| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/21/2001 | US6277730 Method of fabricating interconnects utilizing fluorine doped insulators and barrier layers |
| 08/21/2001 | US6277726 Method for decreasing contact resistance of an electrode positioned inside a misaligned via for multilevel interconnects |
| 08/21/2001 | US6277724 Method for forming an array of sidewall-contacted antifuses having diffused bit lines |
| 08/21/2001 | US6277720 Silicon nitride dopant diffusion barrier in integrated circuits |
| 08/21/2001 | US6277674 Semiconductor fuses, methods of using the same, methods of making the same, and semiconductor devices containing the same |
| 08/21/2001 | US6277673 Leads under chip in conventional IC package |
| 08/21/2001 | US6277672 BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technology |
| 08/21/2001 | US6277670 Semiconductor chip package and fabrication method thereof |
| 08/21/2001 | US6277669 Wafer level packaging method and packages formed |
| 08/21/2001 | US6277658 Method for monitoring alignment mark shielding |
| 08/21/2001 | US6277301 Method of producing a wavelength-converting casting composition |
| 08/21/2001 | US6277225 Stress reduction feature for LOC lead frame |
| 08/21/2001 | US6277222 Electronic component connecting method |
| 08/21/2001 | US6277169 Method for making silver-containing particles |
| 08/21/2001 | US6276599 Method and apparatus for forming solder bumps |
| 08/21/2001 | US6276448 Heat-transfer connector |
| 08/21/2001 | US6276184 Process and apparatus for manufacturing semiconductor devices |
| 08/21/2001 | US6276159 Sorption refrigeration appliance |
| 08/21/2001 | CA2219761C Printed circuit board with selectable routing configuration |
| 08/21/2001 | CA2041730C Stabilization of the interface between aluminum and titanium nitride |
| 08/16/2001 | WO2001060138A1 Multi-device heat sink assembly |
| 08/16/2001 | WO2001059842A1 Vertical conduction flip-chip device with bump contacts on single surface |
| 08/16/2001 | WO2001059840A1 Leadframe interposer |
| 08/16/2001 | WO2001059839A1 Mounting structure for semiconductor chip, semiconductor device, and method of manufacturing semiconductor device |
| 08/16/2001 | WO2001059829A2 Method for mounting integrated circuits on a conductor support and resulting support |
| 08/16/2001 | WO2001059828A2 Building component with constant distorsion-free bonding, and method for bonding |
| 08/16/2001 | WO2001059827A1 Encapsulation for an electrical component and method for producing the same |
| 08/16/2001 | WO2001059789A1 Semiconductor integrated circuit device |
| 08/16/2001 | WO2001058828A1 Ceramic substrate for semiconductor production/inspection device |
| 08/16/2001 | WO2001058643A1 Modified plating solution for plating and planarization and process utilizing same |
| 08/16/2001 | US20010014559 Electronic component inwhich an insert member is tightly held by a resin portion and prevented from deformation thereof |
| 08/16/2001 | US20010014550 Socket for electrical parts |
| 08/16/2001 | US20010014543 Semiconductor wafer including a dot mark of a peculiar shape and method of forming the dot mark |
| 08/16/2001 | US20010014538 Leadless plastic chip carrier with etch back pad singulation and die attach pad array |
| 08/16/2001 | US20010014531 Multilayer alignment keys and alignment method using the same |
| 08/16/2001 | US20010014523 Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device |
| 08/16/2001 | US20010014520 Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units |
| 08/16/2001 | US20010014509 Forming dielectric layer on surface of semiconductor, forming first and second conductive lines in first dielectric layer, forming second dielectric layer covering first and second conductive lines, forming hole, filling with fuse material |
| 08/16/2001 | US20010014491 Lead frame and manufacturing method thereof |
| 08/16/2001 | US20010014490 Method of manufacturing semiconductor integrated circuit device |
| 08/16/2001 | US20010014488 Multi chip semiconductor package and method of construction |
| 08/16/2001 | US20010014487 Hybrid S.C. devices and method of manufacture thereof |
| 08/16/2001 | US20010014486 Method Of Making A Plastic Pakage For An Optical Integrated Circuit Device |
| 08/16/2001 | US20010014413 Substrate for high-voltage modules |
| 08/16/2001 | US20010014390 Method for attenuating thermal sensation when handling objects at non-body temperature |
| 08/16/2001 | US20010014016 Electronic circuit package assembly and method of producing the same |
| 08/16/2001 | US20010014015 Electronic package with stacked connections and method for making same |
| 08/16/2001 | US20010014012 Electronic instrument having a heat sink |
| 08/16/2001 | US20010014011 Heat sink-equipped cooling apparatus |
| 08/16/2001 | US20010013756 Hermetic encapsulation package and method of fabrication thereof |
| 08/16/2001 | US20010013663 Integrated circuit device having c4 and wire bond connections |
| 08/16/2001 | US20010013662 Pad layout and lead layout in semiconductor device |
| 08/16/2001 | US20010013661 Semiconductor device |
| 08/16/2001 | US20010013660 Beol decoupling capacitor |
| 08/16/2001 | US20010013658 Integrated circuit and method for its manufacture |
| 08/16/2001 | US20010013657 Semiconductor device and method of manufacturing the same |
| 08/16/2001 | US20010013656 Semiconductor device and method of producing the same |
| 08/16/2001 | US20010013655 Methods of making microelectronic connections with liquid conductive elements |
| 08/16/2001 | US20010013654 Ball grid package with multiple power/ ground planes |
| 08/16/2001 | US20010013653 Array of electrodes reliable, durable and economical and process for fabrication thereof |
| 08/16/2001 | US20010013652 Semiconductor device free from short-circuit between bump electrodes and separation from circuit board and process of fabrication thereof |
| 08/16/2001 | US20010013651 Semiconductor device and manufacturing method therefor |
| 08/16/2001 | US20010013650 Circuit interconnect providing reduced crosstalk and simultaneous switching noise |
| 08/16/2001 | US20010013649 Encapsulated transfer molding of a semiconductor die with attached heat sink |
| 08/16/2001 | US20010013648 Method of manufacturing a ceramic package utilizing green sheets |
| 08/16/2001 | US20010013647 Flexible substrate based ball grid array (BGA) package |
| 08/16/2001 | US20010013646 Semiconductor device, method for manufacturing same and portable device |
| 08/16/2001 | US20010013645 Semiconductor chip package |
| 08/16/2001 | US20010013644 Chip carriers with enhanced wire bondabi lity |
| 08/16/2001 | US20010013643 Semiconductor integrated circuit device |
| 08/16/2001 | US20010013642 BGA Package Having Substrate With Patterned Solder Mask Defining Open Die Attach Area |
| 08/16/2001 | US20010013641 Mounting substrate and mounting method for semiconductor device |
| 08/16/2001 | US20010013640 Semiconductor device package having separate substrate, strengthening ring and cap structures |
| 08/16/2001 | US20010013639 Ball-grid-array semiconductor with protruding terminals |
| 08/16/2001 | US20010013637 Iridium conductive electrode/barrier structure and method for same |
| 08/16/2001 | US20010013626 Semiconductor device |
| 08/16/2001 | US20010013618 Semiconductor device and method of fabricating the same |
| 08/16/2001 | US20010013617 Semiconductor device and method of manufacturing the same |
| 08/16/2001 | US20010013606 Apparatus for mapping scratches in an oxide film |
| 08/16/2001 | US20010013598 Semiconductor memory device having memory cell area and peripheral circuit area |
| 08/16/2001 | US20010013531 Apparatus and method of clamping semiconductor devices using sliding finger supports |
| 08/16/2001 | US20010013425 Multilayered Substrate for Semiconductor Device |
| 08/16/2001 | US20010013423 Flip chip attach on flexible circuit carrier using chip with metallic cap on solder |
| 08/16/2001 | US20010013422 Electronic interconnection medium having offset electrical mesh plane |
| 08/16/2001 | US20010013421 Leaded semiconductor device package for use in nonsoldering assembling |
| 08/16/2001 | US20010013393 Low molecular weight polyester of a linear aliphatic diol and a dicarboxylic acid reacted with a diisocyanate; high crystallinity; high oxygen and moisture barrier properties |
| 08/16/2001 | US20010013172 Process for producing an electrical component having a plurality of soldered-on plug contacts |
| 08/16/2001 | EP1124259A2 Cooling device for a high power semiconductor module |
| 08/16/2001 | EP1124256A1 Ceramic substrate |
| 08/16/2001 | EP1123565A1 Embedded capacitor multi-chip modules |
| 08/16/2001 | EP1123564A1 Lead frame structure for the fabrication of hybrid semiconductor devices |
| 08/16/2001 | EP1123535A1 Hot-melt adhesive component layers for smart cards |
| 08/16/2001 | EP1123348A2 Impact-resistant epoxide resin compositions |
| 08/16/2001 | EP0662244B1 Plastic semiconductor package with aluminum heat spreader |
| 08/16/2001 | DE4217075C2 Fluorpolymer-Verbundmaterial mit niedrigem Volumenanteil an keramischem Füllstoff Fluoropolymer composite material having a low volume fraction of ceramic filler |
| 08/16/2001 | DE10105920A1 Semiconducting component has anisotropically conductive film connecting semiconducting element to circuit board, film substrate of insulating resin with mutually insulated conducting tracks |
| 08/16/2001 | DE10102197A1 Multiple chip component with wireless packing has dies or chip elements with bumps on lower line frames, upper line frames coupled to dies, connecting rails interconnected in pairs |
| 08/16/2001 | DE10006447A1 Miniaturized component has system bearer and crystalline substrate surfaces at defined angle, adhesive fully or partly filling space between distance structures, substrate and system bearer |
| 08/16/2001 | DE10006215A1 Kühlvorrichtung für ein Hochleistungs-Halbleitermodul A cooling apparatus for a high-power semiconductor module |
| 08/16/2001 | DE10005494A1 Elektronisches Bauteil und Verfahren zur Herstellung des Bauteils Electronic component and method for producing the component |