| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/06/2001 | US20010019891 Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst |
| 09/06/2001 | US20010019890 Process for manufacturing semiconductor device |
| 09/06/2001 | US20010019882 Method of making electrical interconnection for attachment to a substrate |
| 09/06/2001 | US20010019880 Method of producing alignment marks |
| 09/06/2001 | US20010019876 Methods of forming materials between conductive electrical components, and insulating materials |
| 09/06/2001 | US20010019870 Semiconductor processing methods of forming integrated circuitry, forming conductive lines, forming a conductive grid, forming a conductive network, forming an electrical interconnection to a node location forming an electrical interconnection with a transistor source/drain region, and integrated circuitry |
| 09/06/2001 | US20010019867 Non-volatile semiconductor memory and fabricating method therefor |
| 09/06/2001 | US20010019865 Metallization outside protective overcoat for improved capacitors and inductors |
| 09/06/2001 | US20010019857 Semiconductor device and process for producing the same |
| 09/06/2001 | US20010019856 Semiconductor device and method for manufacturing the same |
| 09/06/2001 | US20010019855 Method for manufacturing integrated circuits and semiconductor wafer which has integrated circuits |
| 09/06/2001 | US20010019854 Low-pin-count chip package and manufacturing method thereof |
| 09/06/2001 | US20010019853 Method for producing a semiconductor component with a silicon carrier substrate |
| 09/06/2001 | US20010019852 Semiconductor device, method of making the same, circuit board, flexible substrate, and method of making substrate |
| 09/06/2001 | US20010019847 Method of forming thin copper film |
| 09/06/2001 | US20010019755 Surface trace electrical feedthru |
| 09/06/2001 | US20010019499 Semiconductor integrated circuit device |
| 09/06/2001 | US20010019474 Electric circuit |
| 09/06/2001 | US20010019473 Mounting structure for mounting power elements to heat dissipation member |
| 09/06/2001 | US20010019181 Structure of heat slug-equipped packages and the packaging method of the same |
| 09/06/2001 | US20010019180 Semiconductor integrated circuit device and process for manufacturing the same |
| 09/06/2001 | US20010019179 Connecting method of semiconductor element and semiconductor device |
| 09/06/2001 | US20010019178 Method of interconnecting electronic components using a plurality of conductive studs |
| 09/06/2001 | US20010019173 Semiconductor device and method of manufacturing the same |
| 09/06/2001 | US20010019172 Lead frame, circuit board with lead frame, and method for producing the lead frame |
| 09/06/2001 | US20010019171 Package for semiconductor chip |
| 09/06/2001 | US20010019169 Electronic device with double-wire bonding, manufacturing method thereof, and method for checking intactness of bonding wires of this electronic device |
| 09/06/2001 | US20010019167 Fusible link configuration in integrated circuits |
| 09/06/2001 | US20010019166 Semiconductor devices |
| 09/06/2001 | US20010019164 Method of reducing defects in anti-reflective coatings and semiconductor structures fabricated thereby |
| 09/06/2001 | US20010019162 Stacked semiconductor integrated circuit device and manufacturing method thereof |
| 09/06/2001 | US20010019159 Local interconnect structure for integrated circuit devices, source structure for the same, and method for fabricating the same |
| 09/06/2001 | US20010019156 Semiconductor device and fabrication method thereof |
| 09/06/2001 | US20010019145 Semiconductor memory device and method of manufacturing the same |
| 09/06/2001 | US20010019129 Contact structure of wiring and a method for manufacturing the same |
| 09/06/2001 | US20010019128 Semiconductor device, display device, and method for producing a semiconductor device |
| 09/06/2001 | US20010019124 Semiconductor device measuring socket capable of adjusting contact positions, and semiconductor device manufacturing method using the same |
| 09/06/2001 | US20010018988 Apparatus and method for reducing propagation delay in a conductor |
| 09/06/2001 | US20010018987 Interconnect structure |
| 09/06/2001 | US20010018986 Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound |
| 09/06/2001 | US20010018983 Multilayer integrated substrate and manufacturing method for multilayer ceramic element |
| 09/06/2001 | US20010018967 Heat pipe type cooler |
| 09/06/2001 | US20010018800 Method for forming interconnects |
| 09/06/2001 | US20010018799 Method of forming a chip carrier by joining a laminate layer and stiffener |
| 09/06/2001 | US20010018797 Low temperature co-fired ceramic with improved registration |
| 09/06/2001 | DE10007414A1 Process for through-plating a substrate comprises forming a through-hole in a metal plate in orientation with the through-hole of a ceramic plate, applying a solder paste to one side of the substrate, and passing through an oven |
| 09/06/2001 | DE10007209A1 Halbleiter-Leistungsbauelement mit Schmelzsicherung Semiconductor power device with fuse |
| 09/06/2001 | DE10006968A1 Process for removing zinc-chromium oxide coatings used in the production of semiconductors comprises directing a laser beam onto regions of a surface covered with the coating |
| 09/06/2001 | DE10006951A1 Production of integrated components comprises tensioning strip in frame, applying adhesive to join wafer and strip, welding connecting wires, filling bonding window |
| 09/06/2001 | DE10006942A1 Production of a system carrier used for electronic components comprises providing the surface of a carrier plate with a grid-like recesses on defined sites by punching and galvanically refining |
| 09/05/2001 | EP1130950A2 Wiring board |
| 09/05/2001 | EP1130744A2 Mounting structure for mounting power elements to heat dissipation member |
| 09/05/2001 | EP1130654A1 Integrated device including a metal- insulator-metal capacitor |
| 09/05/2001 | EP1130646A1 Chip-mounted enclosure |
| 09/05/2001 | EP1130645A2 Semiconductor chip with a thermal stress relief layer on the electrodes |
| 09/05/2001 | EP1130644A2 Package and method of manufacturing the same |
| 09/05/2001 | EP1130643A2 Assembly of power semiconductors with a compensation layer facing the heatsink |
| 09/05/2001 | EP1130642A1 High frequency module |
| 09/05/2001 | EP1130641A1 Molded integrated circuit package |
| 09/05/2001 | EP1130639A1 Semiconductor device and manufacture thereof |
| 09/05/2001 | EP1130625A2 Method of sputter depositing copper films |
| 09/05/2001 | EP1130041A1 Epoxy resin composition and semiconductor device |
| 09/05/2001 | EP1130003A1 Glass ceramics composition and electronic parts and multilayered lc multiple component using the same |
| 09/05/2001 | EP1129485A1 Electronic component and use of a protective structure contained therein |
| 09/05/2001 | EP1129480A1 Semiconductor copper bond pad surface protection |
| 09/05/2001 | EP1129479A1 System for assembling substrates to bonding zones provided with cavities |
| 09/05/2001 | EP1129477A1 Salicide process for mosfet integrated circuit |
| 09/05/2001 | EP1129050A1 Paste for screenprinting electric structures onto carrier substrates |
| 09/05/2001 | EP1129048A1 Composite plate and method for producing and using such a composite plate |
| 09/05/2001 | EP0852897B1 Method for surface mounting a heatsink to a printed circuit board |
| 09/05/2001 | EP0685112B1 Repair line structure for thin film electronic devices |
| 09/05/2001 | EP0621981B1 Electronic package having lead frame with improved adhesion |
| 09/05/2001 | CN2446662Y Efficient radiator |
| 09/05/2001 | CN2446661Y 散热器组合 Radiator combination |
| 09/05/2001 | CN2446660Y Improved power assembly support structure |
| 09/05/2001 | CN1311900A Device for electronic packaging, pin jig fixture |
| 09/05/2001 | CN1311899A Catacitive mounting arrangement for securing an integrated circuit package to a heat sink |
| 09/05/2001 | CN1311546A Connection mechanism used for zero insertion force electric connector |
| 09/05/2001 | CN1311530A Mixed medium structure used for improving stability of rear prodn. line structure |
| 09/05/2001 | CN1311528A Semiconductor device and its mfg. method, circuit plate and electronic device |
| 09/05/2001 | CN1311526A Method for mfg. conductive seat used for electric connection and formed conductive seat therefor |
| 09/04/2001 | US6285865 System and method for on-chip filter tuning |
| 09/04/2001 | US6285707 Temperature compensation for communications cards |
| 09/04/2001 | US6285562 Method of contacting a chip |
| 09/04/2001 | US6285561 Data carrier module device having integrated circuit and transmission coil connection contacts covered by a common protective cap |
| 09/04/2001 | US6285560 Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified |
| 09/04/2001 | US6285559 Multichip module |
| 09/04/2001 | US6285554 Method and an arrangement for the electrical contact of components |
| 09/04/2001 | US6285553 Mounting structure for an LSI |
| 09/04/2001 | US6285550 Sub-cooled processor and companion voltage regulator |
| 09/04/2001 | US6285549 Power package lead frame |
| 09/04/2001 | US6285540 Semiconductor device having a fuse |
| 09/04/2001 | US6285269 High-frequency semiconductor device having microwave transmission line being formed by a gate electrode source electrode and a dielectric layer in between |
| 09/04/2001 | US6285238 Electrically programmable fuse |
| 09/04/2001 | US6285237 Device and method for limiting the extent to which circuits in integrated circuit dice electrically load bond pads and other circuit nodes in the dice |
| 09/04/2001 | US6285208 Activation speed of signal wiring line in semiconductor integrated circuit |
| 09/04/2001 | US6285087 Resin-shield type semiconductor device |
| 09/04/2001 | US6285086 Semiconductor device and substrate for semiconductor device |
| 09/04/2001 | US6285085 Semiconductor device, method of fabricating the same and structure for mounting the same |
| 09/04/2001 | US6285084 Semiconductor device |