| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/04/2001 | US6285083 Comprising a metallic bump (nickel or copper) electrically connecting the electrode of the semiconductor to conductive pad, increasing melting point and fatigue resistance |
| 09/04/2001 | US6285082 Soft metal conductor |
| 09/04/2001 | US6285081 Deflectable interconnect |
| 09/04/2001 | US6285079 Semiconductor device employing grid array electrodes and compact chip-size package |
| 09/04/2001 | US6285078 Thermal spreader cap and grease containment structure for semiconductor device |
| 09/04/2001 | US6285077 Multiple layer tape ball grid array package |
| 09/04/2001 | US6285076 Press-connection semiconductor device and press-connection semiconductor assembly |
| 09/04/2001 | US6285075 Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly |
| 09/04/2001 | US6285074 Semiconductor device |
| 09/04/2001 | US6285071 Substrate-on-insulator semiconductor device with noise decoupling |
| 09/04/2001 | US6285070 Method of forming semiconductor die with integral decoupling capacitor |
| 09/04/2001 | US6285068 Antifuses and method of fabricating the same |
| 09/04/2001 | US6285067 Electronic device and method for manufacturing the same |
| 09/04/2001 | US6285066 Semiconductor device having field isolation |
| 09/04/2001 | US6285038 Integrated circuitry and DRAM integrated circuitry |
| 09/04/2001 | US6284985 Ceramic circuit board with a metal plate projected to prevent solder-flow |
| 09/04/2001 | US6284984 Printed circuit board, for mounting BGA elements and a manufacturing method of a printed circuit board for mounting BGA elements |
| 09/04/2001 | US6284818 Epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphosphine with benzoquinone, and a hydrous bismuth nitrate oxide |
| 09/04/2001 | US6284675 Method of forming integrated circuit dielectric by evaporating solvent to yield phase separation |
| 09/04/2001 | US6284656 Copper-polymer connections |
| 09/04/2001 | US6284651 Method for forming a contact having a diffusion barrier |
| 09/04/2001 | US6284650 Integrated tungsten-silicide processes |
| 09/04/2001 | US6284643 Electrical and thermal contact for use in semiconductor devices |
| 09/04/2001 | US6284639 Method for forming a structured metallization on a semiconductor wafer |
| 09/04/2001 | US6284634 Method for forming metal line in semiconductor device |
| 09/04/2001 | US6284627 Method for wiring semi-conductor components in order to prevent product piracy and manipulation, semi-conductors component made according to this method and use of said semi-conductor component in a chip card |
| 09/04/2001 | US6284617 Metalization outside protective overcoat for improved capacitors and inductors |
| 09/04/2001 | US6284575 Method of making a semiconductor device having fuses for repair |
| 09/04/2001 | US6284574 Method of producing heat dissipating structure for semiconductor devices |
| 09/04/2001 | US6284573 Wafer level fabrication and assembly of chip scale packages |
| 09/04/2001 | US6284571 Lead frame assemblies with voltage reference plane and IC packages including same |
| 09/04/2001 | US6284570 Method of manufacturing a semiconductor component from a conductive substrate containing a plurality of vias |
| 09/04/2001 | US6284569 Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffener |
| 09/04/2001 | US6284568 Method and system for producing semiconductor device |
| 09/04/2001 | US6284566 Chip scale package and method for manufacture thereof |
| 09/04/2001 | US6284563 Method of making compliant microelectronic assemblies |
| 09/04/2001 | US6284554 Process for manufacturing a flip-chip integrated circuit |
| 09/04/2001 | US6284389 Composite materials and methods for manufacturing composite materials |
| 09/04/2001 | US6284353 Printed wiring board and method of manufacturing the same |
| 09/04/2001 | US6284317 Providing surface comprising units having silion-hydrogen bonds; exposing to organometallic reagent; forming a silicon-carbon bond at a temperature of less than about 25.degree. c. and free of an external energy source |
| 09/04/2001 | US6284080 Barrier metallization in ceramic substrate for implantable medical devices |
| 09/04/2001 | US6284079 Method and structure to reduce low force pin pull failures in ceramic substrates |
| 09/04/2001 | US6284014 Extrudable, weldable alloy comprising base material of aluminum or titanium, boron or silicon carbide, metal having low intermetallic phase temperature, and reinforcement agent; lightweight, high strength structural members |
| 09/04/2001 | US6283835 Method and apparatus for manufacturing a semiconductor integrated circuit |
| 09/04/2001 | US6283359 Method for enhancing fatigue life of ball grid arrays |
| 09/04/2001 | US6282913 Water vaporization type cooling apparatus for heat-generating unit |
| 09/04/2001 | US6282907 Thermoelectric cooling apparatus and method for maximizing energy transport |
| 09/04/2001 | US6282781 Resin package fabrication process |
| 09/04/2001 | US6282761 Heat sink pressure clip |
| 09/01/2001 | CA2338931A1 Semiconductor device package |
| 08/30/2001 | WO2001063998A1 Multi-layer thermal interface and method for forming a thermal interface with low thermal resistance |
| 08/30/2001 | WO2001063995A1 Device for accommodating electronic components |
| 08/30/2001 | WO2001063991A1 Multilayer printed wiring board and method for producing multilayer printed wiring board |
| 08/30/2001 | WO2001063983A2 Thermal management system |
| 08/30/2001 | WO2001063673A1 Semiconductor integrated circuit and its manufacturing method |
| 08/30/2001 | WO2001063672A2 Integrated circuit interconnect system having matched impedance and capacitance |
| 08/30/2001 | WO2001063670A2 Integrated circuit package with device specific data storage |
| 08/30/2001 | WO2001063669A1 Microwave electric elements using porous silicon dioxide layer and forming method of same |
| 08/30/2001 | WO2001063668A2 Method of forming lead-free solder alloys by electrochemical deposition process |
| 08/30/2001 | WO2001063666A1 Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus |
| 08/30/2001 | WO2001063665A1 A convective heatsink |
| 08/30/2001 | WO2001063662A2 Resistor arrays for mask-alignment detection |
| 08/30/2001 | WO2001063648A2 Method of using optical proximity effects to create electrically blown fuses with sub-critical dimension neck downs |
| 08/30/2001 | WO2001063646A2 Multi-layered multi-chip module |
| 08/30/2001 | WO2001063384A1 Semiconductor chip comprising a light-sensitive element |
| 08/30/2001 | WO2000049421A9 Testing integrated circuit dice |
| 08/30/2001 | US20010018760 Method and apparatus for automatically generating multi-terminal nets, and program storage medium storing program for executing automatic multi-terminal net generation method |
| 08/30/2001 | US20010018757 Method of layouting semiconductor integrated circuit and apparatus for doing the same |
| 08/30/2001 | US20010018646 USB simulation apparatus and storage medium |
| 08/30/2001 | US20010018477 Adhesive composition |
| 08/30/2001 | US20010018286 Engagement means for ZIF electrical connector |
| 08/30/2001 | US20010018265 Method of manufacturing interconnect |
| 08/30/2001 | US20010018264 Semiconductor integrated circuit device and method of manufacturing the same |
| 08/30/2001 | US20010018261 Method and apparatus for filling a gap between spaced layers of a semiconductor |
| 08/30/2001 | US20010018236 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby |
| 08/30/2001 | US20010018235 Electrically isolated power semiconductor package |
| 08/30/2001 | US20010018234 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| 08/30/2001 | US20010018233 Method of manufacturing semiconductor device |
| 08/30/2001 | US20010018232 Process for manufacturing a semiconductor arrangement |
| 08/30/2001 | US20010018230 Flip chip C4 extension structure and process |
| 08/30/2001 | US20010018229 Semiconductor device and method for fabricating same |
| 08/30/2001 | US20010018225 Tape carrier type semiconductor device, method for manufacturing the same, and flexible substrate |
| 08/30/2001 | US20010018137 Ultra-low resistivity tantalum films and methods for their deposition |
| 08/30/2001 | US20010017769 Printed circuit board and method for mounting electrical component thereon |
| 08/30/2001 | US20010017765 Built-in inspection template for a printed circuit |
| 08/30/2001 | US20010017764 Cooling unit for cooling heat generating component and electronic apparatus having the cooling unit |
| 08/30/2001 | US20010017763 Cooling device for a high-power semiconductor module |
| 08/30/2001 | US20010017426 Semiconductor integrated circuit device and manufacturing method thereof |
| 08/30/2001 | US20010017425 Mounting structure of semiconductor device and mounting method thereof |
| 08/30/2001 | US20010017424 Methods for making copper and other metal interconnections in integrated circuits |
| 08/30/2001 | US20010017423 Semiconductor device having sidewall spacers manifesting a self-aligned contact hole |
| 08/30/2001 | US20010017422 Semiconductor device with copper-based wiring lines and method of fabricating the same |
| 08/30/2001 | US20010017421 Semiconductor element with metal layer |
| 08/30/2001 | US20010017419 Method for forming a bit line for a semiconductor device |
| 08/30/2001 | US20010017418 Semiconductor device |
| 08/30/2001 | US20010017417 Semiconductor device with a condductive metal layer engaging not less than fifty percent of a source\drain region |
| 08/30/2001 | US20010017415 Semiconductor device and manufacturing method thereof |
| 08/30/2001 | US20010017414 Flip chip with integrated mask and underfill |
| 08/30/2001 | US20010017413 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| 08/30/2001 | US20010017412 Semiconductor device |