| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/16/2001 | DE10004474A1 Kühlvorrichtung Cooler |
| 08/16/2001 | DE10004410A1 Semiconductor device for discrete device with contacts on lower side - has second metallisation provided on second main side of chip, lying flush with surface, for carrying signals |
| 08/16/2001 | CA2399417A1 Encapsulation for an electronic component and a process for its manufacture |
| 08/15/2001 | CN2443582Y Cooling part for non-uniform distributed heat load |
| 08/15/2001 | CN2443491Y Semiconductor diode conductor supporter |
| 08/15/2001 | CN2443490Y Radiator |
| 08/15/2001 | CN2443489Y Radiator |
| 08/15/2001 | CN1308839A Method for producing interconnections with electrically conductive cross connectious between the top and the bottom part of a substrate and interconnections having such cross connections |
| 08/15/2001 | CN1308773A Capsule for semiconductor components |
| 08/15/2001 | CN1308411A Substrate for assembling electronic elements and piezoelectric vibrator with the substrate |
| 08/15/2001 | CN1308378A Buried metal contact structure and manufacture of semiconductor FET device |
| 08/15/2001 | CN1308376A Capacitor and its manufacture process |
| 08/15/2001 | CN1308375A Diffusion barrier and semiconductor device with diffusion barrier |
| 08/15/2001 | CN1308374A Chip integrating rigid supporting ring |
| 08/15/2001 | CN1308373A Heat dissipator for high-power semiconductor module |
| 08/15/2001 | CN1308372A Breakdown barrier and oxygen barrier for integrated circuit of low dielectric constant dielectric |
| 08/15/2001 | CN1308371A Method of forming copper wiring in semiconductor device |
| 08/15/2001 | CN1308370A Method of forming copper wiring in semiconductor device |
| 08/15/2001 | CN1308369A Design method, masks, manufacture and storage medium of integrated circuit |
| 08/15/2001 | CN1308109A Heat connducting electronic pouring sealant |
| 08/15/2001 | CN1308010A Garbage coating stripper for local electroplating equipment |
| 08/15/2001 | CN1069617C Large ceramic article and method of manufacturing |
| 08/14/2001 | USRE37323 Method for sticking an insulating film to a lead frame |
| 08/14/2001 | US6275621 Moire overlay target |
| 08/14/2001 | US6275381 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
| 08/14/2001 | US6275380 Add-on heat sink and method |
| 08/14/2001 | US6275158 Device arranged for contactless communication and provided with a data carrier with fully enclosed connection means for electrically connecting a chip and a passive component |
| 08/14/2001 | US6274940 Semiconductor wafer, a chemical-mechanical alignment mark, and an apparatus for improving alignment for metal masking in conjunction with oxide and tungsten CMP |
| 08/14/2001 | US6274938 Resin-sealed semiconductor device and method of manufacturing the device |
| 08/14/2001 | US6274937 Silicon multi-chip module packaging with integrated passive components and method of making |
| 08/14/2001 | US6274935 A laminated impurity film within the pad complexes with a nickel containing pad to prevent destructive interaction between nickel and copper; bonding to gold wires |
| 08/14/2001 | US6274934 Semiconductor device and method of manufacturing thereof |
| 08/14/2001 | US6274933 Integrated circuit device having a planar interlevel dielectric layer |
| 08/14/2001 | US6274932 Semiconductor device having metal interconnection comprising metal silicide and four conductive layers |
| 08/14/2001 | US6274931 Integrated circuit packaging systems and methods that use the same packaging substrates for integrated circuits of different data path widths |
| 08/14/2001 | US6274930 Multi-chip module with stacked dice |
| 08/14/2001 | US6274929 Stacked double sided integrated circuit package |
| 08/14/2001 | US6274928 Single deposition layer metal dynamic random access memory |
| 08/14/2001 | US6274927 Plastic package for an optical integrated circuit device and method of making |
| 08/14/2001 | US6274926 Plate-shaped external storage device and method of producing the same |
| 08/14/2001 | US6274925 Low inductance top metal layer design |
| 08/14/2001 | US6274923 Semiconductor device and method for making the same |
| 08/14/2001 | US6274922 Fabrication of high power semiconductor device with a heat sink and integration with planar microstrip circuitry |
| 08/14/2001 | US6274895 Semiconductor integrated circuit device |
| 08/14/2001 | US6274886 Thin-film-transistor-array substrate and liquid-crystal display device |
| 08/14/2001 | US6274883 Structure of a ball grid array substrate with charts for indicating position of defective chips |
| 08/14/2001 | US6274823 Interconnection substrates with resilient contact structures on both sides |
| 08/14/2001 | US6274822 Manufacture of semiconductor connection components with frangible lead sections |
| 08/14/2001 | US6274650 Epoxy resin compositions for liquid encapsulation |
| 08/14/2001 | US6274515 Spin-on dielectric formation process for use in manufacturing semiconductors |
| 08/14/2001 | US6274491 Process of manufacturing thin ball grid array substrates |
| 08/14/2001 | US6274489 Manufacturing method of semiconductor apparatus |
| 08/14/2001 | US6274476 Semiconductor device and method of manufacturing the same |
| 08/14/2001 | US6274475 Specialized metal profile for via landing areas |
| 08/14/2001 | US6274474 Method of forming BGA interconnections having mixed solder profiles |
| 08/14/2001 | US6274473 Flip chip packages |
| 08/14/2001 | US6274452 Semiconductor device having multilayer interconnection structure and method for manufacturing the same |
| 08/14/2001 | US6274451 Method of fabricating a gate-control electrode for an IGBT transistor |
| 08/14/2001 | US6274440 Manufacturing of cavity fuses on gate conductor level |
| 08/14/2001 | US6274417 Method of forming a semiconductor device |
| 08/14/2001 | US6274412 Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays |
| 08/14/2001 | US6274409 Method for making a semiconductor device |
| 08/14/2001 | US6274408 Method for producing a plastic molded semiconductor package |
| 08/14/2001 | US6274407 Method and article for attaching high-operating-temperature electronic component |
| 08/14/2001 | US6274406 Semiconductor device and a method of manufacturing the same |
| 08/14/2001 | US6274405 Semiconductor device, method of making the same, circuit board, and film carrier tape |
| 08/14/2001 | US6274404 Multilayered wiring structure and method of manufacturing the same |
| 08/14/2001 | US6274402 Method of fabricating a silicon solar cell |
| 08/14/2001 | US6274397 Method to preserve the testing chip for package's quality |
| 08/14/2001 | US6274396 Method of manufacturing calibration wafers for determining in-line defect scan tool sensitivity |
| 08/14/2001 | US6274395 Method and apparatus for maintaining test data during fabrication of a semiconductor wafer |
| 08/14/2001 | US6274391 HDI land grid array packaged device having electrical and optical interconnects |
| 08/14/2001 | US6274390 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
| 08/14/2001 | US6274389 Sealing space between carrier substrate and circuit board with reaction product of epoxy resin, curing agent and plasticizer |
| 08/14/2001 | US6274251 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 08/14/2001 | US6274198 Providing semiconductor mask with aperture for defining area of substrate to be covered by material, forming pyramidal shaped features with sidewalls; mounting spheres; positioning mask; depositing material through aperture |
| 08/14/2001 | US6273186 Low-cost, high density, staggered pin fin array |
| 08/14/2001 | US6273185 Heat sink and retainer for electronic integrated devices |
| 08/14/2001 | US6272866 Micro cooling engine array system |
| 08/14/2001 | US6272744 Semiconductor connection components and methods with releasable lead support |
| 08/14/2001 | US6272736 Method for forming a thin-film resistor |
| 08/14/2001 | US6272722 Device for retaining computer CPU cooling piece |
| 08/09/2001 | WO2001058231A1 Cooling device |
| 08/09/2001 | WO2001058227A1 Package for microwave components |
| 08/09/2001 | WO2001058001A1 Rectifier system |
| 08/09/2001 | WO2001057937A1 Concentrically leaded power semiconductor device package |
| 08/09/2001 | WO2001057924A1 Semiconductor component with contacts provided on the lower side thereof, and method for producing the same |
| 08/09/2001 | WO2001057923A1 Method for producing electrical connections in particular for an electronic device |
| 08/09/2001 | WO2001057608A1 A flip-chip switching regulator |
| 08/09/2001 | WO2001057112A1 Adhesive polyimide resin and adhesive laminate |
| 08/09/2001 | WO2001056921A2 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components |
| 08/09/2001 | WO2001047659A8 Energy-efficient, laser-based method and system for processing target material |
| 08/09/2001 | WO2000071921A3 Burrless castellation via process and product for plastic chip carrier |
| 08/09/2001 | US20010012868 A low-molecular-weight polyester formed from a single species of linear aliphatic diol and a single species of dicarboxylic acid with a single species of diisocyanate; impervious to oxygen and moisture; food and drug packaging |
| 08/09/2001 | US20010012739 Composite microelectronic spring structure and method for making same |
| 08/09/2001 | US20010012699 Base thermal SiO2 film 1a is exposed to any gas selected from silicon,germanium or stanium halides |
| 08/09/2001 | US20010012695 Bit line and manufacturing method thereof |
| 08/09/2001 | US20010012693 Method for forming a silicide region on a silicon body |
| 08/09/2001 | US20010012691 Method for forming an integrated circuit interconnect using a dual poly process |
| 08/09/2001 | US20010012688 Process for forming miniature contact holes in semiconductor device without short-circuit |