| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/30/2001 | US20010017411 Semiconductor chip and semiconductor device having the chip |
| 08/30/2001 | US20010017410 Mounting multiple semiconductor dies in a package |
| 08/30/2001 | US20010017408 Semiconductor package |
| 08/30/2001 | US20010017407 Method and apparatus for a semiconductor package for vertical surface mounting |
| 08/30/2001 | US20010017406 Stacked structure of stackable semiconductor packages and method of stacking same |
| 08/30/2001 | US20010017405 Solid-state image pickup device and a method of manufacturing the same |
| 08/30/2001 | US20010017404 Transverse hybrid LOC package |
| 08/30/2001 | US20010017402 Semiconductor device and method of manufacturing the same |
| 08/30/2001 | US20010017400 Semiconductor device |
| 08/30/2001 | US20010017391 Method of fabricating semiconductor device |
| 08/30/2001 | US20010017377 Chip-type semiconductor device |
| 08/30/2001 | US20010017373 Diamond interconnection substrate and a manufacturing method therefor |
| 08/30/2001 | US20010017221 Wiring boards, semiconductor devices and their production processes |
| 08/30/2001 | US20010016978 Method of making an electronic device |
| 08/30/2001 | DE19945914C1 Verfahren zur Erzeugung von präzisen Lötflächen auf einem Schaltungsträger, insbesondere Dünnfilm-Substrat A method for generating precision soldering areas on a circuit carrier, in particular thin-film-substrate |
| 08/30/2001 | DE10109531A1 Starting mixture for the production of a ceramic used in the production of semiconductor elements in information technology comprises a crystallized glass and a filler |
| 08/30/2001 | DE10008386A1 Method for connecting substrates of a vertical, integrated circuit structure partitions a top substrate into a first subpart with a metallizing structure and a second silicon subpart with a circuit structure. |
| 08/30/2001 | DE10000090A1 Electrical connecting element production method has embossed substrate provided with selectively etched conductive galvanic coating |
| 08/29/2001 | EP1128435A2 Microwave electric elements using porous silicon dioxide layer and forming method of same |
| 08/29/2001 | EP1128434A2 Multi-layered multi-chip module for high frequencies |
| 08/29/2001 | EP1128433A2 Method of connecting substrates of a vertically integrated circuit structure |
| 08/29/2001 | EP1128432A2 Fixation of semiconductor modules to a heatsink |
| 08/29/2001 | EP1128431A2 Flip-chip type semiconductor device and method of manufacturing the same |
| 08/29/2001 | EP1128424A2 Test structure close to integrated semiconductor |
| 08/29/2001 | EP1128423A2 Flip-Chip mounted electronic device with multi-layer electrodes |
| 08/29/2001 | EP1128421A2 Method of fabricating an interlayer insulating film comprising Si, O, C and H for semiconductor devices |
| 08/29/2001 | EP1128416A2 Semiconductor device having an inductor |
| 08/29/2001 | EP1128248A1 Semiconductor chip with a light sensitive element |
| 08/29/2001 | EP1128136A2 Absorbent pair refrigeration system |
| 08/29/2001 | EP1127956A2 Tantalum nitride CVD deposition by tantalum oxide densification |
| 08/29/2001 | EP1127838A2 Flip-chip assembly of protected micromechanical devices |
| 08/29/2001 | EP1127479A1 An electrical component and an electrical circuit module having connected ground planes |
| 08/29/2001 | EP1127387A1 Non-circular micro-via |
| 08/29/2001 | EP1127376A1 Integrated circuit chip made secure against the action of electromagnetic radiation |
| 08/29/2001 | EP1127375A1 Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same |
| 08/29/2001 | EP1127368A2 Method for forming silicide regions on an integrated device |
| 08/29/2001 | EP1127031A1 High performance embedded rf filters |
| 08/29/2001 | EP1008002B1 Metallic housing with ceramic insert for electronic or optoelectronic components |
| 08/29/2001 | CN2445435Y Geometric fish-type body type airflow guidance and heat sinking device |
| 08/29/2001 | CN2445434Y Geometric fish-type body airflow guidance heat sink |
| 08/29/2001 | CN2445433Y Crossover radiating fin device |
| 08/29/2001 | CN2445432Y Heat sink |
| 08/29/2001 | CN2445431Y 热传导接触接口 Heat conductive contact interface |
| 08/29/2001 | CN1310476A Joining technique and structure adapted for copper metallized wire |
| 08/29/2001 | CN1310474A Large power semiconductor assembly capable of relieving mechanical stress |
| 08/29/2001 | CN1310473A Heat radiator and its manufacture |
| 08/29/2001 | CN1310472A Apparatus for separating semiconductor device for semiconductor crystal plate |
| 08/29/2001 | CN1310471A Method for forming double-layer low-dielectric barrier-layer using for interconnection and its forming apparatus |
| 08/29/2001 | CN1310469A Integrated circuit assembly band and its producing method |
| 08/29/2001 | CN1070315C White light electroluminescent device with organic multi quantum sink structure |
| 08/28/2001 | US6282679 Pattern and method of metal line package level test for semiconductor device |
| 08/28/2001 | US6282100 Low cost ball grid array package |
| 08/28/2001 | US6282098 Electronic circuit module, electronic circuit module connecting structure and connecting member, and method for connecting the same |
| 08/28/2001 | US6282096 Integration of heat conducting apparatus and chip carrier in IC package |
| 08/28/2001 | US6282095 Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures |
| 08/28/2001 | US6282094 Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same |
| 08/28/2001 | US6282093 LGA clamp mechanism |
| 08/28/2001 | US6282092 Electronic circuit device and method of fabricating the same |
| 08/28/2001 | US6282091 Mounting devices for a heat-generating element and a heat-dissipating device |
| 08/28/2001 | US6282089 Portable computer cooling method and computer holder |
| 08/28/2001 | US6281844 Electrical component and an electrical circuit module having connected ground planes |
| 08/28/2001 | US6281794 Radio frequency transponder with improved read distance |
| 08/28/2001 | US6281778 Monolithic inductor with magnetic flux lines guided away from substrate |
| 08/28/2001 | US6281756 Transistor with internal matching circuit |
| 08/28/2001 | US6281739 Fuse circuit and redundant decoder |
| 08/28/2001 | US6281704 High-performance interconnect |
| 08/28/2001 | US6281696 Method and test circuit for developing integrated circuit fabrication processes |
| 08/28/2001 | US6281695 Integrated circuit package pin indicator |
| 08/28/2001 | US6281592 Package structure for semiconductor chip |
| 08/28/2001 | US6281591 Semiconductor apparatus and semiconductor apparatus manufacturing method |
| 08/28/2001 | US6281590 Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module |
| 08/28/2001 | US6281588 Lead configurations |
| 08/28/2001 | US6281586 Integrated semiconductor circuit configuration having stabilized conductor tracks |
| 08/28/2001 | US6281585 Air gap dielectric in self-aligned via structures |
| 08/28/2001 | US6281584 Integrated circuit with improved adhesion between interfaces of conductive and dielectric surfaces |
| 08/28/2001 | US6281583 Planar integrated circuit interconnect |
| 08/28/2001 | US6281581 Substrate structure for improving attachment reliability of semiconductor chips and modules |
| 08/28/2001 | US6281580 LSI package and inner lead wiring method for same |
| 08/28/2001 | US6281579 Insert-molded leadframe to optimize interface between powertrain and driver board |
| 08/28/2001 | US6281578 Multi-chip module package structure |
| 08/28/2001 | US6281576 Method of fabricating structure for chip micro-joining |
| 08/28/2001 | US6281575 Multi-chip module |
| 08/28/2001 | US6281574 High power microwave transistor amplifier |
| 08/28/2001 | US6281573 Thermal enhancement approach using solder compositions in the liquid state |
| 08/28/2001 | US6281571 Semiconductor device having an external connection electrode extending through a through hole formed in a substrate |
| 08/28/2001 | US6281570 Tape carrier for BGA and semiconductor device using the same |
| 08/28/2001 | US6281569 Pressure-contact semiconductor device |
| 08/28/2001 | US6281568 Plastic integrated circuit device package and leadframe having partially undercut leads and die pad |
| 08/28/2001 | US6281567 Substrate for mounting semiconductor chip with parallel conductive lines |
| 08/28/2001 | US6281566 Plastic package for electronic devices |
| 08/28/2001 | US6281563 Laser programming of CMOS semiconductor devices using make-link structure |
| 08/28/2001 | US6281471 Energy-efficient, laser-based method and system for processing target material |
| 08/28/2001 | US6281452 Multi-level thin-film electronic packaging structure and related method |
| 08/28/2001 | US6281450 Substrate for mounting semiconductor chips |
| 08/28/2001 | US6281448 Printed circuit board and electronic components |
| 08/28/2001 | US6281446 Multi-layered circuit board and method of manufacturing the same |
| 08/28/2001 | US6281445 Device and method for connecting two electronic components |
| 08/28/2001 | US6281437 Method of forming an electrical connection between a conductive member having a dual thickness substrate and a conductor and electronic package including said connection |
| 08/28/2001 | US6281436 Encapsulated surface mounting electronic part |
| 08/28/2001 | US6281435 Chip-type electronic devices |