Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2013
11/19/2013US8587098 Integrated circuit protruding pad package system and method for manufacturing thereof
11/19/2013US8587097 Semiconductor device that suppresses malfunctions due to noise generated in internal circuit
11/19/2013US8587096 Semiconductor device including shielding layer and fabrication method thereof
11/19/2013US8587095 Method for establishing and closing a trench of a semiconductor component
11/19/2013US8587092 Semiconductor device and manufacturing method of the same
11/19/2013US8587090 Die seal ring structure
11/19/2013US8587089 Seal ring structure with polyimide layer adhesion
11/19/2013US8587088 Side-mounted controller and methods for making the same
11/19/2013US8587073 High voltage resistor
11/19/2013US8587072 Silicon carbide semiconductor device
11/19/2013US8587071 Electrostatic discharge (ESD) guard ring protective structure
11/19/2013US8587069 Modified electrostatic discharge arrangement within a single multiple-integrated circuit package
11/19/2013US8587035 Device
11/19/2013US8587016 Light emitting device package having light emitting device on inclined side surface and lighting system including the same
11/19/2013US8587008 Light-emitting device
11/19/2013US8587001 Light-emitting diode light module free of jumper wires
11/19/2013US8586983 Semiconductor chip embedded with a test circuit
11/19/2013US8586982 Semiconductor test chip device to mimic field thermal mini-cycles to assess reliability
11/19/2013US8586493 Silicon nitride sintered body, method of producing the same, and silicon nitride circuit substrate and semiconductor module using the same
11/19/2013US8586477 Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor package
11/19/2013US8586467 Method of mounting electronic component and mounting substrate
11/19/2013US8586418 Method for the production of an electronic component and electronic component produced according to this method
11/19/2013US8586417 Isostress grid array and method of fabrication thereof
11/19/2013US8585272 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
11/19/2013US8584924 Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate
11/19/2013US8584738 Apparatus and method for extracting heat from a device
11/19/2013US8584736 Heat sink assembly having a fin also functioning as a supporting bracket
11/15/2013DE202013008891U1 Kühlmodul Cooling module
11/14/2013WO2013170203A1 Wafer scale packaging die with offset redistribution layer capture pad
11/14/2013WO2013170197A1 Wafer scale packaging die having redistribution layer capture pad with at least one void
11/14/2013WO2013170098A1 Piezoelectric active cooling device
11/14/2013WO2013169801A1 Integrated circuit package auto-routing
11/14/2013WO2013169501A1 Enhanced hydrogen barrier encapsulation of ferroelectric capacitors
11/14/2013WO2013169424A1 Graphene cap for copper interconnect structures
11/14/2013WO2013169423A1 Method and apparatus for controlling thermal cycling
11/14/2013WO2013169120A1 Ceramic heat sink components and method for their fabrication
11/14/2013WO2013168711A1 Power module, mounting structure of connection terminal in power module, and connection terminal
11/14/2013WO2013168521A1 Resin-sealed semiconductor device and production method therefor
11/14/2013WO2013168377A1 Waveguide structure having ebg characteristic
11/14/2013WO2013168354A1 Three-dimensional integrated circuit having stabilization structure for power supply voltage, and method for manufacturing same
11/14/2013WO2013168236A1 Resin-sealed semiconductor device and production method for resin-sealed semiconductor device
11/14/2013WO2013168223A1 Semiconductor package and method for manufacturing same
11/14/2013WO2013167614A1 Aluminium coated copper ribbon
11/14/2013WO2013167609A1 Aluminium coated copper bond wire and method of making the same
11/14/2013WO2013167603A1 Aluminium coated copper bond wire and method of making the same
11/14/2013WO2013167569A1 Apparatus for moulding a housing structure for a plurality of electronic components, and a housing structure of this kind for a plurality of electronic components
11/14/2013WO2013167322A1 Arrangement for heat dissipation for a plastic housing having electronic components arranged therein
11/14/2013WO2013167203A1 Cooling system and method for cooling radio unit
11/14/2013WO2013167123A1 Method for producing metal-ceramic substrates, and metal-ceramic substrate produced according to said method
11/14/2013WO2013166957A1 Power mos device structure
11/14/2013WO2012171726A3 Copper filled opening with a cap layer
11/14/2013US20130303651 Photocurable material for sealing, sealing method, sealing material, and housing using said sealing material
11/14/2013US20130302942 3d ic configuration with contactless communication
11/14/2013US20130302941 Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces
11/14/2013US20130302627 Vapor-deposited coating for barrier films and methods of making and using the same
11/14/2013US20130302603 Adhesive composition and semiconductor device using same
11/14/2013US20130302570 Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
11/14/2013US20130301221 Thermal management system and method between heat generating chip and housing in electronic apparatus
11/14/2013US20130300004 Semiconductor Device and Method of Controlling Warpage in Semiconductor Package
11/14/2013US20130300003 Enhanced Hydrogen Barrier Encapsulation Method for the Control of Hydrogen Induced Degradation of Ferroelectric Capacitors in an F-RAM Process
11/14/2013US20130300002 Resin sealed module
11/14/2013US20130300001 Semiconductor device
11/14/2013US20130300000 Microelectronic package with stacked microelectronic elements and method for manufacture thereof
11/14/2013US20130299998 Semiconductor Device and Method of Forming Guard Ring Around Conductive TSV Through Semiconductor Wafer
11/14/2013US20130299997 Methods of forming bonded semiconductor structures
11/14/2013US20130299995 Semiconductor Device and Method of Depositing Underfill Material With Uniform Flow Rate
11/14/2013US20130299994 Integrated circuits and processes for forming integrated circuits having an embedded electrical interconnect within a substrate
11/14/2013US20130299993 Interconnection of semiconductor device and fabrication method thereof
11/14/2013US20130299992 Bump Structure for Stacked Dies
11/14/2013US20130299991 Semiconductor Device and Manufacturing Method Thereof
11/14/2013US20130299990 Single metal damascene structure and method of forming the same
11/14/2013US20130299989 Chip connection structure and method of forming
11/14/2013US20130299988 Graphene cap for copper interconnect structures
11/14/2013US20130299987 Semiconductor structure having etch stop layer
11/14/2013US20130299986 Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages
11/14/2013US20130299985 Process for fabricating gallium arsenide devices with copper contact layer
11/14/2013US20130299984 Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging
11/14/2013US20130299983 Through Wire Interconnect (TWI) For Semiconductor Components Having Wire In Via And Bonded Connection With Substrate Contact
11/14/2013US20130299982 Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
11/14/2013US20130299981 Molding material, method of fabricating the same, and semiconductor device
11/14/2013US20130299980 Protruding terminals with internal routing interconnections semiconductor device
11/14/2013US20130299979 Plated terminals with routing interconnections semiconductor device
11/14/2013US20130299978 Wiring boards and semiconductor packages including the same
11/14/2013US20130299977 Ramp-stack chip package with variable chip spacing
11/14/2013US20130299976 Semiconductor Die Connection System and Method
11/14/2013US20130299975 Semiconductor Device and Method of Forming Through Vias with Reflowed Conductive Material
11/14/2013US20130299974 Semiconductor Device and Method of Forming Open Cavity in TSV Interposer to Contain Semiconductor Die in WLCSMP
11/14/2013US20130299973 Semiconductor Die and Method of Forming FO-WLCSP Vertical Interconnect Using TSV and TMV
11/14/2013US20130299972 Self-aligned protection layer for copper post structure
11/14/2013US20130299971 Semiconductor Device and Method of Forming Penetrable Film Encapsulant Around Semiconductor Die and Interconnect Structure
11/14/2013US20130299970 Semiconductor device
11/14/2013US20130299969 Semiconductor package and method of manufacturing the semiconductor package
11/14/2013US20130299968 Semiconductor package and a substrate for packaging
11/14/2013US20130299967 Wsp die having redistribution layer capture pad with at least one void
11/14/2013US20130299966 Wsp die with offset redistribution layer capture pad
11/14/2013US20130299965 Semiconductor assemblies, structures, and methods of fabrication
11/14/2013US20130299964 Method for forming a fine pattern using isotropic etching
11/14/2013US20130299963 Production method of cooler
11/14/2013US20130299962 Semiconductor device and method for manufacturing same
11/14/2013US20130299961 Semiconductor package and fabrication method thereof
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