10055436A1 Wärmestrahlungs-Einbettungsstruktur für ein elektrisches Bauteil und Einbettungsverfahren dafür Heat radiation embedding structure for an electrical part and embedding method therefor |
| 08/02/2001 | DE10046925A1 Halbleitervorrichtung mit einer Testmarkierung A semiconductor device with a test marker |
| 08/02/2001 | DE10027852A1 Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat und zum Anordnen auf einem Substrat geeignetes Halbleiterbaelement A method for disposing a semiconductor chip on a substrate, and for arranging on a substrate suitable Halbleiterbaelement |
| 08/02/2001 | DE10003539A1 Halbleiterbauelement mit Metallschicht A semiconductor device with a metal layer |
| 08/02/2001 | DE10002852A1 Abschirmeinrichtung und elektrisches Bauteil mit einer Abschirmeinrichtung Shielding and electrical component with a shielding |
| 08/02/2001 | DE10002377A1 Spule und Spulensystem zur Integration in eine mikroelektronische Schaltung sowie mikroelektronische Schaltung A coil and coil system for integration into a microelectronic circuit and microelectronic circuit |
| 08/02/2001 | DE10002362A1 Halbleiterbauelement Semiconductor device |
| 08/01/2001 | EP1120835A2 MOSFET and method of manufacturing the same |
| 08/01/2001 | EP1120831A2 Electronic component with an electromagnetic shielding device |
| 08/01/2001 | EP1120830A2 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate with a concave portion |
| 08/01/2001 | EP1120826A1 Semiconductor device with metal layer |
| 08/01/2001 | EP1120825A1 Method for manufacturing semiconductor device |
| 08/01/2001 | EP1120823A2 Semiconductor device substrate and method of manufacturing semiconductor device |
| 08/01/2001 | EP1120449A1 Adhesive for bonding circuit members, circuit board, and method of producing the same |
| 08/01/2001 | EP1119823A1 Biometric sensor and corresponding production method |