| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/28/2001 | US6281432 Sheet metal component with depression |
| 08/28/2001 | US6281161 Platinum-containing materials and catalysts |
| 08/28/2001 | US6281133 Method for forming an inter-layer dielectric layer |
| 08/28/2001 | US6281126 Process for manufacturing semiconductor device |
| 08/28/2001 | US6281120 Temperature control structure for integrated circuit |
| 08/28/2001 | US6281119 Method for making contact with a semiconductor layer and semiconductor structure having a plurality of layers |
| 08/28/2001 | US6281118 Method of manufacturing semiconductor device |
| 08/28/2001 | US6281117 Method to form uniform silicide features |
| 08/28/2001 | US6281113 Method for forming an interplayer insulating film and semiconductor device |
| 08/28/2001 | US6281112 Structure of interlayer insulator film and method for planarization of interlayer insulator film |
| 08/28/2001 | US6281111 Semiconductor apparatus and method for fabricating the same |
| 08/28/2001 | US6281109 Advance metallization process |
| 08/28/2001 | US6281108 System and method to provide power to a sea of gates standard cell block from an overhead bump grid |
| 08/28/2001 | US6281107 Semiconductor device and method for manufacturing the same |
| 08/28/2001 | US6281106 Method of solder bumping a circuit component |
| 08/28/2001 | US6281105 Unzippable polymer selected from the group consisting of poly-alpha-methylstyrene, polypropylene carbonate, polyethylene carbonate and polychloral dissolved in said solvent |
| 08/28/2001 | US6281104 Low temperature reflow method for filling high aspect ratio contacts |
| 08/28/2001 | US6281100 Semiconductor processing methods |
| 08/28/2001 | US6281096 Chip scale packaging process |
| 08/28/2001 | US6281090 Method for the manufacture of printed circuit boards with plated resistors |
| 08/28/2001 | US6281083 Methods of forming field effect transistor gates, and methods of forming integrated circuitry |
| 08/28/2001 | US6281054 SOI device and method for fabricating the same |
| 08/28/2001 | US6281051 Semiconductor device and manufacturing method thereof |
| 08/28/2001 | US6281047 Method of singulating a batch of integrated circuit package units constructed on a single matrix base |
| 08/28/2001 | US6281046 Method of forming an integrated circuit package at a wafer level |
| 08/28/2001 | US6281045 Semiconductor apparatus, manufacturing method thereof and electronic apparatus |
| 08/28/2001 | US6281044 Method and system for fabricating semiconductor components |
| 08/28/2001 | US6281043 Fabrication of hybrid semiconductor devices |
| 08/28/2001 | US6281042 Structure and method for a high performance electronic packaging assembly |
| 08/28/2001 | US6281041 Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball |
| 08/28/2001 | US6281040 Methods for making circuit substrates and electrical assemblies |
| 08/28/2001 | US6281029 Probe points for heat dissipation during testing of flip chip IC |
| 08/28/2001 | US6281028 LED alignment points for semiconductor die |
| 08/28/2001 | US6281026 Semiconductor device and method for manufacturing the same |
| 08/28/2001 | US6280858 Substrate with solder alloy for mounting electronic parts |
| 08/28/2001 | US6280829 Glass based material with silica, alumina, borate with calcium oxide and magnesium oxide |
| 08/28/2001 | US6280828 Flexible wiring board |
| 08/28/2001 | US6280797 Coating material and method for providing asset protection |
| 08/28/2001 | US6280640 Providing layers of copper conductors on base; electrically connecting layers of copper conductors by aluminum studs; providing barrier metal mask; anodizing unprotected aluminum; removing aluminum oxide; etching copper conductor; polishing |
| 08/28/2001 | US6280595 Providing substrate having electrode at its surfacethat is proximate to molecule bearing protected functional group; applying potential to electrode to generate electrochemical reagents to deprotect; bonding with monomer |
| 08/28/2001 | US6280496 Mixture with aluminum or copper |
| 08/28/2001 | US6280219 Socket apparatus for IC packages |
| 08/28/2001 | US6280218 Socket for electrical parts |
| 08/28/2001 | US6280116 Fixing device |
| 08/28/2001 | US6279816 Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices |
| 08/28/2001 | US6279649 Cooling apparatus using boiling and condensing refrigerant |
| 08/28/2001 | US6279648 Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices, and cooling devices manufactured by the method |
| 08/28/2001 | US6279563 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 08/28/2001 | US6279337 Refrigeration system for electronic components having environmental isolation |
| 08/28/2001 | US6279336 Assembly for switching electrical power |
| 08/28/2001 | US6279227 Method of forming a resilient contact structure |
| 08/28/2001 | US6279226 Lead bonding machine for bonding leads of a chip disposed over a carrier tape to an electrode pad formed on the chip |
| 08/28/2001 | CA2241765C Solid-state relay |
| 08/23/2001 | WO2001062057A1 Heat sink with an integrated component clamping device |
| 08/23/2001 | WO2001061758A1 Lateral dmos improved breakdown structure and method |
| 08/23/2001 | WO2001061757A1 Module and method for interconnecting integrated circuits that facilitate high speed signal propagation with reduced noise |
| 08/23/2001 | WO2001061754A1 Semiconductor device fabrication method and semiconductor device fabrication device |
| 08/23/2001 | WO2001061753A1 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same |
| 08/23/2001 | WO2001061752A1 Rf power transistor having cascaded cells with phase matching between cells |
| 08/23/2001 | WO2001061751A2 Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessor |
| 08/23/2001 | WO2001061746A2 Test structure for metal cmp process control |
| 08/23/2001 | WO2001061744A1 Method for manufacturing semiconductor device |
| 08/23/2001 | WO2001061737A1 Electron beam modification of cvd deposited films, forming low dielectric constant materials |
| 08/23/2001 | WO2001061718A1 Semiconductor power component comprising a safety fuse |
| 08/23/2001 | WO2001060938A1 Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| 08/23/2001 | WO2001060913A1 Thermosetting resin composition |
| 08/23/2001 | WO2001060891A1 Polyalkylene polysulphides |
| 08/23/2001 | WO2001060242A2 Test structure for metal cmp process control |
| 08/23/2001 | WO2000050994A3 Calibrating functions of an integrated circuit and storing calibration parameters thereof in a programmable fuse array |
| 08/23/2001 | US20010016551 Shock resistance; high strength; heat resistance |
| 08/23/2001 | US20010016462 Laminated support |
| 08/23/2001 | US20010016435 IC socket for surface-monuting semiconductor device |
| 08/23/2001 | US20010016419 Integration of low-k SiOF for damascene structure |
| 08/23/2001 | US20010016418 Method for forming interconnection of semiconductor device |
| 08/23/2001 | US20010016415 Method of improving copper pad adhesion |
| 08/23/2001 | US20010016413 Semiconductor device and method of manufacturing a semiconductor device with reduced contact failures |
| 08/23/2001 | US20010016408 Mask repattern process |
| 08/23/2001 | US20010016407 Integrated circuit having conductive paths of different heights formed from the same layer structure and method for forming the same |
| 08/23/2001 | US20010016400 Method of making wafer level chip scale package |
| 08/23/2001 | US20010016384 Semiconductor device and process for fabrication thereof |
| 08/23/2001 | US20010016374 Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices |
| 08/23/2001 | US20010016373 Hybrid frame with lead-lock tape |
| 08/23/2001 | US20010016371 Method of fabricating a semiconductor device |
| 08/23/2001 | US20010016370 Low cost decal material used for packaging |
| 08/23/2001 | US20010016369 Chip scale surface mount package for semiconductor device and process of fabricating the same |
| 08/23/2001 | US20010015811 Test structure for metal CMP process control |
| 08/23/2001 | US20010015785 Interposer device |
| 08/23/2001 | US20010015781 Liquid crystal display device, wiring substrate, and methods for fabricating the same |
| 08/23/2001 | US20010015773 Special contact points for accessing internal circuitry of an integrated circuit |
| 08/23/2001 | US20010015676 Wireless communication system |
| 08/23/2001 | US20010015652 Probe card assembly and kit, and methods of making same |
| 08/23/2001 | US20010015499 Semiconductor device and method for fabricating the same |
| 08/23/2001 | US20010015498 Semiconductor device and method of fabricating the same |
| 08/23/2001 | US20010015497 Integrated circuit package, ball-grid array integrated circuit package and methods of packaging an integrated circuit |
| 08/23/2001 | US20010015496 Semiconductor device and method for the fabrication thereof |
| 08/23/2001 | US20010015495 Process for forming cone shaped solder for chip interconnection |
| 08/23/2001 | US20010015493 Chip on board with heat sink attachment |
| 08/23/2001 | US20010015492 Packaged die on pcb with heat sink encapsulant |
| 08/23/2001 | US20010015491 Printed-wiring substrate having lead pins |
| 08/23/2001 | US20010015490 High speed digital and microwave device package |