| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/23/2001 | US20010015489 Semiconductor device and its manufacturing method |
| 08/23/2001 | US20010015487 Stackable chip package with flex carrier |
| 08/23/2001 | US20010015486 Semicondutor device with resin package |
| 08/23/2001 | US20010015485 Higher-density memory card |
| 08/23/2001 | US20010015484 Heat -resistant adhesive sheet |
| 08/23/2001 | US20010015483 Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof |
| 08/23/2001 | US20010015482 Semiconductor device and method for manufacturing the same |
| 08/23/2001 | US20010015481 Semiconductor integrated circuit device and method of manufacturing the same |
| 08/23/2001 | US20010015480 Lead frame attachment for optoelectronic device |
| 08/23/2001 | US20010015479 Tape under frame for conventional-type IC package assembly |
| 08/23/2001 | US20010015477 Method of packaging fuses |
| 08/23/2001 | US20010015476 Semiconductor device |
| 08/23/2001 | US20010015474 Method of manufacturing a double-heterojunction bipolar transistor on III-V material |
| 08/23/2001 | US20010015472 Semiconductor device using fuse/anti-fuse system and method of manufacturing the same |
| 08/23/2001 | US20010015471 Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry |
| 08/23/2001 | US20010015467 Transistor for a semiconductor device and method for fabricating same |
| 08/23/2001 | US20010015464 Semiconductor integrated circuit design method and computer-readable recording medium |
| 08/23/2001 | US20010015452 Semiconductor device having contact hole and method of manufacturing the same |
| 08/23/2001 | US20010015443 Semiconductor light emitting device |
| 08/23/2001 | US20010015439 Bumped semiconductor component having test pads, and method and system for testing bumped semiconductor components |
| 08/23/2001 | US20010015436 Semiconductor device and method of manufacturing the same |
| 08/23/2001 | US20010015327 Surface package type semiconductor package and method of producing semiconductor memory |
| 08/23/2001 | US20010015288 Microcircuit shielded, controlled impedance "gatling gun" via |
| 08/23/2001 | US20010015285 Semiconductor device |
| 08/23/2001 | US20010015221 Solar cell and method of fabricating the same |
| 08/23/2001 | US20010015012 Structure of conductive bump in wiring board |
| 08/23/2001 | US20010015009 Method of fabricating semiconductor package |
| 08/23/2001 | EP1145123A3 Calibrating functions of an integrated circuit and storing calibration parameters thereof in a programmable fuse array |
| 08/23/2001 | DE10106492A1 Halbleiterbauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 08/23/2001 | DE10103312A1 Layoutentwurfsverfahren Layout design method |
| 08/23/2001 | DE10007828A1 Heat dissipating device has housing that includes central area and fins, with slit formed in between each two adjacent fins, and mounting plate with fan that is secured to housing |
| 08/23/2001 | DE10006528A1 Fuse arrangement used in a semiconductor device has a strip-like metal layer with a restriction arranged on a semiconductor body which is thermally insulated below the restriction |
| 08/23/2001 | DE10006505A1 Leistungshalbleiter-Modul aus einer Vielzahl von parallel zueinander geschalteten IGBT-Chips Power semiconductor module consisting of a plurality of parallel-connected IGBT chips |
| 08/23/2001 | DE10006446A1 Verkapselung für ein elektrisches Bauelement und Verfahren zur Herstellung Encapsulation of an electrical component and method for preparing |
| 08/23/2001 | DE10006445A1 Leadframe Interposer Leadframe interposer |
| 08/23/2001 | DE10006243A1 Schmelzbrückenanordnung in integrierten Schaltungen Fusion-bridge arrangement in integrated circuits |
| 08/22/2001 | EP1126752A2 Chip scale packaging on CTE matched printed wiring boards |
| 08/22/2001 | EP1126546A2 Electrical connection |
| 08/22/2001 | EP1126522A1 Packaged integrated circuit with radio frequency antenna |
| 08/22/2001 | EP1126521A1 Method of manufacturing electrical contacts of an elelctrical device |
| 08/22/2001 | EP1126520A2 IC device and method of manufacturing the same |
| 08/22/2001 | EP1126519A2 Structure and method for bond pads of copper-metallized intergrated circuits |
| 08/22/2001 | EP1126518A2 Process for fabricating a semiconductor device |
| 08/22/2001 | EP1126515A1 Method of manufacturing a III-V material double heterojunction bipolar transistor |
| 08/22/2001 | EP1125482A1 Stacked circuit board assembly adapted for heat dissipation |
| 08/22/2001 | EP1125479A1 Fabrication process for flex circuit applications |
| 08/22/2001 | EP1125330A1 Method of creating an electrical interconnect device bearing an array of electrical contact pads |
| 08/22/2001 | EP1125329A1 Tape ball grid array with interconnected ground plane |
| 08/22/2001 | EP1125327A1 High-performance dual-damascene interconnect structures |
| 08/22/2001 | EP1125318A1 Apparatus for and method of manufacturing a semiconductor die carrier |
| 08/22/2001 | EP1124882A1 PREPARATION OF CROSS-LINKED 2-DIMENSIONAL POLYMERS WITH SIDEDNESS FROM $g(a),$g(b)-LACTONES |
| 08/22/2001 | EP0990240B1 Electric capacitor |
| 08/22/2001 | EP0954425A4 Method for transfer molding standard electronic packages and apparatus formed thereby |
| 08/22/2001 | EP0856199B1 Polymer stud grid array |
| 08/22/2001 | EP0596075B1 Non-conductive end layer for integrated stack of ic chips |
| 08/22/2001 | CN2444386Y High conducting radiating device |
| 08/22/2001 | CN1309815A Thermally conductive mounting arrangement for securing integrated circuit package to heat sink |
| 08/22/2001 | CN1309794A Biometrix sensor and corresponding production method |
| 08/22/2001 | CN1309625A Glass ceramics composition and electronic parts and multilayered LC multiple component using same |
| 08/22/2001 | CN1309425A Semiconductor integrated circuit device and mfg. method thereof |
| 08/22/2001 | CN1309424A Semiconductor device |
| 08/22/2001 | CN1309418A Method and device for forming film on substrate |
| 08/22/2001 | CN1309341A Cooling device provided with radiator |
| 08/22/2001 | CN1309073A Long lead rack conveying mechanism of electric plating device |
| 08/21/2001 | US6279147 Use of an existing product map as a background for making test masks |
| 08/21/2001 | US6278951 Crosstalk noise calculation method and storage medium |
| 08/21/2001 | US6278653 Reduced skew timing scheme for write circuitry used in memory circuits |
| 08/21/2001 | US6278618 Substrate strips for use in integrated circuit packaging |
| 08/21/2001 | US6278616 Modifying memory device organization in high density packages |
| 08/21/2001 | US6278615 Heatsink grounding spring and shield apparatus |
| 08/21/2001 | US6278284 Testing IC socket |
| 08/21/2001 | US6278264 Flip-chip switching regulator |
| 08/21/2001 | US6278193 Optical sensing method to place flip chips |
| 08/21/2001 | US6278192 Semiconductor device with encapsulating material composed of silica |
| 08/21/2001 | US6278190 Semiconductor device |
| 08/21/2001 | US6278189 High density integrated circuits using tapered and self-aligned contacts |
| 08/21/2001 | US6278188 Semiconductor constructions comprising aluminum-containing layers |
| 08/21/2001 | US6278187 Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof |
| 08/21/2001 | US6278186 Parasitic current barriers |
| 08/21/2001 | US6278184 Solder disc connection |
| 08/21/2001 | US6278182 Lead frame type semiconductor package |
| 08/21/2001 | US6278181 Stacked multi-chip modules using C4 interconnect technology having improved thermal management |
| 08/21/2001 | US6278180 Ball-grid-array-type semiconductor device and its fabrication method and electronic device |
| 08/21/2001 | US6278178 Integrated device package and fabrication methods thereof |
| 08/21/2001 | US6278177 Substrateless chip scale package and method of making same |
| 08/21/2001 | US6278176 Semiconductor device and process for producing the same |
| 08/21/2001 | US6278175 Leadframe alteration to direct compound flow into package |
| 08/21/2001 | US6278174 Integrated circuit insulator and structure using low dielectric insulator material including HSQ and fluorinated oxide |
| 08/21/2001 | US6278171 Sublithographic fuses using a phase shift mask |
| 08/21/2001 | US6278150 Conductive layer connecting structure and method of manufacturing the same |
| 08/21/2001 | US6278148 Semiconductor device having a shielding conductor |
| 08/21/2001 | US6278129 Corrosion sensitivity structures for vias and contact holes in integrated circuits |
| 08/21/2001 | US6278128 Semiconductor device having external connection terminals formed in two-dimensional area |
| 08/21/2001 | US6278049 Thermoelectric devices and methods for making the same |
| 08/21/2001 | US6277766 Method of making fullerene-decorated nanoparticles and their use as a low dielectric constant material for semiconductor devices |
| 08/21/2001 | US6277764 Forming silicon oxyfluoride dielectric |
| 08/21/2001 | US6277763 Controlled etching |
| 08/21/2001 | US6277761 Method for fabricating stacked vias |
| 08/21/2001 | US6277740 Integrated circuit trenched features and method of producing same |
| 08/21/2001 | US6277731 Method for forming a semiconductor connection with a top surface having an enlarged recess |